DE102007026633B4 - Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware - Google Patents

Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware Download PDF

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Publication number
DE102007026633B4
DE102007026633B4 DE102007026633A DE102007026633A DE102007026633B4 DE 102007026633 B4 DE102007026633 B4 DE 102007026633B4 DE 102007026633 A DE102007026633 A DE 102007026633A DE 102007026633 A DE102007026633 A DE 102007026633A DE 102007026633 B4 DE102007026633 B4 DE 102007026633B4
Authority
DE
Germany
Prior art keywords
treatment
goods
devices
electrolytic treatment
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102007026633A
Other languages
German (de)
English (en)
Other versions
DE102007026633A1 (de
Inventor
Reinhard Schneider
Henry Kunze
Ferdinand Wiener
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102007026633A priority Critical patent/DE102007026633B4/de
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to AT08759143T priority patent/ATE519872T1/de
Priority to PCT/EP2008/004616 priority patent/WO2008148578A1/en
Priority to US12/602,703 priority patent/US8545687B2/en
Priority to JP2010510699A priority patent/JP2010530029A/ja
Priority to CN200880018855XA priority patent/CN101730760B/zh
Priority to EP08759143A priority patent/EP2176450B9/en
Priority to KR1020097025444A priority patent/KR20100019481A/ko
Priority to PL08759143T priority patent/PL2176450T3/pl
Priority to KR1020157013377A priority patent/KR101641475B1/ko
Priority to BRPI0812259-8A2A priority patent/BRPI0812259A2/pt
Priority to TW097120909A priority patent/TWI433965B/zh
Publication of DE102007026633A1 publication Critical patent/DE102007026633A1/de
Application granted granted Critical
Publication of DE102007026633B4 publication Critical patent/DE102007026633B4/de
Priority to JP2013123570A priority patent/JP5597751B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Coating Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
DE102007026633A 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware Expired - Fee Related DE102007026633B4 (de)

Priority Applications (13)

Application Number Priority Date Filing Date Title
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
BRPI0812259-8A2A BRPI0812259A2 (pt) 2007-06-06 2008-06-03 Aparelho e método para o tratamento eletrolítico de um produto em forma de placa
US12/602,703 US8545687B2 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product
JP2010510699A JP2010530029A (ja) 2007-06-06 2008-06-03 板状製品の電気的処理用装置及び方法
CN200880018855XA CN101730760B (zh) 2007-06-06 2008-06-03 用于电解处理板状产品的装置和方法
EP08759143A EP2176450B9 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product
AT08759143T ATE519872T1 (de) 2007-06-06 2008-06-03 Vorrichtung und verfahren zum elektrolytischen behandeln einer plattenförmigen ware
PL08759143T PL2176450T3 (pl) 2007-06-06 2008-06-03 Aparat i sposób elektrolitycznej obróbki produktu w kształcie płytki
KR1020157013377A KR101641475B1 (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법
PCT/EP2008/004616 WO2008148578A1 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product
KR1020097025444A KR20100019481A (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법
TW097120909A TWI433965B (zh) 2007-06-06 2008-06-05 用於電解處理板狀產品之裝置及方法
JP2013123570A JP5597751B2 (ja) 2007-06-06 2013-06-12 板状製品の電気分解処理用装置及び方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware

Publications (2)

Publication Number Publication Date
DE102007026633A1 DE102007026633A1 (de) 2008-12-11
DE102007026633B4 true DE102007026633B4 (de) 2009-04-02

Family

ID=39712035

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007026633A Expired - Fee Related DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware

Country Status (11)

Country Link
US (1) US8545687B2 (https=)
EP (1) EP2176450B9 (https=)
JP (2) JP2010530029A (https=)
KR (2) KR20100019481A (https=)
CN (1) CN101730760B (https=)
AT (1) ATE519872T1 (https=)
BR (1) BRPI0812259A2 (https=)
DE (1) DE102007026633B4 (https=)
PL (1) PL2176450T3 (https=)
TW (1) TWI433965B (https=)
WO (1) WO2008148578A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010033256A1 (de) 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung

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RU2474525C2 (ru) 2007-06-05 2013-02-10 Нестек С.А. Капсула и способ приготовления пищевой жидкости с помощью центрифугирования
CA2687894C (en) * 2007-06-05 2016-05-10 Nestec S.A. Capsule system, device and method for preparing a food liquid contained in a receptacle by centrifugation
ATE540880T1 (de) * 2007-06-05 2012-01-15 Nestec Sa Einwegkapsel zur herstellung eines flüssigen nahrungsmittels durch zentrifugierung
CN101677706B (zh) * 2007-06-05 2013-07-17 雀巢产品技术援助有限公司 使用煮泡离心力的用于制备饮料或液态食品的方法和系统
US8512784B2 (en) * 2008-09-02 2013-08-20 Nestec S.A. Method and device for controlled beverage production using centrifugal forces
EP2330953B1 (en) 2008-09-02 2015-06-03 Nestec S.A. Method for preparing a food liquid contained in a capsule by centrifugation and system adapted for such method
WO2010066736A1 (en) 2008-12-09 2010-06-17 Nestec S.A. Liquid food preparation system for preparing a liquid food by centrifugation
JP5375596B2 (ja) * 2009-02-19 2013-12-25 株式会社デンソー 噴流式めっき方法および装置
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US8658232B2 (en) * 2009-08-28 2014-02-25 Nestec S.A. Capsule system for the preparation of beverages by centrifugation
CN104545474B (zh) 2009-08-28 2017-05-31 雀巢产品技术援助有限公司 通过离心法制备饮料的胶囊系统
JP5889799B2 (ja) * 2010-12-01 2016-03-22 マルイ鍍金工業株式会社 電解ケース
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
US20140083842A1 (en) * 2012-09-25 2014-03-27 Almex Pe Inc. Serial plating system
EP2746432A1 (en) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
ITMI20130466A1 (it) * 2013-03-27 2014-09-28 Qualital Servizi S R L Sistema di pretrattamento alla verniciatura dell'alluminio mediante una tecnica innovativa di ossidazione anodica.
EP2813601A1 (en) 2013-06-14 2014-12-17 ATOTECH Deutschland GmbH Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device
ES2772808T3 (es) * 2014-03-11 2020-07-08 Qualital Servizi S R L Instalación y procedimiento para el tratamiento de anodización de productos fabricados de aluminio o aleaciones del mismo
CN105063709B (zh) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 印刷电路板用电镀装置
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
CN109312487B (zh) * 2016-06-09 2021-02-26 杰富意钢铁株式会社 电镀钢板的制造方法以及其制造装置
EP3287550B1 (en) 2016-08-23 2019-02-13 ATOTECH Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
JP6995544B2 (ja) * 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
CN112899743B (zh) * 2021-01-19 2021-09-21 鑫巨(深圳)半导体科技有限公司 一种电镀装置及电镀方法
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN117964183B (zh) * 2024-04-02 2024-06-07 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) 一种苯胺类事故废水应急处置方法及一体化装置

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WO1998049374A2 (de) * 1997-04-25 1998-11-05 Atotech Deutschland Gmbh Vorrichtung zum elektrolytischen behandeln von leiterplatten und leiterfolien

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US4622917A (en) * 1982-09-27 1986-11-18 Etd Technology, Inc. Apparatus and method for electroless plating
DE4133561A1 (de) * 1991-10-10 1993-04-15 Reinhard Kissler Gmbh Verfahren und vorrichtung zum galvanisieren von waren
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010033256A1 (de) 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung
WO2012013362A1 (de) 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und verfahren zur erzeugung gezielter strömungs- und stromdichtemuster bei einer chemischen und/oder elektrolytischen oberflächenbehandlung

Also Published As

Publication number Publication date
JP2013224492A (ja) 2013-10-31
ATE519872T1 (de) 2011-08-15
PL2176450T3 (pl) 2011-12-30
WO2008148578A1 (en) 2008-12-11
JP5597751B2 (ja) 2014-10-01
US20100176004A1 (en) 2010-07-15
EP2176450B9 (en) 2012-02-01
CN101730760A (zh) 2010-06-09
BRPI0812259A2 (pt) 2014-12-23
KR20100019481A (ko) 2010-02-18
EP2176450A1 (en) 2010-04-21
CN101730760B (zh) 2011-09-28
US8545687B2 (en) 2013-10-01
KR101641475B1 (ko) 2016-07-20
TWI433965B (zh) 2014-04-11
KR20150071031A (ko) 2015-06-25
JP2010530029A (ja) 2010-09-02
EP2176450B1 (en) 2011-08-10
DE102007026633A1 (de) 2008-12-11
TW200918689A (en) 2009-05-01

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