KR20080113371A - 신속한 전자 소자 조립에 유용한 ｕｖ ｂ-단계화가능한, 수분 경화성 조성물 - Google Patents
신속한 전자 소자 조립에 유용한 ｕｖ ｂ-단계화가능한, 수분 경화성 조성물 Download PDFInfo
- Publication number
- KR20080113371A KR20080113371A KR1020087022545A KR20087022545A KR20080113371A KR 20080113371 A KR20080113371 A KR 20080113371A KR 1020087022545 A KR1020087022545 A KR 1020087022545A KR 20087022545 A KR20087022545 A KR 20087022545A KR 20080113371 A KR20080113371 A KR 20080113371A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive composition
- acrylate
- alkoxy
- substrate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 109
- 230000001070 adhesive effect Effects 0.000 claims abstract description 94
- 239000000853 adhesive Substances 0.000 claims abstract description 93
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 44
- 238000006243 chemical reaction Methods 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 125000004423 acyloxy group Chemical group 0.000 claims abstract description 28
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 27
- 238000013008 moisture curing Methods 0.000 claims abstract description 27
- 239000003707 silyl modified polymer Substances 0.000 claims abstract description 25
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 23
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 12
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims abstract description 10
- 230000000977 initiatory effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 33
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 30
- 239000002245 particle Substances 0.000 claims description 26
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 14
- 239000003054 catalyst Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 8
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 7
- -1 acyloxy silane Chemical compound 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 230000001588 bifunctional effect Effects 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000002841 Lewis acid Substances 0.000 claims description 3
- 150000007517 lewis acids Chemical class 0.000 claims description 3
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical group CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 3
- XPEMPJFPRCHICU-UHFFFAOYSA-N (1-tert-butylcyclohexyl) prop-2-enoate Chemical compound C=CC(=O)OC1(C(C)(C)C)CCCCC1 XPEMPJFPRCHICU-UHFFFAOYSA-N 0.000 claims description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical group CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 2
- VEPKQEUBKLEPRA-UHFFFAOYSA-N VX-745 Chemical compound FC1=CC(F)=CC=C1SC1=NN2C=NC(=O)C(C=3C(=CC=CC=3Cl)Cl)=C2C=C1 VEPKQEUBKLEPRA-UHFFFAOYSA-N 0.000 claims description 2
- 238000009156 water cure Methods 0.000 claims description 2
- 230000001464 adherent effect Effects 0.000 claims 2
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- 238000001723 curing Methods 0.000 description 9
- 239000003504 photosensitizing agent Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000003377 acid catalyst Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000013008 thixotropic agent Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000003211 polymerization photoinitiator Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 235000012545 Vaccinium macrocarpon Nutrition 0.000 description 1
- 235000002118 Vaccinium oxycoccus Nutrition 0.000 description 1
- 244000291414 Vaccinium oxycoccus Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005903 acid hydrolysis reaction Methods 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000004634 cranberry Nutrition 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000012955 diaryliodonium Substances 0.000 description 1
- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- OYUWJVBUUZOZGY-UHFFFAOYSA-N disilanyl(hydroxy)silane Chemical compound O[SiH2][SiH2][SiH3] OYUWJVBUUZOZGY-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/276,922 | 2006-03-17 | ||
| US11/276,922 US20070219285A1 (en) | 2006-03-17 | 2006-03-17 | Uv b-stageable, moisture curable composition useful for rapid electronic device assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080113371A true KR20080113371A (ko) | 2008-12-30 |
Family
ID=38518770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087022545A Withdrawn KR20080113371A (ko) | 2006-03-17 | 2007-02-23 | 신속한 전자 소자 조립에 유용한 ｕｖ ｂ-단계화가능한, 수분 경화성 조성물 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070219285A1 (https=) |
| EP (1) | EP1996665A1 (https=) |
| JP (1) | JP2009530441A (https=) |
| KR (1) | KR20080113371A (https=) |
| CN (1) | CN101405360B (https=) |
| TW (1) | TW200745297A (https=) |
| WO (1) | WO2007108895A1 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2393195C1 (ru) * | 2009-02-18 | 2010-06-27 | Общество с ограниченной ответственностью "Пента-91" (ООО "Пента-91") | Фотополимеризуемая кремнийорганическая композиция для склеивания и герметизации оптических элементов и способ получения ее основы |
| KR20170135813A (ko) * | 2015-04-09 | 2017-12-08 | 세키스이가가쿠 고교가부시키가이샤 | 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 |
| KR20210088647A (ko) * | 2018-11-08 | 2021-07-14 | 델로 인더스트리크레브스토페 게엠베하 운트 코 카게아아 | 수분-경화성 1액형 조성물 및 그 조성물을 사용하여 접합, 캐스팅 및 코팅하는 방법 |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5602626B2 (ja) | 2007-06-29 | 2014-10-08 | アーティフィシャル マッスル，インク． | 感覚性フィードバック用途のための電気活性ポリマートランスデューサー |
| JP5466843B2 (ja) * | 2008-10-30 | 2014-04-09 | 倉敷繊維加工株式会社 | エアフィルタ用積層不織布の製造方法 |
| EP2239793A1 (de) | 2009-04-11 | 2010-10-13 | Bayer MaterialScience AG | Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung |
| JP5737185B2 (ja) * | 2009-11-13 | 2015-06-17 | 日立化成株式会社 | 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ |
| DE102010010598A1 (de) * | 2010-03-08 | 2011-09-08 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dual härtende Masse und deren Verwendung |
| TWI542269B (zh) | 2011-03-01 | 2016-07-11 | 拜耳材料科學股份有限公司 | 用於生產可變形聚合物裝置和薄膜的自動化生產方法 |
| KR20140019801A (ko) | 2011-03-22 | 2014-02-17 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | 전기활성 중합체 작동기 렌티큘라 시스템 |
| TWI575049B (zh) * | 2011-12-22 | 2017-03-21 | 漢高股份有限公司 | 紫外線硬化型和濕氣硬化型黏膠組成物 |
| CN102559121A (zh) * | 2012-02-29 | 2012-07-11 | 北京海斯迪克新材料有限公司 | 一种uv/湿气双重固化覆膜胶及其制备方法 |
| EP2828901B1 (en) | 2012-03-21 | 2017-01-04 | Parker Hannifin Corporation | Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices |
| WO2013192143A1 (en) | 2012-06-18 | 2013-12-27 | Bayer Intellectual Property Gmbh | Stretch frame for stretching process |
| WO2014066576A1 (en) | 2012-10-24 | 2014-05-01 | Bayer Intellectual Property Gmbh | Polymer diode |
| CN103232782B (zh) * | 2013-04-23 | 2016-12-28 | 矽时代材料科技股份有限公司 | 一种环保型无溶剂丙烯酸酯保形涂料 |
| JP6432174B2 (ja) * | 2014-06-18 | 2018-12-05 | セメダイン株式会社 | 導電性接着剤 |
| WO2016104787A1 (ja) | 2014-12-26 | 2016-06-30 | セメダイン株式会社 | 光硬化性組成物 |
| KR20180090818A (ko) | 2015-12-08 | 2018-08-13 | 세메다인 가부시키 가이샤 | 광경화성 점착제를 이용하는 접착 방법 |
| DE102015224734A1 (de) | 2015-12-09 | 2017-06-14 | Tesa Se | Zusammensetzung zur Herstellung von Haftklebemassen |
| DE102016111590A1 (de) | 2016-06-24 | 2017-12-28 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Einkomponentenmasse auf Basis von Alkoxysilanen und Verfahren zum Fügen oder Vergießen von Bauteilen unter Verwendung der Masse |
| US20200071512A1 (en) * | 2017-03-29 | 2020-03-05 | Sika Technology Ag | Water-based composition having improved mechanical properties |
| EP3645284A4 (en) | 2017-06-27 | 2021-03-24 | Inx International Ink Co. | ENERGY CURED HEAT ACTIVATED INKJET ADHESIVES FOR FILM APPLICATIONS |
| US12054620B2 (en) | 2017-06-27 | 2024-08-06 | Inx International Ink Co. | Energy curable, heat activated flexographic adhesives for die-less foiling |
| CN111479693B (zh) * | 2017-12-13 | 2023-06-16 | 3M创新有限公司 | 含有三烷基硼烷络合物引发剂和光酸的光学透明粘合剂 |
| EP3763795A1 (de) * | 2019-07-08 | 2021-01-13 | tesa SE | Feuchtigkeitsvernetzbare, dimensionsstabile polymermasse |
| CN114163974A (zh) * | 2021-12-30 | 2022-03-11 | 烟台信友新材料有限公司 | 一种可uv-led和湿气双固化的高润湿性环保三防胶黏剂及其制备方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4239077A (en) * | 1978-12-01 | 1980-12-16 | Westinghouse Electric Corp. | Method of making heat curable adhesive coated insulation for transformers |
| JP2635098B2 (ja) * | 1988-05-09 | 1997-07-30 | 東芝シリコーン株式会社 | 硬化性ポリオルガノシロキサン組成物 |
| US5086088A (en) * | 1989-03-09 | 1992-02-04 | Minnesota Mining And Manufacturing Company | Epoxy-acrylate blend pressure-sensitive thermosetting adhesives |
| KR930702462A (ko) * | 1990-09-19 | 1993-09-09 | 게리 리 그리스월드 | 수분-경화성 폴리올레핀으로 구성된 압감성 접착제 |
| US5212211A (en) * | 1990-11-19 | 1993-05-18 | Loctite Corporation | Polymodal-cure silicone composition, and method of making the same |
| US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
| US6471820B1 (en) * | 1995-01-05 | 2002-10-29 | 3M Innovative Properties | Moisture-curable silicone composition |
| US5827926A (en) * | 1996-11-08 | 1998-10-27 | Minnesota Mining And Manufacturing Company | Moisture-curable, hot-melt composition |
| WO1998040439A1 (en) * | 1997-03-14 | 1998-09-17 | Minnesota Mining And Manufacturing Company | Cure-on-demand, moisture-curable compositions having reactive silane functionality |
| SG73647A1 (en) * | 1998-06-09 | 2000-06-20 | Nat Starch Chem Invest | Uv / moisture cure adhesive |
| JP2002308959A (ja) * | 2001-04-16 | 2002-10-23 | Kanegafuchi Chem Ind Co Ltd | 湿気硬化型組成物 |
| US6606247B2 (en) * | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
| JP3892270B2 (ja) * | 2001-10-17 | 2007-03-14 | コニシ株式会社 | 一液湿気硬化型可撓性樹脂組成物 |
| US7214569B2 (en) * | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| US20030187088A1 (en) * | 2002-04-01 | 2003-10-02 | Shin-Etsu Chemical Co., Ltd. | Photo-curable coating compostion for hard protective coat and coated article |
| KR100967770B1 (ko) * | 2002-10-23 | 2010-07-05 | 헨켈 코포레이션 | 고속 수분 경화성 및 자외선-수분 이중 경화성 조성물 |
| US6940408B2 (en) * | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
| JP2005281404A (ja) * | 2004-03-29 | 2005-10-13 | Aica Kogyo Co Ltd | 湿気硬化型樹脂組成物とその硬化促進方法 |
| JP2005350514A (ja) * | 2004-06-08 | 2005-12-22 | Sekisui Chem Co Ltd | 湿気硬化型組成物とその用途 |
| US20050282355A1 (en) * | 2004-06-18 | 2005-12-22 | Edwards David N | High density bonding of electrical devices |
-
2006
- 2006-03-17 US US11/276,922 patent/US20070219285A1/en not_active Abandoned
-
2007
- 2007-02-23 KR KR1020087022545A patent/KR20080113371A/ko not_active Withdrawn
- 2007-02-23 CN CN2007800094505A patent/CN101405360B/zh not_active Expired - Fee Related
- 2007-02-23 JP JP2009500367A patent/JP2009530441A/ja not_active Withdrawn
- 2007-02-23 EP EP07751613A patent/EP1996665A1/en not_active Withdrawn
- 2007-02-23 WO PCT/US2007/004865 patent/WO2007108895A1/en not_active Ceased
- 2007-03-14 TW TW096108810A patent/TW200745297A/zh unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2393195C1 (ru) * | 2009-02-18 | 2010-06-27 | Общество с ограниченной ответственностью "Пента-91" (ООО "Пента-91") | Фотополимеризуемая кремнийорганическая композиция для склеивания и герметизации оптических элементов и способ получения ее основы |
| KR20170135813A (ko) * | 2015-04-09 | 2017-12-08 | 세키스이가가쿠 고교가부시키가이샤 | 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 |
| KR20210088647A (ko) * | 2018-11-08 | 2021-07-14 | 델로 인더스트리크레브스토페 게엠베하 운트 코 카게아아 | 수분-경화성 1액형 조성물 및 그 조성물을 사용하여 접합, 캐스팅 및 코팅하는 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070219285A1 (en) | 2007-09-20 |
| CN101405360B (zh) | 2010-11-17 |
| WO2007108895A1 (en) | 2007-09-27 |
| TW200745297A (en) | 2007-12-16 |
| EP1996665A1 (en) | 2008-12-03 |
| CN101405360A (zh) | 2009-04-08 |
| JP2009530441A (ja) | 2009-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20080113371A (ko) | 신속한 전자 소자 조립에 유용한 ｕｖ ｂ-단계화가능한, 수분 경화성 조성물 | |
| CN1146647C (zh) | 各向异性导电粘合剂、其制法和使用该粘合剂的电子装置 | |
| KR101538834B1 (ko) | 이방성 도전 재료, 접속 구조체 및 접속 구조체의 제조 방법 | |
| TWI402286B (zh) | A hardened composition, an anisotropic conductive material, and a connecting structure | |
| TW200946633A (en) | Conductive adhesive precursor, method of using the same, and article | |
| CN101568612A (zh) | 用于快速电子组件的热可b阶化组合物 | |
| CN1252204C (zh) | 使用可光活化胶粘膜粘合基材的方法 | |
| CN1326904C (zh) | 光碱发生剂以及应用它的固化性组合物及固化方法 | |
| CN104650789A (zh) | 一种各向异性导电胶及封装方法 | |
| TWI836720B (zh) | 電路連接用接著劑組成物及結構體 | |
| JPWO2018181536A1 (ja) | 接着剤組成物及び構造体 | |
| JP2002294177A (ja) | ダイアタッチフィルム並びにそれを用いた半導体装置の製造方法及び半導体装置 | |
| JPH11191320A (ja) | 異方性導電接着フィルム | |
| JP2000007758A (ja) | Ｂ−ステージ化できる液状エポキシ樹脂組成物 | |
| WO1997016500A1 (en) | Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive | |
| TWI498410B (zh) | 異方性導電膜、接合體及連接方法 | |
| JP5192950B2 (ja) | 硬化性エポキシ組成物、異方性導電材料、積層体、接続構造体及び接続構造体の製造方法 | |
| CN108350341B (zh) | 粘接剂组合物和结构体 | |
| CN101336278A (zh) | 热固化型粘接剂 | |
| TW201724924A (zh) | 接著劑組成物及結構體 | |
| CN100376648C (zh) | 潜在性硬化剂、其制造方法和粘接剂 | |
| JP5011599B2 (ja) | 接着剤組成物、回路接続用接着剤組成物、回路接続材料、接続体及び半導体装置 | |
| JP4797224B2 (ja) | 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 | |
| CN102965040B (zh) | 用于制造电子部件的胶粘带 | |
| TW202513745A (zh) | 導電糊、rfid嵌體及rfid嵌體之製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20080916 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |