KR20100019481A - 판상 제품의 전해 처리를 위한 장치 및 방법 - Google Patents

판상 제품의 전해 처리를 위한 장치 및 방법 Download PDF

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Publication number
KR20100019481A
KR20100019481A KR1020097025444A KR20097025444A KR20100019481A KR 20100019481 A KR20100019481 A KR 20100019481A KR 1020097025444 A KR1020097025444 A KR 1020097025444A KR 20097025444 A KR20097025444 A KR 20097025444A KR 20100019481 A KR20100019481 A KR 20100019481A
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KR
South Korea
Prior art keywords
product
treatment
flow
plate
flow device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097025444A
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English (en)
Korean (ko)
Inventor
라인하르트 슈나이더
헨리 쿤체
페르디난트 비에너
Original Assignee
아토테크더치랜드게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아토테크더치랜드게엠베하 filed Critical 아토테크더치랜드게엠베하
Publication of KR20100019481A publication Critical patent/KR20100019481A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Coating Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020097025444A 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법 Ceased KR20100019481A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007026633.4 2007-06-06
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020157013377A Division KR101641475B1 (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Publications (1)

Publication Number Publication Date
KR20100019481A true KR20100019481A (ko) 2010-02-18

Family

ID=39712035

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020097025444A Ceased KR20100019481A (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법
KR1020157013377A Expired - Fee Related KR101641475B1 (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020157013377A Expired - Fee Related KR101641475B1 (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Country Status (11)

Country Link
US (1) US8545687B2 (https=)
EP (1) EP2176450B9 (https=)
JP (2) JP2010530029A (https=)
KR (2) KR20100019481A (https=)
CN (1) CN101730760B (https=)
AT (1) ATE519872T1 (https=)
BR (1) BRPI0812259A2 (https=)
DE (1) DE102007026633B4 (https=)
PL (1) PL2176450T3 (https=)
TW (1) TWI433965B (https=)
WO (1) WO2008148578A1 (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8431175B2 (en) * 2007-06-05 2013-04-30 Nestec S.A. Method for preparing a beverage or food liquid and system using brewing centrifugal force
RU2474525C2 (ru) 2007-06-05 2013-02-10 Нестек С.А. Капсула и способ приготовления пищевой жидкости с помощью центрифугирования
CA2687894C (en) * 2007-06-05 2016-05-10 Nestec S.A. Capsule system, device and method for preparing a food liquid contained in a receptacle by centrifugation
ATE540880T1 (de) * 2007-06-05 2012-01-15 Nestec Sa Einwegkapsel zur herstellung eines flüssigen nahrungsmittels durch zentrifugierung
CN101677706B (zh) * 2007-06-05 2013-07-17 雀巢产品技术援助有限公司 使用煮泡离心力的用于制备饮料或液态食品的方法和系统
US8512784B2 (en) * 2008-09-02 2013-08-20 Nestec S.A. Method and device for controlled beverage production using centrifugal forces
EP2330953B1 (en) 2008-09-02 2015-06-03 Nestec S.A. Method for preparing a food liquid contained in a capsule by centrifugation and system adapted for such method
WO2010066736A1 (en) 2008-12-09 2010-06-17 Nestec S.A. Liquid food preparation system for preparing a liquid food by centrifugation
JP5375596B2 (ja) * 2009-02-19 2013-12-25 株式会社デンソー 噴流式めっき方法および装置
DK2592021T3 (en) * 2009-08-19 2015-04-27 Nestec Sa The capsule for preparing a coffee extract having a structure that facilitates perforation for injecting water
US8658232B2 (en) * 2009-08-28 2014-02-25 Nestec S.A. Capsule system for the preparation of beverages by centrifugation
CN104545474B (zh) 2009-08-28 2017-05-31 雀巢产品技术援助有限公司 通过离心法制备饮料的胶囊系统
DE102010033256A1 (de) 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung
JP5889799B2 (ja) * 2010-12-01 2016-03-22 マルイ鍍金工業株式会社 電解ケース
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
US20140083842A1 (en) * 2012-09-25 2014-03-27 Almex Pe Inc. Serial plating system
EP2746432A1 (en) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
ITMI20130466A1 (it) * 2013-03-27 2014-09-28 Qualital Servizi S R L Sistema di pretrattamento alla verniciatura dell'alluminio mediante una tecnica innovativa di ossidazione anodica.
EP2813601A1 (en) 2013-06-14 2014-12-17 ATOTECH Deutschland GmbH Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device
ES2772808T3 (es) * 2014-03-11 2020-07-08 Qualital Servizi S R L Instalación y procedimiento para el tratamiento de anodización de productos fabricados de aluminio o aleaciones del mismo
CN105063709B (zh) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 印刷电路板用电镀装置
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
CN109312487B (zh) * 2016-06-09 2021-02-26 杰富意钢铁株式会社 电镀钢板的制造方法以及其制造装置
EP3287550B1 (en) 2016-08-23 2019-02-13 ATOTECH Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
JP6995544B2 (ja) * 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
CN112899743B (zh) * 2021-01-19 2021-09-21 鑫巨(深圳)半导体科技有限公司 一种电镀装置及电镀方法
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN117964183B (zh) * 2024-04-02 2024-06-07 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) 一种苯胺类事故废水应急处置方法及一体化装置

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963588A (en) * 1975-04-21 1976-06-15 United States Steel Corporation Coalescent-jet apparatus and method for high current density preferential electroplating
US4043891A (en) * 1976-01-14 1977-08-23 Bell Telephone Laboratories, Incorporated Electrolytic cell with bipolar electrodes
JPS5836079B2 (ja) * 1980-12-02 1983-08-06 日鉱エンジニアリング株式会社 金属表面処理装置
JPS57210989A (en) 1981-02-10 1982-12-24 Hiroshige Sawa Electroplating method
CA1190514A (en) 1981-06-25 1985-07-16 George R. Scanlon High speed plating of flat planar workpieces
US4622917A (en) * 1982-09-27 1986-11-18 Etd Technology, Inc. Apparatus and method for electroless plating
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
JPS59181873U (ja) * 1983-05-21 1984-12-04 株式会社　中央製作所 板状被表面処理物のメツキ処理装置
DE3804070C3 (de) 1988-02-10 1994-02-24 Siemens Nixdorf Inf Syst Galvanisieranlage für Leiterplatten
JPH07113159B2 (ja) 1988-08-29 1995-12-06 日本電装株式会社 めっき装置
JPH0826480B2 (ja) * 1989-03-28 1996-03-13 日本エレクトロプレイテイング・エンジニヤース株式会社 メッキ装置及びメッキ金属の補給方法
DE4133561C2 (de) * 1991-10-10 1994-02-03 Reinhard Kissler Gmbh Verfahren und Vorrichtung zum Galvanisieren von Waren
DE4322378A1 (de) * 1993-07-06 1995-01-12 Hans Henig Verfahren und Einrichtung zur Oberflächenbehandlung vornehmlich plattenförmiger Werkstücke in horizontaler Betriebslage
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
JP3438387B2 (ja) 1995-03-16 2003-08-18 株式会社デンソー めっき装置およびめっき方法
JP3352352B2 (ja) 1997-03-31 2002-12-03 新光電気工業株式会社 めっき装置、めっき方法およびバンプの形成方法
DE19717512C3 (de) 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
US5865984A (en) * 1997-06-30 1999-02-02 International Business Machines Corporation Electrochemical etching apparatus and method for spirally etching a workpiece
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer
CA2320278C (en) 1998-02-12 2006-01-03 Acm Research, Inc. Plating apparatus and method
JPH11288893A (ja) * 1998-04-03 1999-10-19 Nec Corp 半導体製造装置及び半導体装置の製造方法
US6132586A (en) * 1998-06-11 2000-10-17 Integrated Process Equipment Corporation Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
US6610190B2 (en) * 2000-11-03 2003-08-26 Nutool, Inc. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
US6984302B2 (en) * 1998-12-30 2006-01-10 Intel Corporation Electroplating cell based upon rotational plating solution flow
JP4175528B2 (ja) * 1999-02-25 2008-11-05 株式会社ナウケミカル めっき装置
JP3352081B2 (ja) 2001-02-01 2002-12-03 株式会社アスカエンジニアリング プリント基板の銅めっき装置
US6989084B2 (en) * 2001-11-02 2006-01-24 Rockwell Scientific Licensing, Llc Semiconductor wafer plating cell assembly
JP2005520930A (ja) * 2001-12-24 2005-07-14 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ ウェハ表面を電気メッキするための装置および方法
JP4330380B2 (ja) * 2003-05-29 2009-09-16 株式会社荏原製作所 めっき装置及びめっき方法
CN101812711B (zh) * 2003-03-11 2011-11-16 株式会社荏原制作所 镀覆装置
US20040182715A1 (en) * 2003-03-20 2004-09-23 Jeffrey Bogart Process and apparatus for air bubble removal during electrochemical processing
JP4624738B2 (ja) 2003-08-21 2011-02-02 株式会社荏原製作所 めっき装置
EP1533400A1 (en) * 2003-11-20 2005-05-25 Process Automation International Limited A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus

Also Published As

Publication number Publication date
JP2013224492A (ja) 2013-10-31
ATE519872T1 (de) 2011-08-15
PL2176450T3 (pl) 2011-12-30
WO2008148578A1 (en) 2008-12-11
JP5597751B2 (ja) 2014-10-01
US20100176004A1 (en) 2010-07-15
EP2176450B9 (en) 2012-02-01
CN101730760A (zh) 2010-06-09
BRPI0812259A2 (pt) 2014-12-23
DE102007026633B4 (de) 2009-04-02
EP2176450A1 (en) 2010-04-21
CN101730760B (zh) 2011-09-28
US8545687B2 (en) 2013-10-01
KR101641475B1 (ko) 2016-07-20
TWI433965B (zh) 2014-04-11
KR20150071031A (ko) 2015-06-25
JP2010530029A (ja) 2010-09-02
EP2176450B1 (en) 2011-08-10
DE102007026633A1 (de) 2008-12-11
TW200918689A (en) 2009-05-01

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