CN103227127A - 用于丝网印刷的短热力曲线炉 - Google Patents

用于丝网印刷的短热力曲线炉 Download PDF

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Publication number
CN103227127A
CN103227127A CN2013101388946A CN201310138894A CN103227127A CN 103227127 A CN103227127 A CN 103227127A CN 2013101388946 A CN2013101388946 A CN 2013101388946A CN 201310138894 A CN201310138894 A CN 201310138894A CN 103227127 A CN103227127 A CN 103227127A
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CN
China
Prior art keywords
substrate
conveying device
gas
screen printing
equipment
Prior art date
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Pending
Application number
CN2013101388946A
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English (en)
Chinese (zh)
Inventor
A·巴希尼
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Applied Materials Italia SRL
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Applied Materials Baccini SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ITUD20080135 external-priority patent/ITUD20080135A1/it
Priority claimed from ITUD20080154 external-priority patent/ITUD20080154A1/it
Application filed by Applied Materials Baccini SpA filed Critical Applied Materials Baccini SpA
Publication of CN103227127A publication Critical patent/CN103227127A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Drying Of Solid Materials (AREA)
  • Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
  • Screen Printers (AREA)
  • Electrodes Of Semiconductors (AREA)
CN2013101388946A 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉 Pending CN103227127A (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
IT2008A000135 2008-06-11
ITUD20080135 ITUD20080135A1 (it) 2008-06-11 2008-06-11 Forno a basso profilo termico per stampa serigrafica
IT2008A000154 2008-06-27
ITUD20080154 ITUD20080154A1 (it) 2008-06-27 2008-06-27 Forno a basso profilo termico per stampa serigrafica
US12/240,955 US20090308860A1 (en) 2008-06-11 2008-09-29 Short thermal profile oven useful for screen printing
US12/240,955 2008-09-29
US12/273,442 US20090311439A1 (en) 2008-06-11 2008-11-18 Short Thermal Profile Oven Useful For Screen Printing
US12/273,442 2008-11-18

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2009801225813A Division CN102057462B (zh) 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉

Publications (1)

Publication Number Publication Date
CN103227127A true CN103227127A (zh) 2013-07-31

Family

ID=41151966

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2013101388946A Pending CN103227127A (zh) 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉
CN2009801225813A Expired - Fee Related CN102057462B (zh) 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2009801225813A Expired - Fee Related CN102057462B (zh) 2008-06-11 2009-05-29 用于丝网印刷的短热力曲线炉

Country Status (7)

Country Link
US (2) US20090308860A1 (enExample)
EP (1) EP2301064B1 (enExample)
JP (1) JP2011526734A (enExample)
KR (1) KR20110030564A (enExample)
CN (2) CN103227127A (enExample)
TW (1) TWI479590B (enExample)
WO (1) WO2009150070A1 (enExample)

Cited By (3)

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CN104441956A (zh) * 2014-12-10 2015-03-25 苏州互强工业设备有限公司 一种丝印烘干线
CN108878334A (zh) * 2017-05-16 2018-11-23 先进装配系统新加坡有限公司 工件转移和印刷
CN111295767A (zh) * 2017-10-27 2020-06-16 应用材料意大利有限公司 被配置为确定沉积布置的状态的设备、用于制造太阳能电池的系统、以及用于确定沉积布置的状态的方法

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WO2007066808A1 (ja) * 2005-12-06 2007-06-14 Musashi Engineering, Inc. 加工装置および加工方法
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US10442226B2 (en) 2008-06-13 2019-10-15 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
WO2011110231A1 (en) * 2010-03-12 2011-09-15 Q-Cells Se Method and in-line production system for the production of solar cells
US20120060758A1 (en) * 2011-03-24 2012-03-15 Primestar Solar, Inc. Dynamic system for variable heating or cooling of linearly conveyed substrates
US9589817B2 (en) * 2011-04-15 2017-03-07 Illinois Tool Works Inc. Dryer
KR101928890B1 (ko) * 2012-11-30 2019-03-12 카티바, 인크. 산업용 프린팅 시스템의 유지 방법
US10468279B2 (en) 2013-12-26 2019-11-05 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
WO2015112454A1 (en) 2014-01-21 2015-07-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
WO2015168036A1 (en) 2014-04-30 2015-11-05 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
US10676847B2 (en) 2014-11-07 2020-06-09 Illinois Tool Works Inc. Discharge nozzle plate for center-to-ends fiber oxidation oven
US10458710B2 (en) 2014-11-07 2019-10-29 Illinois Tool Works Inc. Supply plenum for center-to-ends fiber oxidation oven
CN104527218B (zh) * 2014-12-24 2016-01-13 庄统壹 一种网版印刷机及利用该网版印刷机印刷的工艺方法
CN108604619A (zh) * 2016-02-22 2018-09-28 应用材料意大利有限公司 用于处理太阳能电池基板的设备、用于处理太阳能电池基板的系统和用于处理太阳能电池基板的方法
CN110534611A (zh) * 2018-05-25 2019-12-03 米亚索乐装备集成（福建）有限公司 一种用于片状电池的加热设备
DE102018210558A1 (de) * 2018-06-28 2019-02-28 Heidelberger Druckmaschinen Ag Druckvorrichtung mit einem Planarmotorsystem
KR102088778B1 (ko) * 2018-08-07 2020-03-13 김영택 수용성 잉크를 이용한 인쇄기의 열 건조장치
PT3725523T (pt) 2019-04-18 2024-05-02 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
HUE068309T2 (hu) 2019-04-18 2024-12-28 Exentis Knowledge Gmbh Eljárás háromdimenziós szitanyomó munkadarabok elõállítására
ES2978787T3 (es) * 2019-04-18 2024-09-20 Exentis Knowledge Gmbh Dispositivo y procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales
ES2973939T3 (es) * 2019-04-18 2024-06-25 Exentis Knowledge Gmbh Dispositivo y procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales
CN111186211B (zh) * 2020-02-04 2021-06-04 北部湾大学 一种用于陶瓷花纸印刷机的油墨干燥装置
CN114801452A (zh) * 2021-01-18 2022-07-29 博泽精密科技(苏州)有限公司 一种印刷机械自动上料机构
CN215305176U (zh) * 2021-06-15 2021-12-28 江门市新会恒隆家居创新用品有限公司 多士炉

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CN108878334B (zh) * 2017-05-16 2023-05-09 先进装配系统新加坡有限公司 工件转移和印刷
CN111295767A (zh) * 2017-10-27 2020-06-16 应用材料意大利有限公司 被配置为确定沉积布置的状态的设备、用于制造太阳能电池的系统、以及用于确定沉积布置的状态的方法

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US20090311439A1 (en) 2009-12-17
EP2301064A1 (en) 2011-03-30
KR20110030564A (ko) 2011-03-23
CN102057462B (zh) 2013-05-15
TW201009990A (en) 2010-03-01
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US20090308860A1 (en) 2009-12-17

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