SG11201406961PA - Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface - Google Patents
Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surfaceInfo
- Publication number
- SG11201406961PA SG11201406961PA SG11201406961PA SG11201406961PA SG11201406961PA SG 11201406961P A SG11201406961P A SG 11201406961PA SG 11201406961P A SG11201406961P A SG 11201406961PA SG 11201406961P A SG11201406961P A SG 11201406961PA SG 11201406961P A SG11201406961P A SG 11201406961PA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate surface
- cleaning agent
- semiconductor substrate
- processing
- semiconductor substrates
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 239000000758 substrate Substances 0.000 title 2
- 239000012459 cleaning agent Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/36—Organic compounds containing phosphorus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
- H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
-
- C11D2111/22—
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012103921 | 2012-04-27 | ||
| PCT/JP2013/062464 WO2013162020A1 (en) | 2012-04-27 | 2013-04-26 | Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201406961PA true SG11201406961PA (en) | 2014-11-27 |
Family
ID=49483316
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201406961PA SG11201406961PA (en) | 2012-04-27 | 2013-04-26 | Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface |
| SG10201608964TA SG10201608964TA (en) | 2012-04-27 | 2013-04-26 | Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201608964TA SG10201608964TA (en) | 2012-04-27 | 2013-04-26 | Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9803161B2 (en) |
| EP (1) | EP2843689A4 (en) |
| JP (1) | JP6128118B2 (en) |
| KR (1) | KR101966635B1 (en) |
| CN (1) | CN104254906B (en) |
| SG (2) | SG11201406961PA (en) |
| TW (1) | TWI589691B (en) |
| WO (1) | WO2013162020A1 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015189829A (en) * | 2014-03-27 | 2015-11-02 | 株式会社フジミインコーポレーテッド | polishing composition |
| JP6436638B2 (en) * | 2014-03-27 | 2018-12-12 | 株式会社フジミインコーポレーテッド | Polishing composition |
| JP6373029B2 (en) * | 2014-03-27 | 2018-08-15 | 株式会社フジミインコーポレーテッド | Polishing composition |
| JP6343160B2 (en) * | 2014-03-28 | 2018-06-13 | 株式会社フジミインコーポレーテッド | Polishing composition |
| KR102360224B1 (en) * | 2015-02-16 | 2022-03-14 | 삼성디스플레이 주식회사 | Cleaning composition |
| WO2016170942A1 (en) | 2015-04-22 | 2016-10-27 | Jsr株式会社 | Treatment composition for chemical mechanical polishing, chemical mechanical polishing method, and cleaning method |
| KR101654900B1 (en) * | 2016-02-04 | 2016-09-07 | 주식회사 한국루베 | Decontaminant composition |
| KR102341136B1 (en) * | 2016-07-26 | 2021-12-21 | 가부시키가이샤 후지미인코퍼레이티드 | Surface treatment composition and surface treatment method using the same |
| CN106283092B (en) * | 2016-08-05 | 2018-06-19 | 宁波金特信钢铁科技有限公司 | A kind of preparation method of no amino fluoride salt electric substrate cleaning combination |
| JP6791680B2 (en) | 2016-08-09 | 2020-11-25 | 株式会社フジミインコーポレーテッド | Surface treatment composition and cleaning method using it |
| JP6697362B2 (en) * | 2016-09-23 | 2020-05-20 | 株式会社フジミインコーポレーテッド | Surface treatment composition, surface treatment method using the same, and method for manufacturing semiconductor substrate |
| CN110178204B (en) * | 2017-01-17 | 2022-11-04 | 株式会社大赛璐 | Cleaning agent for semiconductor substrate |
| WO2018163617A1 (en) * | 2017-03-08 | 2018-09-13 | 株式会社フジミインコーポレーテッド | Surface treatment composition, production method therefor, surface treatment method, and production method for semiconductor substrate |
| JP7156266B2 (en) | 2017-03-17 | 2022-10-19 | 三菱ケミカル株式会社 | Cleaning composition for semiconductor device substrate, method for cleaning semiconductor device substrate, method for producing semiconductor device substrate, and semiconductor device substrate |
| JP6849564B2 (en) | 2017-09-19 | 2021-03-24 | 株式会社フジミインコーポレーテッド | Surface treatment composition and surface treatment method using the same |
| JP7028592B2 (en) | 2017-09-19 | 2022-03-02 | 株式会社フジミインコーポレーテッド | A surface treatment composition, a method for producing a surface treatment composition, a surface treatment method, and a method for producing a semiconductor substrate. |
| US11060051B2 (en) | 2018-10-12 | 2021-07-13 | Fujimi Incorporated | Composition for rinsing or cleaning a surface with ceria particles adhered |
| CN110394694A (en) * | 2019-07-26 | 2019-11-01 | 浙江天马轴承集团有限公司 | A kind of plasma point discharge flash removed processing method |
| JP7220809B2 (en) * | 2019-12-26 | 2023-02-10 | 富士フイルム株式会社 | Cleaning liquid, cleaning method |
| JPWO2021210308A1 (en) * | 2020-04-16 | 2021-10-21 | ||
| CN113862088B (en) * | 2021-10-27 | 2023-11-10 | 福建省佑达环保材料有限公司 | Mask cleaning agent for OLED |
| WO2023182142A1 (en) * | 2022-03-25 | 2023-09-28 | 富士フイルム株式会社 | Composition, semiconductor-element manufacturing method, and semiconductor-substrate washing method |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3219020B2 (en) | 1996-06-05 | 2001-10-15 | 和光純薬工業株式会社 | Cleaning agent |
| US6410494B2 (en) | 1996-06-05 | 2002-06-25 | Wako Pure Chemical Industries, Ltd. | Cleaning agent |
| TW416987B (en) | 1996-06-05 | 2001-01-01 | Wako Pure Chem Ind Ltd | A composition for cleaning the semiconductor substrate surface |
| JPH1140526A (en) * | 1997-07-22 | 1999-02-12 | Hitachi Ltd | Wiring formation method and manufacture of semiconductor device |
| US6395693B1 (en) | 1999-09-27 | 2002-05-28 | Cabot Microelectronics Corporation | Cleaning solution for semiconductor surfaces following chemical-mechanical polishing |
| JP4821082B2 (en) | 2000-03-21 | 2011-11-24 | 和光純薬工業株式会社 | Semiconductor substrate cleaning agent and cleaning method |
| JP2002299300A (en) * | 2001-03-30 | 2002-10-11 | Kaijo Corp | Substrate treatment method |
| JP2005101479A (en) * | 2002-11-08 | 2005-04-14 | Sumitomo Chemical Co Ltd | Cleaning liquid for semiconductor substrate |
| US7700532B2 (en) | 2002-11-08 | 2010-04-20 | Wako Pure Chemical Industries, Ltd. | Cleaning composition and method of cleaning therewith |
| TWI362415B (en) * | 2003-10-27 | 2012-04-21 | Wako Pure Chem Ind Ltd | Novel detergent and method for cleaning |
| KR100795364B1 (en) * | 2004-02-10 | 2008-01-17 | 삼성전자주식회사 | Composition for cleaning a semiconductor substrate, method of cleaning and method for manufacturing a conductive structure using the same |
| SG150509A1 (en) * | 2004-03-01 | 2009-03-30 | Mallinckrodt Baker Inc | Nanoelectronic and microelectronic cleaning compositions |
| WO2006129538A1 (en) * | 2005-06-01 | 2006-12-07 | Nissan Chemical Industries, Ltd. | Semiconductor wafer cleaning composition containing phosphonic acid and method of cleaning |
| JP2008181955A (en) * | 2007-01-23 | 2008-08-07 | Fujifilm Corp | Polishing liquid for metal and polishing method using the same |
| JP5121273B2 (en) * | 2007-03-29 | 2013-01-16 | 富士フイルム株式会社 | Polishing liquid for metal and polishing method |
| JP2009194049A (en) * | 2008-02-13 | 2009-08-27 | Sanyo Chem Ind Ltd | Detergent for copper wire semiconductor |
| JP2009239206A (en) * | 2008-03-28 | 2009-10-15 | Sanyo Chem Ind Ltd | Cleaning agent for copper wiring semiconductor |
| JP2010258014A (en) | 2009-04-21 | 2010-11-11 | Jsr Corp | Composition for cleaning, and cleaning method |
| US8148310B2 (en) | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
| JP5858597B2 (en) | 2010-01-29 | 2016-02-10 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | Cleaning agent for tungsten wiring semiconductor |
| US9045717B2 (en) * | 2010-01-29 | 2015-06-02 | Advanced Technology Materials, Inc. | Cleaning agent for semiconductor provided with metal wiring |
| JP5508158B2 (en) * | 2010-06-22 | 2014-05-28 | 富士フイルム株式会社 | Cleaning composition, cleaning method, and manufacturing method of semiconductor device |
-
2013
- 2013-04-26 US US14/397,364 patent/US9803161B2/en active Active
- 2013-04-26 SG SG11201406961PA patent/SG11201406961PA/en unknown
- 2013-04-26 KR KR1020147029843A patent/KR101966635B1/en active IP Right Grant
- 2013-04-26 TW TW102114989A patent/TWI589691B/en active
- 2013-04-26 WO PCT/JP2013/062464 patent/WO2013162020A1/en active Application Filing
- 2013-04-26 EP EP20130780549 patent/EP2843689A4/en not_active Withdrawn
- 2013-04-26 CN CN201380022014.7A patent/CN104254906B/en active Active
- 2013-04-26 SG SG10201608964TA patent/SG10201608964TA/en unknown
- 2013-04-26 JP JP2014512722A patent/JP6128118B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| SG10201608964TA (en) | 2016-12-29 |
| TW201402806A (en) | 2014-01-16 |
| CN104254906B (en) | 2017-07-21 |
| KR20150003217A (en) | 2015-01-08 |
| KR101966635B1 (en) | 2019-08-27 |
| US20150140820A1 (en) | 2015-05-21 |
| EP2843689A4 (en) | 2015-05-13 |
| TWI589691B (en) | 2017-07-01 |
| US9803161B2 (en) | 2017-10-31 |
| EP2843689A1 (en) | 2015-03-04 |
| JP6128118B2 (en) | 2017-05-17 |
| CN104254906A (en) | 2014-12-31 |
| WO2013162020A1 (en) | 2013-10-31 |
| JPWO2013162020A1 (en) | 2015-12-24 |
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