TW200745297A - UV B-stageable, moisture curable composition useful for rapid electronic device assembly - Google Patents
UV B-stageable, moisture curable composition useful for rapid electronic device assemblyInfo
- Publication number
- TW200745297A TW200745297A TW096108810A TW96108810A TW200745297A TW 200745297 A TW200745297 A TW 200745297A TW 096108810 A TW096108810 A TW 096108810A TW 96108810 A TW96108810 A TW 96108810A TW 200745297 A TW200745297 A TW 200745297A
- Authority
- TW
- Taiwan
- Prior art keywords
- stageable
- electronic device
- curable composition
- device assembly
- composition useful
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/276,922 US20070219285A1 (en) | 2006-03-17 | 2006-03-17 | Uv b-stageable, moisture curable composition useful for rapid electronic device assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200745297A true TW200745297A (en) | 2007-12-16 |
Family
ID=38518770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096108810A TW200745297A (en) | 2006-03-17 | 2007-03-14 | UV B-stageable, moisture curable composition useful for rapid electronic device assembly |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070219285A1 (zh) |
EP (1) | EP1996665A1 (zh) |
JP (1) | JP2009530441A (zh) |
KR (1) | KR20080113371A (zh) |
CN (1) | CN101405360B (zh) |
TW (1) | TW200745297A (zh) |
WO (1) | WO2007108895A1 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5602626B2 (ja) | 2007-06-29 | 2014-10-08 | アーティフィシャル マッスル,インク. | 感覚性フィードバック用途のための電気活性ポリマートランスデューサー |
JP5466843B2 (ja) * | 2008-10-30 | 2014-04-09 | 倉敷繊維加工株式会社 | エアフィルタ用積層不織布の製造方法 |
EP2239793A1 (de) | 2009-04-11 | 2010-10-13 | Bayer MaterialScience AG | Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung |
JP5737185B2 (ja) * | 2009-11-13 | 2015-06-17 | 日立化成株式会社 | 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ |
DE102010010598A1 (de) * | 2010-03-08 | 2011-09-08 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dual härtende Masse und deren Verwendung |
CA2828809A1 (en) | 2011-03-01 | 2012-09-07 | Francois EGRON | Automated manufacturing processes for producing deformable polymer devices and films |
TW201250288A (en) | 2011-03-22 | 2012-12-16 | Bayer Materialscience Ag | Electroactive polymer actuator lenticular system |
TWI575049B (zh) * | 2011-12-22 | 2017-03-21 | 漢高股份有限公司 | 紫外線硬化型和濕氣硬化型黏膠組成物 |
CN102559121A (zh) * | 2012-02-29 | 2012-07-11 | 北京海斯迪克新材料有限公司 | 一种uv/湿气双重固化覆膜胶及其制备方法 |
WO2013142552A1 (en) | 2012-03-21 | 2013-09-26 | Bayer Materialscience Ag | Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices |
KR20150031285A (ko) | 2012-06-18 | 2015-03-23 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | 연신 공정을 위한 연신 프레임 |
WO2014066576A1 (en) | 2012-10-24 | 2014-05-01 | Bayer Intellectual Property Gmbh | Polymer diode |
CN103232782B (zh) * | 2013-04-23 | 2016-12-28 | 矽时代材料科技股份有限公司 | 一种环保型无溶剂丙烯酸酯保形涂料 |
JP6432174B2 (ja) * | 2014-06-18 | 2018-12-05 | セメダイン株式会社 | 導電性接着剤 |
JP6683133B2 (ja) | 2014-12-26 | 2020-04-15 | セメダイン株式会社 | 光硬化性組成物 |
WO2016163353A1 (ja) * | 2015-04-09 | 2016-10-13 | 積水化学工業株式会社 | 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤 |
KR20180090818A (ko) | 2015-12-08 | 2018-08-13 | 세메다인 가부시키 가이샤 | 광경화성 점착제를 이용하는 접착 방법 |
DE102015224734A1 (de) | 2015-12-09 | 2017-06-14 | Tesa Se | Zusammensetzung zur Herstellung von Haftklebemassen |
DE102016111590A1 (de) | 2016-06-24 | 2017-12-28 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Einkomponentenmasse auf Basis von Alkoxysilanen und Verfahren zum Fügen oder Vergießen von Bauteilen unter Verwendung der Masse |
WO2018178165A1 (en) * | 2017-03-29 | 2018-10-04 | Sika Technology Ag | Water-based composition having improved mechanical properties |
US10927269B2 (en) | 2017-06-27 | 2021-02-23 | Inx International Ink Co. | Energy cured heat activated ink jet adhesives for foiling applications |
KR102625644B1 (ko) * | 2017-12-13 | 2024-01-15 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 트라이알킬 보란 착물 개시제 및 광산을 함유하는 광학 투명 접착제 |
DE102018127854A1 (de) * | 2018-11-08 | 2020-05-14 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Feuchtigkeitshärtbare Einkomponentenmasse und Verfahren zum Fügen, Vergießen und Beschichten unter Verwendung der Masse |
EP3763795A1 (de) * | 2019-07-08 | 2021-01-13 | tesa SE | Feuchtigkeitsvernetzbare, dimensionsstabile polymermasse |
CN114163974A (zh) * | 2021-12-30 | 2022-03-11 | 烟台信友新材料有限公司 | 一种可uv-led和湿气双固化的高润湿性环保三防胶黏剂及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4239077A (en) * | 1978-12-01 | 1980-12-16 | Westinghouse Electric Corp. | Method of making heat curable adhesive coated insulation for transformers |
JP2635098B2 (ja) * | 1988-05-09 | 1997-07-30 | 東芝シリコーン株式会社 | 硬化性ポリオルガノシロキサン組成物 |
US5086088A (en) * | 1989-03-09 | 1992-02-04 | Minnesota Mining And Manufacturing Company | Epoxy-acrylate blend pressure-sensitive thermosetting adhesives |
AU648586B2 (en) * | 1990-09-19 | 1994-04-28 | Minnesota Mining And Manufacturing Company | Moisture-curable polyolefin pressure-sensitive adhesives |
US5212211A (en) * | 1990-11-19 | 1993-05-18 | Loctite Corporation | Polymodal-cure silicone composition, and method of making the same |
US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
US6471820B1 (en) * | 1995-01-05 | 2002-10-29 | 3M Innovative Properties | Moisture-curable silicone composition |
US5827926A (en) * | 1996-11-08 | 1998-10-27 | Minnesota Mining And Manufacturing Company | Moisture-curable, hot-melt composition |
AU6461998A (en) * | 1997-03-14 | 1998-09-29 | Minnesota Mining And Manufacturing Company | Cure-on-demand, moisture-curable compositions having reactive silane functionality |
SG73647A1 (en) * | 1998-06-09 | 2000-06-20 | Nat Starch Chem Invest | Uv / moisture cure adhesive |
JP2002308959A (ja) * | 2001-04-16 | 2002-10-23 | Kanegafuchi Chem Ind Co Ltd | 湿気硬化型組成物 |
US6606247B2 (en) * | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
JP3892270B2 (ja) * | 2001-10-17 | 2007-03-14 | コニシ株式会社 | 一液湿気硬化型可撓性樹脂組成物 |
US7214569B2 (en) * | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
US20030187088A1 (en) * | 2002-04-01 | 2003-10-02 | Shin-Etsu Chemical Co., Ltd. | Photo-curable coating compostion for hard protective coat and coated article |
DE60312891T2 (de) * | 2002-10-23 | 2007-12-13 | Henkel Corp., Rocky Hill | Feuchtigkeits- und gleichzeitig UV- und feuchtigkeitsschnellhärtende Zusammensetzungen |
US6940408B2 (en) * | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
JP2005281404A (ja) * | 2004-03-29 | 2005-10-13 | Aica Kogyo Co Ltd | 湿気硬化型樹脂組成物とその硬化促進方法 |
JP2005350514A (ja) * | 2004-06-08 | 2005-12-22 | Sekisui Chem Co Ltd | 湿気硬化型組成物とその用途 |
US20050282355A1 (en) * | 2004-06-18 | 2005-12-22 | Edwards David N | High density bonding of electrical devices |
-
2006
- 2006-03-17 US US11/276,922 patent/US20070219285A1/en not_active Abandoned
-
2007
- 2007-02-23 KR KR1020087022545A patent/KR20080113371A/ko not_active Application Discontinuation
- 2007-02-23 WO PCT/US2007/004865 patent/WO2007108895A1/en active Application Filing
- 2007-02-23 EP EP07751613A patent/EP1996665A1/en not_active Withdrawn
- 2007-02-23 JP JP2009500367A patent/JP2009530441A/ja not_active Withdrawn
- 2007-02-23 CN CN2007800094505A patent/CN101405360B/zh not_active Expired - Fee Related
- 2007-03-14 TW TW096108810A patent/TW200745297A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20070219285A1 (en) | 2007-09-20 |
JP2009530441A (ja) | 2009-08-27 |
CN101405360A (zh) | 2009-04-08 |
WO2007108895A1 (en) | 2007-09-27 |
EP1996665A1 (en) | 2008-12-03 |
CN101405360B (zh) | 2010-11-17 |
KR20080113371A (ko) | 2008-12-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200745297A (en) | UV B-stageable, moisture curable composition useful for rapid electronic device assembly | |
JP2009530441A5 (zh) | ||
CL2011000591A1 (es) | Proceso para preparar una resina de (met)acrilato de uretano que comprende la reacción de un poliisocianato con al menos un compuesto que contiene dos grupos reactivos capaces de reaccionar con grupos isocianato y un (met)acrilato con grupo capaz de reaccionar con grupos isocianatos; composición adhesiva curable por radiación; método para preparar un adhesivo curable por radiación. | |
ATE352596T1 (de) | Mittels energie härtbare zusammensetzung zur herstellung eines druckempfindlichen klebstoffs | |
HK1041712A1 (en) | Die attach adhesives for use in microelectronic devices | |
SG73662A1 (en) | Die attach adhesives for use in microelectronic devices | |
MX2015008378A (es) | Composicion curable dual por radiacion actinica y humedad. | |
WO2008123110A1 (ja) | 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法 | |
WO2008009575A3 (en) | Method of bonding | |
DE602005018240D1 (de) | Härtbare flüssigharzlichtwellenleiter-upjacket-zusammensetzung | |
ATE318296T1 (de) | Druckempfindlicher kleber und druckempfindliches klebeprodukt | |
JP2013522393A (ja) | 光学用感圧性接着剤シート | |
EP1571191A3 (en) | Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same | |
WO2008014466A3 (en) | Dual cure adhesive formulations | |
RU2011147589A (ru) | Клеи на основе силикон-акрилового гибридного полимера | |
TW200613329A (en) | Photocurable resin composition and resin composition for plastics comprising the same | |
TW200801485A (en) | Method of presuming the state of ultra-violet-curing resin | |
DE602005009639D1 (de) | Durch Ultraviolettstrahlung härtbare Tintenstrahltinte | |
WO2009041533A1 (ja) | ハードコートフィルム | |
MXPA05012264A (es) | Composicion curable por radiacion. | |
MY145701A (en) | Adhesive sheet for light-emitting diode device and light-emitting diode device | |
EP1754766A4 (en) | Aqueous resin dispersion for adhesives and their composition | |
HK1077320A1 (en) | Paint, particularly for plastic materials, and painting method using said paint | |
WO2008108390A1 (ja) | 光硬化性組成物およびこれを用いた硬化物 | |
ATE517161T1 (de) | Druckempfindliches haftmittel mit hoher scherung |