KR20070094551A - 감방사선성 수지 조성물, 액정 표시패널용 스페이서, 액정표시패널용 스페이서의 형성 방법 및 액정 표시패널 - Google Patents

감방사선성 수지 조성물, 액정 표시패널용 스페이서, 액정표시패널용 스페이서의 형성 방법 및 액정 표시패널 Download PDF

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KR20070094551A
KR20070094551A KR1020070026057A KR20070026057A KR20070094551A KR 20070094551 A KR20070094551 A KR 20070094551A KR 1020070026057 A KR1020070026057 A KR 1020070026057A KR 20070026057 A KR20070026057 A KR 20070026057A KR 20070094551 A KR20070094551 A KR 20070094551A
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South Korea
Prior art keywords
resin composition
weight
sensitive resin
radiation sensitive
liquid crystal
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KR1020070026057A
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English (en)
Korean (ko)
Inventor
히또시 하마구치
다이고 이치노헤
šœ뻬이 구마
도시히로 니시오
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제이에스알 가부시끼가이샤
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Publication of KR20070094551A publication Critical patent/KR20070094551A/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Liquid Crystal (AREA)
  • Graft Or Block Polymers (AREA)
KR1020070026057A 2006-03-17 2007-03-16 감방사선성 수지 조성물, 액정 표시패널용 스페이서, 액정표시패널용 스페이서의 형성 방법 및 액정 표시패널 KR20070094551A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00074856 2006-03-17
JP2006074856A JP4816917B2 (ja) 2006-03-17 2006-03-17 感放射線性樹脂組成物、液晶表示パネル用スペーサー、液晶表示パネル用スペーサーの形成方法、および液晶表示パネル

Publications (1)

Publication Number Publication Date
KR20070094551A true KR20070094551A (ko) 2007-09-20

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KR1020070026057A KR20070094551A (ko) 2006-03-17 2007-03-16 감방사선성 수지 조성물, 액정 표시패널용 스페이서, 액정표시패널용 스페이서의 형성 방법 및 액정 표시패널

Country Status (4)

Country Link
JP (1) JP4816917B2 (ja)
KR (1) KR20070094551A (ja)
CN (1) CN101266405B (ja)
TW (1) TWI410750B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130020601A (ko) * 2011-08-17 2013-02-27 후지필름 가부시키가이샤 포토스페이서용 감광성 수지 조성물 및 이를 사용한 포토스페이서

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4802817B2 (ja) * 2006-03-31 2011-10-26 大日本印刷株式会社 異種部材一括形成用光硬化性樹脂組成物
JP5256646B2 (ja) * 2006-05-31 2013-08-07 三菱化学株式会社 液晶表示装置
JP5256647B2 (ja) * 2006-05-31 2013-08-07 三菱化学株式会社 保護膜用熱硬化性組成物、硬化物、及び液晶表示装置
JP5181613B2 (ja) * 2007-10-17 2013-04-10 日油株式会社 カラーフィルタ用熱硬化性樹脂組成物およびカラーフィルタ
JP5734579B2 (ja) * 2010-03-26 2015-06-17 三洋化成工業株式会社 感光性樹脂組成物
JP5683849B2 (ja) * 2010-06-30 2015-03-11 三洋化成工業株式会社 感光性樹脂組成物
JP5633381B2 (ja) * 2011-01-17 2014-12-03 Jsr株式会社 感放射線性樹脂組成物、硬化膜及び硬化膜の形成方法
JP2012159657A (ja) * 2011-01-31 2012-08-23 Asahi Kasei E-Materials Corp 光硬化型樹脂組成物及びそれを用いたパターン形成された基材の製造方法、並びに該基材を備える電子部品
JP5924350B2 (ja) * 2012-02-02 2016-05-25 日立化成株式会社 感光性樹脂組成物及びそれを用いた感光性エレメント、スペーサーの形成方法、並びに、スペーサー
KR20140098483A (ko) * 2013-01-31 2014-08-08 삼성디스플레이 주식회사 감광성 수지 조성물 및 이를 이용한 패턴 형성 방법
TWI652297B (zh) * 2013-11-15 2019-03-01 富士軟片股份有限公司 硬化性組成物、硬化膜的製造方法、硬化膜及顯示裝置
KR20180077743A (ko) * 2016-12-29 2018-07-09 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0689078B2 (ja) * 1990-02-27 1994-11-09 積水化学工業株式会社 感光性樹脂組成物
JPH06345835A (ja) * 1993-06-08 1994-12-20 Mitsubishi Rayon Co Ltd 架橋硬化樹脂
US6127094A (en) * 1997-10-02 2000-10-03 Napp Systems Inc. Acrylate copolymer-containing water-developable photosensitive resins and printing plates prepared therefrom
JP4016893B2 (ja) * 2003-06-12 2007-12-05 Ｊｓｒ株式会社 表示パネル用スペーサーの形成に使用される感放射線性樹脂組成物および液晶表示素子
JP2005024893A (ja) * 2003-07-02 2005-01-27 Hitachi Chem Co Ltd 感光性樹脂組成物及びその用途
JP4315010B2 (ja) * 2004-02-13 2009-08-19 Ｊｓｒ株式会社 感放射線性樹脂組成物、表示パネル用スペーサーおよび表示パネル
JP4539165B2 (ja) * 2004-05-12 2010-09-08 Ｊｓｒ株式会社 感放射線性樹脂組成物、スペーサー、およびその形成方法、並びに液晶表示素子
TW200540565A (en) * 2004-06-08 2005-12-16 Sumitomo Chemical Co Photosensitive resin composition
CN100480745C (zh) * 2004-06-18 2009-04-22 富士胶片株式会社 着色感光性树脂组合物及其布膜、感光性树脂转印材料
JP4419736B2 (ja) * 2004-07-20 2010-02-24 Ｊｓｒ株式会社 感光性樹脂組成物、表示パネル用スペーサーおよび表示パネル
JP4864375B2 (ja) * 2004-08-09 2012-02-01 ドンジン セミケム カンパニー リミテッド スペーサ用感光性樹脂組成物、スペーサ及び液晶表示素子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130020601A (ko) * 2011-08-17 2013-02-27 후지필름 가부시키가이샤 포토스페이서용 감광성 수지 조성물 및 이를 사용한 포토스페이서

Also Published As

Publication number Publication date
CN101266405A (zh) 2008-09-17
TW200739259A (en) 2007-10-16
TWI410750B (zh) 2013-10-01
JP2007249005A (ja) 2007-09-27
JP4816917B2 (ja) 2011-11-16
CN101266405B (zh) 2011-12-21

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