TW200745297A - UV B-stageable, moisture curable composition useful for rapid electronic device assembly - Google Patents

UV B-stageable, moisture curable composition useful for rapid electronic device assembly

Info

Publication number
TW200745297A
TW200745297A TW096108810A TW96108810A TW200745297A TW 200745297 A TW200745297 A TW 200745297A TW 096108810 A TW096108810 A TW 096108810A TW 96108810 A TW96108810 A TW 96108810A TW 200745297 A TW200745297 A TW 200745297A
Authority
TW
Taiwan
Prior art keywords
stageable
electronic device
curable composition
device assembly
composition useful
Prior art date
Application number
TW096108810A
Other languages
English (en)
Chinese (zh)
Inventor
Michael Andrew Kropp
Robert Lawrence David Zenner
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200745297A publication Critical patent/TW200745297A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
TW096108810A 2006-03-17 2007-03-14 UV B-stageable, moisture curable composition useful for rapid electronic device assembly TW200745297A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/276,922 US20070219285A1 (en) 2006-03-17 2006-03-17 Uv b-stageable, moisture curable composition useful for rapid electronic device assembly

Publications (1)

Publication Number Publication Date
TW200745297A true TW200745297A (en) 2007-12-16

Family

ID=38518770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108810A TW200745297A (en) 2006-03-17 2007-03-14 UV B-stageable, moisture curable composition useful for rapid electronic device assembly

Country Status (7)

Country Link
US (1) US20070219285A1 (https=)
EP (1) EP1996665A1 (https=)
JP (1) JP2009530441A (https=)
KR (1) KR20080113371A (https=)
CN (1) CN101405360B (https=)
TW (1) TW200745297A (https=)
WO (1) WO2007108895A1 (https=)

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RU2393195C1 (ru) * 2009-02-18 2010-06-27 Общество с ограниченной ответственностью "Пента-91" (ООО "Пента-91") Фотополимеризуемая кремнийорганическая композиция для склеивания и герметизации оптических элементов и способ получения ее основы
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
KR20120080634A (ko) * 2009-11-13 2012-07-17 히다치 가세고교 가부시끼가이샤 반도체 장치, 반도체 장치의 제조 방법 및 접착제층 부착 반도체 웨이퍼
DE102010010598A1 (de) 2010-03-08 2011-09-08 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Dual härtende Masse und deren Verwendung
WO2012118916A2 (en) 2011-03-01 2012-09-07 Bayer Materialscience Ag Automated manufacturing processes for producing deformable polymer devices and films
JP2014517331A (ja) 2011-03-22 2014-07-17 バイエル・インテレクチュアル・プロパティ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 電場応答性高分子アクチュエータレンチキュラシステム
TWI575049B (zh) * 2011-12-22 2017-03-21 漢高股份有限公司 紫外線硬化型和濕氣硬化型黏膠組成物
CN102559121A (zh) * 2012-02-29 2012-07-11 北京海斯迪克新材料有限公司 一种uv/湿气双重固化覆膜胶及其制备方法
US9876160B2 (en) 2012-03-21 2018-01-23 Parker-Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
KR20150031285A (ko) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 연신 공정을 위한 연신 프레임
US9590193B2 (en) 2012-10-24 2017-03-07 Parker-Hannifin Corporation Polymer diode
CN103232782B (zh) * 2013-04-23 2016-12-28 矽时代材料科技股份有限公司 一种环保型无溶剂丙烯酸酯保形涂料
JP6432174B2 (ja) * 2014-06-18 2018-12-05 セメダイン株式会社 導電性接着剤
KR102494910B1 (ko) 2014-12-26 2023-02-01 세메다인 가부시키 가이샤 광경화성 조성물
CN107075061B (zh) * 2015-04-09 2021-08-24 积水化学工业株式会社 光湿固化型树脂组合物、电子部件用粘接剂及显示元件用粘接剂
JP6156607B1 (ja) * 2015-12-08 2017-07-05 セメダイン株式会社 光硬化性粘着剤を用いる接着方法
DE102015224734A1 (de) 2015-12-09 2017-06-14 Tesa Se Zusammensetzung zur Herstellung von Haftklebemassen
DE102016111590A1 (de) 2016-06-24 2017-12-28 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Einkomponentenmasse auf Basis von Alkoxysilanen und Verfahren zum Fügen oder Vergießen von Bauteilen unter Verwendung der Masse
EP3601399A1 (en) * 2017-03-29 2020-02-05 Sika Technology AG Water-based composition having improved mechanical properties
JP7697773B2 (ja) 2017-06-27 2025-06-24 アイエヌエックス インターナショナル インク カンパニー 箔押し用エネルギー硬化型熱活性化インクジェット接着剤
US12054620B2 (en) 2017-06-27 2024-08-06 Inx International Ink Co. Energy curable, heat activated flexographic adhesives for die-less foiling
KR102625644B1 (ko) * 2017-12-13 2024-01-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 트라이알킬 보란 착물 개시제 및 광산을 함유하는 광학 투명 접착제
DE102018127854A1 (de) * 2018-11-08 2020-05-14 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Feuchtigkeitshärtbare Einkomponentenmasse und Verfahren zum Fügen, Vergießen und Beschichten unter Verwendung der Masse
EP3763795A1 (de) * 2019-07-08 2021-01-13 tesa SE Feuchtigkeitsvernetzbare, dimensionsstabile polymermasse
CN114163974A (zh) * 2021-12-30 2022-03-11 烟台信友新材料有限公司 一种可uv-led和湿气双固化的高润湿性环保三防胶黏剂及其制备方法

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US20050282355A1 (en) * 2004-06-18 2005-12-22 Edwards David N High density bonding of electrical devices

Also Published As

Publication number Publication date
EP1996665A1 (en) 2008-12-03
US20070219285A1 (en) 2007-09-20
JP2009530441A (ja) 2009-08-27
CN101405360A (zh) 2009-04-08
CN101405360B (zh) 2010-11-17
WO2007108895A1 (en) 2007-09-27
KR20080113371A (ko) 2008-12-30

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