IT1392992B1 - Procedimento e apparecchiatura per la stampa serigrafica di uno schema a strato multiplo - Google Patents
Procedimento e apparecchiatura per la stampa serigrafica di uno schema a strato multiploInfo
- Publication number
- IT1392992B1 IT1392992B1 ITUD2009A000044A ITUD20090044A IT1392992B1 IT 1392992 B1 IT1392992 B1 IT 1392992B1 IT UD2009A000044 A ITUD2009A000044 A IT UD2009A000044A IT UD20090044 A ITUD20090044 A IT UD20090044A IT 1392992 B1 IT1392992 B1 IT 1392992B1
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- equipment
- multiple layer
- layer diagram
- serigraphic printing
- Prior art date
Links
- 238000010586 diagram Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F33/00—Indicating, counting, warning, control or safety devices
- B41F33/0081—Devices for scanning register marks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Methods (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000044A IT1392992B1 (it) | 2009-02-23 | 2009-02-23 | Procedimento e apparecchiatura per la stampa serigrafica di uno schema a strato multiplo |
CN2009801575982A CN102325654A (zh) | 2009-02-23 | 2009-05-25 | 多层图案的丝网印刷方法及设备 |
US13/202,960 US20120048132A1 (en) | 2009-02-23 | 2009-05-25 | Method and apparatus for screen printing a multiple layer pattern |
PCT/EP2009/056324 WO2010094344A1 (en) | 2009-02-23 | 2009-05-25 | Method and apparatus for screen printing a multiple layer pattern |
KR1020117022341A KR20110126721A (ko) | 2009-02-23 | 2009-05-25 | 다수의 층 패턴을 스크린 인쇄하기 위한 방법 및 장치 |
EP09779535A EP2398647A1 (en) | 2009-02-23 | 2009-05-25 | Method and apparatus for screen printing a multiple layer pattern |
JP2011550428A JP2012518555A (ja) | 2009-02-23 | 2009-05-25 | 多層パターンをスクリーン印刷するための方法及び装置 |
TW099105051A TWI462670B (zh) | 2009-02-23 | 2010-02-22 | 多層圖案之網印方法及設備 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000044A IT1392992B1 (it) | 2009-02-23 | 2009-02-23 | Procedimento e apparecchiatura per la stampa serigrafica di uno schema a strato multiplo |
Publications (2)
Publication Number | Publication Date |
---|---|
ITUD20090044A1 ITUD20090044A1 (it) | 2010-08-24 |
IT1392992B1 true IT1392992B1 (it) | 2012-04-02 |
Family
ID=41258419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUD2009A000044A IT1392992B1 (it) | 2009-02-23 | 2009-02-23 | Procedimento e apparecchiatura per la stampa serigrafica di uno schema a strato multiplo |
Country Status (8)
Country | Link |
---|---|
US (1) | US20120048132A1 (it) |
EP (1) | EP2398647A1 (it) |
JP (1) | JP2012518555A (it) |
KR (1) | KR20110126721A (it) |
CN (1) | CN102325654A (it) |
IT (1) | IT1392992B1 (it) |
TW (1) | TWI462670B (it) |
WO (1) | WO2010094344A1 (it) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090308860A1 (en) * | 2008-06-11 | 2009-12-17 | Applied Materials, Inc. | Short thermal profile oven useful for screen printing |
FR2932717B1 (fr) * | 2008-06-24 | 2011-03-25 | Dubuit Mach | Machine a imprimer. |
WO2010068331A1 (en) * | 2008-12-10 | 2010-06-17 | Applied Materials, Inc. | Enhanced vision system for screen printing pattern alignment |
JP4939583B2 (ja) * | 2009-09-09 | 2012-05-30 | 日東電工株式会社 | 回路付きサスペンション基板集合体シートおよびその製造方法 |
TWI431787B (zh) * | 2010-11-30 | 2014-03-21 | Inventec Solar Energy Corp | 印製識別碼於太陽能電池基板的方法及其應用 |
WO2012103188A2 (en) * | 2011-01-25 | 2012-08-02 | E. I. Du Pont De Nemours And Company | A method for calculating an offset value for aligned deposition of a second pattern onto a first pattern |
TWI456775B (zh) * | 2012-02-03 | 2014-10-11 | Inventec Solar Energy Corp | 圖案化基板之定位方法與使用其之太陽能電池之堆疊膜層的製造方法 |
EP2882593A1 (en) * | 2012-08-06 | 2015-06-17 | Tetra Laval Holdings & Finance S.A. | Improved processing of webs |
ITUD20120149A1 (it) * | 2012-08-31 | 2014-03-01 | Applied Materials Italia Srl | Metodo ed apparato di stampa di uno schema su un substrato |
CN102825933B (zh) * | 2012-09-13 | 2014-12-24 | 英利能源(中国)有限公司 | 太阳能电池片的丝网印刷方法、太阳能电池片及其制备方法 |
CN103855239B (zh) * | 2012-11-30 | 2016-12-21 | 茂迪股份有限公司 | 太阳能电池的正面电极及其制造方法 |
DE102013205731A1 (de) * | 2013-03-28 | 2014-10-02 | JRT Photovoltaics GmbH & Co. KG | Siebdruckanlage zum Bedrucken von flächigen Substraten, insbesondere Solarzellen und Verfahren zum Bedrucken von Substraten |
DE102013103837A1 (de) | 2013-04-16 | 2014-10-16 | Teamtechnik Maschinen Und Anlagen Gmbh | Aufbringen von Leitkleber auf Solarzellen |
CN103839861B (zh) * | 2014-03-18 | 2016-11-16 | 常州天合光能有限公司 | 用于太阳能电池表面细栅的多次套印对准方法 |
WO2016180446A1 (en) * | 2015-05-08 | 2016-11-17 | Applied Materials Italia S.R.L. | Method for screen printing on a substrate for the production of a solar cell, screen used in screen printing on a substrate for the production of a solar cell, and apparatus for screen printing on a substrate for the production of a solar cell |
DE102015110975B4 (de) * | 2015-07-07 | 2019-05-09 | Hanwha Q Cells Gmbh | Kontaktierungsstruktur und ein Verfahren zur Feststellung eines Versatzes zwischen Metallisierungsstrukturen auf Photovoltaikmodulen |
JP6390978B2 (ja) * | 2016-02-05 | 2018-09-19 | パナソニックIpマネジメント株式会社 | 半導体装置の製造装置 |
CN106079944B (zh) * | 2016-06-30 | 2019-01-22 | 京东方科技集团股份有限公司 | 一种网版印刷标记的方法、显示面板、显示装置 |
CN107718878B (zh) * | 2016-08-10 | 2021-06-15 | 策塔克有限公司 | 用于丝网印刷机和模板印刷机的测量装置和方法 |
EP3335249A1 (en) * | 2016-10-28 | 2018-06-20 | Applied Materials Italia S.R.L. | Apparatus for processing of a substrate used in the manufacture of a solar cell, and method for processing of a substrate used in the manufacture of a solar cell |
DE102017201715B4 (de) | 2017-02-02 | 2022-08-18 | Ekra Automatisierungssysteme Gmbh | Druckvorrichtung |
US10115687B2 (en) * | 2017-02-03 | 2018-10-30 | Applied Materials, Inc. | Method of pattern placement correction |
CN110710001A (zh) * | 2017-05-30 | 2020-01-17 | 应用材料意大利有限公司 | 用于制造太阳能电池的基板上的丝网印刷的设备、丝网装置、系统和方法 |
EP3725524A1 (de) * | 2019-04-18 | 2020-10-21 | Exentis Knowledge GmbH | Vorrichtung und verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken |
CN110379884B (zh) * | 2019-06-05 | 2021-07-20 | 晶澳太阳能有限公司 | 一种电池表面激光定位点及perc电池的制备方法 |
CN115384176A (zh) * | 2021-05-25 | 2022-11-25 | 庆鼎精密电子(淮安)有限公司 | 焊料印刷设备及焊料印刷方法 |
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GB2088283B (en) * | 1980-11-05 | 1984-08-08 | Secr Defence | Alignment drive |
US4981074A (en) * | 1988-06-01 | 1991-01-01 | Hitachi Techno Engineering Co., Ltd. | Method and apparatus for screen printing |
JPH0266994A (ja) * | 1988-08-31 | 1990-03-07 | Nec Corp | 厚膜印刷基板 |
JPH02246314A (ja) * | 1989-03-20 | 1990-10-02 | Fujitsu Ltd | パターン作成方法 |
JPH05229097A (ja) * | 1992-02-22 | 1993-09-07 | Tdk Corp | スクリーン印刷法 |
US5403754A (en) * | 1992-09-30 | 1995-04-04 | Texas Instruments Incorporated | Lithography method for direct alignment of integrated circuits multiple layers |
JP3229118B2 (ja) * | 1993-04-26 | 2001-11-12 | 三菱電機株式会社 | 積層型半導体装置のパターン形成方法 |
JP3310540B2 (ja) * | 1996-05-22 | 2002-08-05 | 松下電器産業株式会社 | スクリーン印刷方法とその装置 |
US5901646A (en) * | 1997-10-21 | 1999-05-11 | Preco Industries, Inc. | Screen printing machine having three axes screen registration with shiftable support vacuum table for web |
JPH11170481A (ja) * | 1997-12-10 | 1999-06-29 | Micro Tec Kk | スクリーン印刷機及びスクリーン印刷方法 |
GB2359515B (en) * | 2000-02-23 | 2003-12-03 | Kistech Ltd | Method of printing and printing machine |
JP2002231622A (ja) * | 2000-11-29 | 2002-08-16 | Nikon Corp | ステージ装置及び露光装置 |
JP2002225221A (ja) * | 2001-02-02 | 2002-08-14 | Matsushita Electric Ind Co Ltd | スクリーン印刷機及びスクリーン印刷方法 |
JP3504623B2 (ja) * | 2001-03-12 | 2004-03-08 | マイクロ・テック株式会社 | スクリーン印刷装置及びスクリーン製版セット方法 |
JP2003062972A (ja) * | 2001-08-23 | 2003-03-05 | Minoguruupu:Kk | 印刷位置決め装置及びその位置決め方法 |
JP3705202B2 (ja) * | 2001-12-25 | 2005-10-12 | 株式会社村田製作所 | 連続体シートの印刷方法および印刷装置 |
JP2004136569A (ja) * | 2002-10-18 | 2004-05-13 | Toko Inc | スクリーン印刷装置のアライメント方法 |
JP4121928B2 (ja) * | 2003-10-08 | 2008-07-23 | シャープ株式会社 | 太陽電池の製造方法 |
FR2886577B1 (fr) * | 2005-06-06 | 2008-12-26 | Mach Dubuit Soc Par Actions Si | Machine et dispositif d'impression par serigraphie |
JP4944407B2 (ja) * | 2005-08-01 | 2012-05-30 | 富士機械製造株式会社 | スクリーン・基板位置合わせ方法および装置 |
FR2899840B1 (fr) * | 2006-04-12 | 2008-07-04 | Mach Dubuit Soc Par Actions Si | Machine d'impression par serigraphie |
DE102007003224A1 (de) * | 2007-01-15 | 2008-07-17 | Thieme Gmbh & Co. Kg | Bearbeitungslinie für plattenartige Elemente, insbesondere Solarzellen, und Verfahren zum Bearbeiten von plattenartigen Elementen |
ITUD20070195A1 (it) * | 2007-10-24 | 2009-04-25 | Baccini S P A | Procedimento di produzione e controllo di piastre per elettronica e relativo apparato |
CN100572057C (zh) * | 2008-09-19 | 2009-12-23 | 深圳市网印巨星机电设备有限公司 | 用于丝网印刷机的自动对位方法和系统 |
FR2936975B1 (fr) * | 2008-10-13 | 2011-06-03 | Dubuit Mach | Machine d'impression par serigraphie et procede d'impression associe |
-
2009
- 2009-02-23 IT ITUD2009A000044A patent/IT1392992B1/it active
- 2009-05-25 US US13/202,960 patent/US20120048132A1/en not_active Abandoned
- 2009-05-25 KR KR1020117022341A patent/KR20110126721A/ko not_active Application Discontinuation
- 2009-05-25 CN CN2009801575982A patent/CN102325654A/zh active Pending
- 2009-05-25 JP JP2011550428A patent/JP2012518555A/ja active Pending
- 2009-05-25 EP EP09779535A patent/EP2398647A1/en not_active Withdrawn
- 2009-05-25 WO PCT/EP2009/056324 patent/WO2010094344A1/en active Application Filing
-
2010
- 2010-02-22 TW TW099105051A patent/TWI462670B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2398647A1 (en) | 2011-12-28 |
US20120048132A1 (en) | 2012-03-01 |
TW201041467A (en) | 2010-11-16 |
ITUD20090044A1 (it) | 2010-08-24 |
WO2010094344A1 (en) | 2010-08-26 |
JP2012518555A (ja) | 2012-08-16 |
TWI462670B (zh) | 2014-11-21 |
CN102325654A (zh) | 2012-01-18 |
KR20110126721A (ko) | 2011-11-23 |
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