KR20080111170A - 코발트, 니켈 및 규소를 함유하는 구리 합금 - Google Patents

코발트, 니켈 및 규소를 함유하는 구리 합금 Download PDF

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Publication number
KR20080111170A
KR20080111170A KR1020087030326A KR20087030326A KR20080111170A KR 20080111170 A KR20080111170 A KR 20080111170A KR 1020087030326 A KR1020087030326 A KR 1020087030326A KR 20087030326 A KR20087030326 A KR 20087030326A KR 20080111170 A KR20080111170 A KR 20080111170A
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South Korea
Prior art keywords
copper
temperature
alloy
nickel
weight percent
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Ceased
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KR1020087030326A
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English (en)
Korean (ko)
Inventor
프랭크 엔 만디고
피터 더블류 로빈슨
데렉 이 타일러
안드레아스 뵈겔
한스-아힘 쿤
프랑크 엠 켑펠러
외르크 제거
Original Assignee
지비씨 메탈즈, 엘엘씨
빌란트-베르케악티엔게젤샤프트
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=30115641&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20080111170(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 지비씨 메탈즈, 엘엘씨, 빌란트-베르케악티엔게젤샤프트 filed Critical 지비씨 메탈즈, 엘엘씨
Publication of KR20080111170A publication Critical patent/KR20080111170A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
KR1020087030326A 2002-07-05 2003-07-01 코발트, 니켈 및 규소를 함유하는 구리 합금 Ceased KR20080111170A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39376502P 2002-07-05 2002-07-05
US60/393,765 2002-07-05

Related Parent Applications (1)

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KR1020047021553A Division KR20050061401A (ko) 2002-07-05 2003-07-01 코발트, 니켈 및 규소를 함유하는 구리 합금

Publications (1)

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KR20080111170A true KR20080111170A (ko) 2008-12-22

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ID=30115641

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KR1020087030326A Ceased KR20080111170A (ko) 2002-07-05 2003-07-01 코발트, 니켈 및 규소를 함유하는 구리 합금
KR1020047021553A Ceased KR20050061401A (ko) 2002-07-05 2003-07-01 코발트, 니켈 및 규소를 함유하는 구리 합금

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KR1020047021553A Ceased KR20050061401A (ko) 2002-07-05 2003-07-01 코발트, 니켈 및 규소를 함유하는 구리 합금

Country Status (11)

Country Link
US (4) US7182823B2 (enExample)
EP (1) EP1520054B8 (enExample)
JP (3) JP2005532477A (enExample)
KR (2) KR20080111170A (enExample)
CN (4) CN101041868A (enExample)
AU (1) AU2003247661A1 (enExample)
CA (1) CA2490799C (enExample)
ES (1) ES2605354T3 (enExample)
MX (1) MXPA05000148A (enExample)
TW (1) TWI327601B (enExample)
WO (1) WO2004005560A2 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101274063B1 (ko) * 2013-01-22 2013-06-12 한국기계연구원 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법
WO2017018570A1 (ko) * 2015-07-29 2017-02-02 창원대학교 산학협력단 배향형 석출물을 포함하는 금속복합재료 및 이의 제조 방법

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US7371627B1 (en) * 2005-05-13 2008-05-13 Micron Technology, Inc. Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines
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US7687342B2 (en) * 2005-09-01 2010-03-30 Micron Technology, Inc. Method of manufacturing a memory device
US7557032B2 (en) * 2005-09-01 2009-07-07 Micron Technology, Inc. Silicided recessed silicon
US7416943B2 (en) * 2005-09-01 2008-08-26 Micron Technology, Inc. Peripheral gate stacks and recessed array gates
JP2007169765A (ja) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The 銅合金とその製造方法
US8268098B2 (en) * 2006-05-26 2012-09-18 Kobe Steel, Ltd. Copper alloy having high strength, high electric conductivity and excellent bending workability
JP5355865B2 (ja) * 2006-06-01 2013-11-27 古河電気工業株式会社 銅合金線材の製造方法および銅合金線材
EP1967596B1 (en) * 2007-02-13 2010-06-16 Dowa Metaltech Co., Ltd. Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4357536B2 (ja) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 強度と成形性に優れる電気電子部品用銅合金板
JP4934493B2 (ja) * 2007-05-09 2012-05-16 古河電気工業株式会社 時効析出型合金ストリップの熱処理方法
JP4981748B2 (ja) * 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
US8287669B2 (en) * 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
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JP5512273B2 (ja) * 2007-09-28 2014-06-04 Ｊｘ日鉱日石金属株式会社 印刷回路用銅箔及び銅張積層板
RU2413021C1 (ru) * 2007-09-28 2011-02-27 Джей Экс Ниппон Майнинг Энд Метлз Корпорейшн МЕДНЫЙ СПЛАВ Cu-Ni-Si-Co ДЛЯ МАТЕРИАЛОВ ЭЛЕКТРОННОЙ ТЕХНИКИ И СПОСОБ ЕГО ПРОИЗВОДСТВА
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US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
US20100326573A1 (en) * 2008-01-30 2010-12-30 Kuniteru Mihara Copper alloy material for electric/electronic component and method for manufacturing the same
WO2009116649A1 (ja) * 2008-03-21 2009-09-24 古河電気工業株式会社 電気電子部品用銅合金材
EP2371976B1 (en) * 2008-12-01 2014-10-22 JX Nippon Mining & Metals Corporation Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor
JP5261161B2 (ja) 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4708485B2 (ja) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
KR20120054099A (ko) 2009-09-28 2012-05-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ 계 구리 합금 및 그 제조 방법
JP5578827B2 (ja) * 2009-10-13 2014-08-27 Ｄｏｗａメタルテック株式会社 高強度銅合金板材およびその製造方法
JP4677505B1 (ja) 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5961335B2 (ja) * 2010-04-05 2016-08-02 Ｄｏｗａメタルテック株式会社 銅合金板材および電気・電子部品
JP6045635B2 (ja) * 2010-04-05 2016-12-14 Ｄｏｗａメタルテック株式会社 銅合金板材の製造方法
JP4830035B2 (ja) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP4672804B1 (ja) * 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4708497B1 (ja) 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法
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