JP2010530029A - 板状製品の電気的処理用装置及び方法 - Google Patents

板状製品の電気的処理用装置及び方法 Download PDF

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Publication number
JP2010530029A
JP2010530029A JP2010510699A JP2010510699A JP2010530029A JP 2010530029 A JP2010530029 A JP 2010530029A JP 2010510699 A JP2010510699 A JP 2010510699A JP 2010510699 A JP2010510699 A JP 2010510699A JP 2010530029 A JP2010530029 A JP 2010530029A
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product
treatment
flow
flow device
processing
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Pending
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JP2010510699A
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Japanese (ja)
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JP2010530029A5 (https=
Inventor
ラインハルト シュナイダー
ヘンリー クンツェ
フェルディナント ヴィーナー
Original Assignee
アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング
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Publication of JP2010530029A publication Critical patent/JP2010530029A/ja
Publication of JP2010530029A5 publication Critical patent/JP2010530029A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Coating Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2010510699A 2007-06-06 2008-06-03 板状製品の電気的処理用装置及び方法 Pending JP2010530029A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
PCT/EP2008/004616 WO2008148578A1 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013123570A Division JP5597751B2 (ja) 2007-06-06 2013-06-12 板状製品の電気分解処理用装置及び方法

Publications (2)

Publication Number Publication Date
JP2010530029A true JP2010530029A (ja) 2010-09-02
JP2010530029A5 JP2010530029A5 (https=) 2011-01-27

Family

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Family Applications (2)

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JP2010510699A Pending JP2010530029A (ja) 2007-06-06 2008-06-03 板状製品の電気的処理用装置及び方法
JP2013123570A Expired - Fee Related JP5597751B2 (ja) 2007-06-06 2013-06-12 板状製品の電気分解処理用装置及び方法

Family Applications After (1)

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JP2013123570A Expired - Fee Related JP5597751B2 (ja) 2007-06-06 2013-06-12 板状製品の電気分解処理用装置及び方法

Country Status (11)

Country Link
US (1) US8545687B2 (https=)
EP (1) EP2176450B9 (https=)
JP (2) JP2010530029A (https=)
KR (2) KR20100019481A (https=)
CN (1) CN101730760B (https=)
AT (1) ATE519872T1 (https=)
BR (1) BRPI0812259A2 (https=)
DE (1) DE102007026633B4 (https=)
PL (1) PL2176450T3 (https=)
TW (1) TWI433965B (https=)
WO (1) WO2008148578A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010216006A (ja) * 2009-02-19 2010-09-30 Denso Corp 噴流式めっき方法および装置
WO2012073501A1 (ja) * 2010-12-01 2012-06-07 マルイ鍍金工業株式会社 電解液、電解ケース、電解研磨システムおよび、それらを用いた電解研磨方法
WO2019058860A1 (ja) * 2017-09-20 2019-03-28 上村工業株式会社 表面処理装置および表面処理方法
JP2024504514A (ja) * 2021-01-19 2024-01-31 ▲シン▼巨（深▲せん▼）半導体科技有限公司 電気めっき装置及び電気めっき方法

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US8431175B2 (en) * 2007-06-05 2013-04-30 Nestec S.A. Method for preparing a beverage or food liquid and system using brewing centrifugal force
RU2474525C2 (ru) 2007-06-05 2013-02-10 Нестек С.А. Капсула и способ приготовления пищевой жидкости с помощью центрифугирования
CA2687894C (en) * 2007-06-05 2016-05-10 Nestec S.A. Capsule system, device and method for preparing a food liquid contained in a receptacle by centrifugation
ATE540880T1 (de) * 2007-06-05 2012-01-15 Nestec Sa Einwegkapsel zur herstellung eines flüssigen nahrungsmittels durch zentrifugierung
CN101677706B (zh) * 2007-06-05 2013-07-17 雀巢产品技术援助有限公司 使用煮泡离心力的用于制备饮料或液态食品的方法和系统
US8512784B2 (en) * 2008-09-02 2013-08-20 Nestec S.A. Method and device for controlled beverage production using centrifugal forces
EP2330953B1 (en) 2008-09-02 2015-06-03 Nestec S.A. Method for preparing a food liquid contained in a capsule by centrifugation and system adapted for such method
WO2010066736A1 (en) 2008-12-09 2010-06-17 Nestec S.A. Liquid food preparation system for preparing a liquid food by centrifugation
DK2592021T3 (en) * 2009-08-19 2015-04-27 Nestec Sa The capsule for preparing a coffee extract having a structure that facilitates perforation for injecting water
US8658232B2 (en) * 2009-08-28 2014-02-25 Nestec S.A. Capsule system for the preparation of beverages by centrifugation
CN104545474B (zh) 2009-08-28 2017-05-31 雀巢产品技术援助有限公司 通过离心法制备饮料的胶囊系统
DE102010033256A1 (de) 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
US20140083842A1 (en) * 2012-09-25 2014-03-27 Almex Pe Inc. Serial plating system
EP2746432A1 (en) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
ITMI20130466A1 (it) * 2013-03-27 2014-09-28 Qualital Servizi S R L Sistema di pretrattamento alla verniciatura dell'alluminio mediante una tecnica innovativa di ossidazione anodica.
EP2813601A1 (en) 2013-06-14 2014-12-17 ATOTECH Deutschland GmbH Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device
ES2772808T3 (es) * 2014-03-11 2020-07-08 Qualital Servizi S R L Instalación y procedimiento para el tratamiento de anodización de productos fabricados de aluminio o aleaciones del mismo
CN105063709B (zh) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 印刷电路板用电镀装置
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
CN109312487B (zh) * 2016-06-09 2021-02-26 杰富意钢铁株式会社 电镀钢板的制造方法以及其制造装置
EP3287550B1 (en) 2016-08-23 2019-02-13 ATOTECH Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN117964183B (zh) * 2024-04-02 2024-06-07 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) 一种苯胺类事故废水应急处置方法及一体化装置

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JPS5794593A (en) * 1980-12-02 1982-06-12 Nikko Eng Kk Surface treating device for metal
JPS57210989A (en) * 1981-02-10 1982-12-24 Hiroshige Sawa Electroplating method
JPS59181873U (ja) * 1983-05-21 1984-12-04 株式会社　中央製作所 板状被表面処理物のメツキ処理装置
JPH0261089A (ja) * 1988-08-29 1990-03-01 Nippon Denso Co Ltd めっき装置
JPH02254200A (ja) * 1989-03-28 1990-10-12 Electroplating Eng Of Japan Co メッキ装置及びメッキ金属の補給方法
JPH08253892A (ja) * 1995-03-16 1996-10-01 Nippondenso Co Ltd めっき装置およびめっき方法
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JPS5794593A (en) * 1980-12-02 1982-06-12 Nikko Eng Kk Surface treating device for metal
JPS57210989A (en) * 1981-02-10 1982-12-24 Hiroshige Sawa Electroplating method
JPS59181873U (ja) * 1983-05-21 1984-12-04 株式会社　中央製作所 板状被表面処理物のメツキ処理装置
JPH0261089A (ja) * 1988-08-29 1990-03-01 Nippon Denso Co Ltd めっき装置
JPH02254200A (ja) * 1989-03-28 1990-10-12 Electroplating Eng Of Japan Co メッキ装置及びメッキ金属の補給方法
JPH08253892A (ja) * 1995-03-16 1996-10-01 Nippondenso Co Ltd めっき装置およびめっき方法
JPH10275811A (ja) * 1997-03-31 1998-10-13 Shinko Electric Ind Co Ltd バンプの形成方法およびめっき装置
JP2000239899A (ja) * 1999-02-25 2000-09-05 Nau Chemical:Kk めっき装置
JP2002226993A (ja) * 2001-02-01 2002-08-14 Asuka Engineering:Kk プリント基板の銅めっき方法およびめっき装置
JP2005520930A (ja) * 2001-12-24 2005-07-14 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ ウェハ表面を電気メッキするための装置および方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010216006A (ja) * 2009-02-19 2010-09-30 Denso Corp 噴流式めっき方法および装置
WO2012073501A1 (ja) * 2010-12-01 2012-06-07 マルイ鍍金工業株式会社 電解液、電解ケース、電解研磨システムおよび、それらを用いた電解研磨方法
WO2019058860A1 (ja) * 2017-09-20 2019-03-28 上村工業株式会社 表面処理装置および表面処理方法
JP2019056137A (ja) * 2017-09-20 2019-04-11 上村工業株式会社 表面処理装置および表面処理方法
KR20200056409A (ko) * 2017-09-20 2020-05-22 우에무라 고교 가부시키가이샤 표면 처리 장치 및 표면 처리 방법
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US11389818B2 (en) 2017-09-20 2022-07-19 C. Uyemura & Co., Ltd. Surface treatment apparatus and surface treatment method
JP2024504514A (ja) * 2021-01-19 2024-01-31 ▲シン▼巨（深▲せん▼）半導体科技有限公司 電気めっき装置及び電気めっき方法
JP7672742B2 (ja) 2021-01-19 2025-05-08 ▲シン▼巨（深▲せん▼）半導体科技有限公司 電気めっき装置及び電気めっき方法

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Publication number Publication date
JP2013224492A (ja) 2013-10-31
ATE519872T1 (de) 2011-08-15
PL2176450T3 (pl) 2011-12-30
WO2008148578A1 (en) 2008-12-11
JP5597751B2 (ja) 2014-10-01
US20100176004A1 (en) 2010-07-15
EP2176450B9 (en) 2012-02-01
CN101730760A (zh) 2010-06-09
BRPI0812259A2 (pt) 2014-12-23
DE102007026633B4 (de) 2009-04-02
KR20100019481A (ko) 2010-02-18
EP2176450A1 (en) 2010-04-21
CN101730760B (zh) 2011-09-28
US8545687B2 (en) 2013-10-01
KR101641475B1 (ko) 2016-07-20
TWI433965B (zh) 2014-04-11
KR20150071031A (ko) 2015-06-25
EP2176450B1 (en) 2011-08-10
DE102007026633A1 (de) 2008-12-11
TW200918689A (en) 2009-05-01

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