PL2176450T3 - Aparat i sposób elektrolitycznej obróbki produktu w kształcie płytki - Google Patents

Aparat i sposób elektrolitycznej obróbki produktu w kształcie płytki

Info

Publication number
PL2176450T3
PL2176450T3 PL08759143T PL08759143T PL2176450T3 PL 2176450 T3 PL2176450 T3 PL 2176450T3 PL 08759143 T PL08759143 T PL 08759143T PL 08759143 T PL08759143 T PL 08759143T PL 2176450 T3 PL2176450 T3 PL 2176450T3
Authority
PL
Poland
Prior art keywords
product
treatment
plate
shaped product
electrolytic treatment
Prior art date
Application number
PL08759143T
Other languages
English (en)
Polish (pl)
Inventor
Reinhard Schneider
Henry Kunze
Ferdinand Wiener
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL2176450T3 publication Critical patent/PL2176450T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Coating Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
PL08759143T 2007-06-06 2008-06-03 Aparat i sposób elektrolitycznej obróbki produktu w kształcie płytki PL2176450T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
EP08759143A EP2176450B9 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product
PCT/EP2008/004616 WO2008148578A1 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product

Publications (1)

Publication Number Publication Date
PL2176450T3 true PL2176450T3 (pl) 2011-12-30

Family

ID=39712035

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08759143T PL2176450T3 (pl) 2007-06-06 2008-06-03 Aparat i sposób elektrolitycznej obróbki produktu w kształcie płytki

Country Status (11)

Country Link
US (1) US8545687B2 (https=)
EP (1) EP2176450B9 (https=)
JP (2) JP2010530029A (https=)
KR (2) KR20100019481A (https=)
CN (1) CN101730760B (https=)
AT (1) ATE519872T1 (https=)
BR (1) BRPI0812259A2 (https=)
DE (1) DE102007026633B4 (https=)
PL (1) PL2176450T3 (https=)
TW (1) TWI433965B (https=)
WO (1) WO2008148578A1 (https=)

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ES2772808T3 (es) * 2014-03-11 2020-07-08 Qualital Servizi S R L Instalación y procedimiento para el tratamiento de anodización de productos fabricados de aluminio o aleaciones del mismo
CN105063709B (zh) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 印刷电路板用电镀装置
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
CN109312487B (zh) * 2016-06-09 2021-02-26 杰富意钢铁株式会社 电镀钢板的制造方法以及其制造装置
EP3287550B1 (en) 2016-08-23 2019-02-13 ATOTECH Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
JP6995544B2 (ja) * 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
CN112899743B (zh) * 2021-01-19 2021-09-21 鑫巨(深圳)半导体科技有限公司 一种电镀装置及电镀方法
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
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Also Published As

Publication number Publication date
JP2013224492A (ja) 2013-10-31
ATE519872T1 (de) 2011-08-15
WO2008148578A1 (en) 2008-12-11
JP5597751B2 (ja) 2014-10-01
US20100176004A1 (en) 2010-07-15
EP2176450B9 (en) 2012-02-01
CN101730760A (zh) 2010-06-09
BRPI0812259A2 (pt) 2014-12-23
DE102007026633B4 (de) 2009-04-02
KR20100019481A (ko) 2010-02-18
EP2176450A1 (en) 2010-04-21
CN101730760B (zh) 2011-09-28
US8545687B2 (en) 2013-10-01
KR101641475B1 (ko) 2016-07-20
TWI433965B (zh) 2014-04-11
KR20150071031A (ko) 2015-06-25
JP2010530029A (ja) 2010-09-02
EP2176450B1 (en) 2011-08-10
DE102007026633A1 (de) 2008-12-11
TW200918689A (en) 2009-05-01

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