KR20070003818A - 다중 직렬 선택 장치들을 통합하는 낸드 메모리 어레이 및상기 어레이의 동작 방법 - Google Patents
다중 직렬 선택 장치들을 통합하는 낸드 메모리 어레이 및상기 어레이의 동작 방법 Download PDFInfo
- Publication number
- KR20070003818A KR20070003818A KR1020067013554A KR20067013554A KR20070003818A KR 20070003818 A KR20070003818 A KR 20070003818A KR 1020067013554 A KR1020067013554 A KR 1020067013554A KR 20067013554 A KR20067013554 A KR 20067013554A KR 20070003818 A KR20070003818 A KR 20070003818A
- Authority
- KR
- South Korea
- Prior art keywords
- nand string
- memory
- voltage
- string
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000015654 memory Effects 0.000 title claims abstract description 310
- 238000000034 method Methods 0.000 title claims description 54
- 238000003860 storage Methods 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000007667 floating Methods 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 5
- 230000000737 periodic effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 13
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 55
- 238000003491 array Methods 0.000 description 29
- 230000002829 reductive effect Effects 0.000 description 21
- 239000011295 pitch Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- 230000002265 prevention Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 230000008901 benefit Effects 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000003449 preventive effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 241000270295 Serpentes Species 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010893 electron trap Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000006993 memory improvement Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- -1 silicon oxide nitride Chemical class 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
- G11C16/3427—Circuits or methods to prevent or reduce disturbance of the state of a memory cell when neighbouring cells are read or written
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/729,865 US20050128807A1 (en) | 2003-12-05 | 2003-12-05 | Nand memory array incorporating multiple series selection devices and method for operation of same |
| US10/729,865 | 2003-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20070003818A true KR20070003818A (ko) | 2007-01-05 |
Family
ID=34652706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067013554A Withdrawn KR20070003818A (ko) | 2003-12-05 | 2004-12-02 | 다중 직렬 선택 장치들을 통합하는 낸드 메모리 어레이 및상기 어레이의 동작 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20050128807A1 (enExample) |
| EP (1) | EP1695356A2 (enExample) |
| JP (1) | JP2007513455A (enExample) |
| KR (1) | KR20070003818A (enExample) |
| CN (1) | CN1906700A (enExample) |
| WO (1) | WO2005057586A2 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7924629B2 (en) | 2007-12-28 | 2011-04-12 | Samsung Electronics Co., Ltd. | Three-dimensional memory device and programming method |
| KR101054554B1 (ko) * | 2009-07-15 | 2011-08-04 | 가부시끼가이샤 도시바 | 불휘발성 반도체 기억 장치 |
| KR20130007417A (ko) * | 2011-06-23 | 2013-01-18 | 매크로닉스 인터내셔널 컴퍼니 리미티드 | 메모리 스트링 내에 다이오드를 구비하는 3차원 어레이의 메모리 구조 |
| KR20240013012A (ko) * | 2022-07-21 | 2024-01-30 | 경북대학교 산학협력단 | 공핍모드 및 다중 문턱전압을 갖는 mosfet을 사용하는 3진 논리 회로 설계 방법 및 이를 수행하기 위한 장치 및 기록 매체 |
| US12530514B2 (en) | 2022-07-21 | 2026-01-20 | Kyungpook National University Industry-Academic Cooperation Foundation | Method of designing ternary logic circuit using MOSFETs having depletion-mode and multi-VTHS, and device and recording medium for performing the same |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7233522B2 (en) | 2002-12-31 | 2007-06-19 | Sandisk 3D Llc | NAND memory array incorporating capacitance boosting of channel regions in unselected memory cells and method for operation of same |
| US7221588B2 (en) * | 2003-12-05 | 2007-05-22 | Sandisk 3D Llc | Memory array incorporating memory cells arranged in NAND strings |
| US20060067127A1 (en) * | 2004-09-30 | 2006-03-30 | Matrix Semiconductor, Inc. | Method of programming a monolithic three-dimensional memory |
| KR100645055B1 (ko) * | 2004-10-28 | 2006-11-10 | 삼성전자주식회사 | 플래시 메모리 장치 및 그것의 프로그램 방법 |
| US7298665B2 (en) * | 2004-12-30 | 2007-11-20 | Sandisk 3D Llc | Dual-mode decoder circuit, integrated circuit memory array incorporating same, and related methods of operation |
| US7177191B2 (en) * | 2004-12-30 | 2007-02-13 | Sandisk 3D Llc | Integrated circuit including memory array incorporating multiple types of NAND string structures |
| US7286439B2 (en) * | 2004-12-30 | 2007-10-23 | Sandisk 3D Llc | Apparatus and method for hierarchical decoding of dense memory arrays using multiple levels of multiple-headed decoders |
| US7054219B1 (en) | 2005-03-31 | 2006-05-30 | Matrix Semiconductor, Inc. | Transistor layout configuration for tight-pitched memory array lines |
| US7272052B2 (en) * | 2005-03-31 | 2007-09-18 | Sandisk 3D Llc | Decoding circuit for non-binary groups of memory line drivers |
| US7359279B2 (en) * | 2005-03-31 | 2008-04-15 | Sandisk 3D Llc | Integrated circuit memory array configuration including decoding compatibility with partial implementation of multiple memory layers |
| US7142471B2 (en) * | 2005-03-31 | 2006-11-28 | Sandisk 3D Llc | Method and apparatus for incorporating block redundancy in a memory array |
| US7170783B2 (en) * | 2005-04-01 | 2007-01-30 | Micron Technology, Inc. | Layout for NAND flash memory array having reduced word line impedance |
| EP1750273B1 (en) * | 2005-08-05 | 2011-12-07 | Infineon Technologies AG | Memory cell with increased access reliability |
| US7684781B2 (en) * | 2005-11-25 | 2010-03-23 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device |
| US7912439B2 (en) * | 2005-11-25 | 2011-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and operating method thereof |
| US20080237694A1 (en) * | 2007-03-27 | 2008-10-02 | Michael Specht | Integrated circuit, cell, cell arrangement, method for manufacturing an integrated circuit, method for manufacturing a cell, memory module |
| US7638836B2 (en) * | 2007-05-15 | 2009-12-29 | Schiltron Corporation | Nonvolatile memory with backplate |
| KR100909968B1 (ko) * | 2007-06-12 | 2009-07-29 | 삼성전자주식회사 | 구동방식을 개선한 입체 구조의 플래시 메모리 장치 및 그구동방법 |
| KR100953046B1 (ko) * | 2007-12-27 | 2010-04-14 | 주식회사 하이닉스반도체 | 불휘발성 메모리 소자의 동작 방법 |
| US7916544B2 (en) * | 2008-01-25 | 2011-03-29 | Micron Technology, Inc. | Random telegraph signal noise reduction scheme for semiconductor memories |
| US8458114B2 (en) * | 2009-03-02 | 2013-06-04 | Analog Devices, Inc. | Analog computation using numerical representations with uncertainty |
| US8179731B2 (en) * | 2009-03-27 | 2012-05-15 | Analog Devices, Inc. | Storage devices with soft processing |
| US8199576B2 (en) * | 2009-04-08 | 2012-06-12 | Sandisk 3D Llc | Three-dimensional array of re-programmable non-volatile memory elements having vertical bit lines and a double-global-bit-line architecture |
| US7983065B2 (en) * | 2009-04-08 | 2011-07-19 | Sandisk 3D Llc | Three-dimensional array of re-programmable non-volatile memory elements having vertical bit lines |
| US8351236B2 (en) * | 2009-04-08 | 2013-01-08 | Sandisk 3D Llc | Three-dimensional array of re-programmable non-volatile memory elements having vertical bit lines and a single-sided word line architecture |
| JP2011076678A (ja) * | 2009-09-30 | 2011-04-14 | Toshiba Corp | 不揮発性半導体記憶装置 |
| CN107293322B (zh) * | 2010-02-07 | 2021-09-21 | 芝诺半导体有限公司 | 含导通浮体晶体管、并具有永久性和非永久性功能的半导体存储元件及操作方法 |
| US9378831B2 (en) | 2010-02-09 | 2016-06-28 | Samsung Electronics Co., Ltd. | Nonvolatile memory devices, operating methods thereof and memory systems including the same |
| KR101658479B1 (ko) | 2010-02-09 | 2016-09-21 | 삼성전자주식회사 | 불휘발성 메모리 장치, 그것의 동작 방법, 그리고 그것을 포함하는 메모리 시스템 |
| KR101691088B1 (ko) | 2010-02-17 | 2016-12-29 | 삼성전자주식회사 | 불휘발성 메모리 장치, 그것의 동작 방법, 그리고 그것을 포함하는 메모리 시스템 |
| KR101691092B1 (ko) | 2010-08-26 | 2016-12-30 | 삼성전자주식회사 | 불휘발성 메모리 장치, 그것의 동작 방법, 그리고 그것을 포함하는 메모리 시스템 |
| US9324440B2 (en) | 2010-02-09 | 2016-04-26 | Samsung Electronics Co., Ltd. | Nonvolatile memory devices, operating methods thereof and memory systems including the same |
| US8923060B2 (en) | 2010-02-17 | 2014-12-30 | Samsung Electronics Co., Ltd. | Nonvolatile memory devices and operating methods thereof |
| US8908431B2 (en) | 2010-02-17 | 2014-12-09 | Samsung Electronics Co., Ltd. | Control method of nonvolatile memory device |
| JP5788183B2 (ja) | 2010-02-17 | 2015-09-30 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 不揮発性メモリ装置、それの動作方法、そしてそれを含むメモリシステム |
| JP2011170956A (ja) | 2010-02-18 | 2011-09-01 | Samsung Electronics Co Ltd | 不揮発性メモリ装置およびそのプログラム方法と、それを含むメモリシステム |
| US8553466B2 (en) | 2010-03-04 | 2013-10-08 | Samsung Electronics Co., Ltd. | Non-volatile memory device, erasing method thereof, and memory system including the same |
| US8526237B2 (en) | 2010-06-08 | 2013-09-03 | Sandisk 3D Llc | Non-volatile memory having 3D array of read/write elements and read/write circuits and method thereof |
| US8547720B2 (en) | 2010-06-08 | 2013-10-01 | Sandisk 3D Llc | Non-volatile memory having 3D array of read/write elements with efficient decoding of vertical bit lines and word lines |
| US8797806B2 (en) * | 2011-08-15 | 2014-08-05 | Micron Technology, Inc. | Apparatus and methods including source gates |
| CN104067348B (zh) * | 2012-01-24 | 2017-04-05 | 苹果公司 | 用于模拟存储器单元的编程及擦除方案 |
| US10541029B2 (en) | 2012-08-01 | 2020-01-21 | Micron Technology, Inc. | Partial block memory operations |
| US8921891B2 (en) | 2012-08-22 | 2014-12-30 | Micron Technology, Inc. | Vertical memory cell string with dielectric in a portion of the body |
| US9589644B2 (en) * | 2012-10-08 | 2017-03-07 | Micron Technology, Inc. | Reducing programming disturbance in memory devices |
| KR102242022B1 (ko) | 2013-09-16 | 2021-04-21 | 삼성전자주식회사 | 불휘발성 메모리 및 그것의 프로그램 방법 |
| KR20150049908A (ko) * | 2013-10-31 | 2015-05-08 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치 및 그것의 소거 방법 |
| US9379163B1 (en) | 2015-03-06 | 2016-06-28 | Kabushiki Kaisha Toshiba | Variable resistance memory device |
| US10157680B2 (en) * | 2015-12-22 | 2018-12-18 | Sandisk Technologies Llp | Sub-block mode for non-volatile memory |
| US10438025B2 (en) * | 2016-10-04 | 2019-10-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-destruct SRAM-based authentication circuit |
| KR102620813B1 (ko) * | 2017-01-03 | 2024-01-04 | 에스케이하이닉스 주식회사 | 반도체 장치, 그 동작 방법 및 메모리 시스템 |
| CN110473579B (zh) * | 2019-07-11 | 2021-07-13 | 中国科学院微电子研究所 | 三维阻变存储阵列、译码电路以及存储系统 |
| EP3832721A1 (en) | 2019-12-06 | 2021-06-09 | Imec VZW | A method for fabricating a 3d ferroelectric memory |
| CN111312312B (zh) * | 2020-02-19 | 2021-10-15 | 无锡中微亿芯有限公司 | 一种用于p_flash型可编程逻辑器件的配置控制电路 |
| CN113196402B (zh) | 2020-03-23 | 2022-11-04 | 长江存储科技有限责任公司 | 存储器件及其编程操作 |
| CN111527544B (zh) * | 2020-03-23 | 2021-04-16 | 长江存储科技有限责任公司 | 3d nand闪存的操作方法和3d nand闪存 |
| US11177280B1 (en) | 2020-05-18 | 2021-11-16 | Sandisk Technologies Llc | Three-dimensional memory device including wrap around word lines and methods of forming the same |
| US11393832B2 (en) * | 2020-07-15 | 2022-07-19 | Ferroelectric Memory Gmbh | Memory cell arrangement |
| WO2022153366A1 (ja) * | 2021-01-12 | 2022-07-21 | Tdk株式会社 | 磁気アレイ、磁気アレイの制御方法及び磁気アレイの制御プログラム |
| CN113223596B (zh) * | 2021-05-25 | 2022-06-17 | 长江存储科技有限责任公司 | 一种三维非易失性存储器及其数据擦除验证方法 |
Family Cites Families (89)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4142176A (en) * | 1976-09-27 | 1979-02-27 | Mostek Corporation | Series read only memory structure |
| US4543594A (en) * | 1982-09-07 | 1985-09-24 | Intel Corporation | Fusible link employing capacitor structure |
| US4602354A (en) * | 1983-01-10 | 1986-07-22 | Ncr Corporation | X-and-OR memory array |
| US4646266A (en) * | 1984-09-28 | 1987-02-24 | Energy Conversion Devices, Inc. | Programmable semiconductor structures and methods for using the same |
| US4868616A (en) * | 1986-12-11 | 1989-09-19 | Energy Conversion Devices, Inc. | Amorphous electronic matrix array for liquid crystal display |
| USRE35838E (en) * | 1987-12-28 | 1998-07-07 | Kabushiki Kaisha Toshiba | Electrically erasable programmable read-only memory with NAND cell structure |
| JP2718716B2 (ja) * | 1988-09-30 | 1998-02-25 | 株式会社東芝 | 不揮発性半導体メモリ装置およびそのデータ書替え方法 |
| JP2586187B2 (ja) * | 1990-07-16 | 1997-02-26 | 日本電気株式会社 | 半導体記憶装置 |
| US5197027A (en) * | 1991-01-24 | 1993-03-23 | Nexcom Technology, Inc. | Single transistor eeprom architecture |
| JP3109537B2 (ja) * | 1991-07-12 | 2000-11-20 | 日本電気株式会社 | 読み出し専用半導体記憶装置 |
| KR940008204B1 (ko) * | 1991-08-14 | 1994-09-08 | 삼성전자 주식회사 | 낸드형 플래쉬 메모리의 과도소거 방지장치 및 방법 |
| US5412493A (en) * | 1992-09-25 | 1995-05-02 | Sony Corporation | Liquid crystal display device having LDD structure type thin film transistors connected in series |
| US5644533A (en) * | 1992-11-02 | 1997-07-01 | Nvx Corporation | Flash memory system, and methods of constructing and utilizing same |
| KR960000616B1 (ko) * | 1993-01-13 | 1996-01-10 | 삼성전자주식회사 | 불휘발성 반도체 메모리 장치 |
| JP3207592B2 (ja) * | 1993-03-19 | 2001-09-10 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| US5555204A (en) * | 1993-06-29 | 1996-09-10 | Kabushiki Kaisha Toshiba | Non-volatile semiconductor memory device |
| JP3192861B2 (ja) * | 1994-03-14 | 2001-07-30 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| DE19523775C2 (de) * | 1994-06-29 | 2001-12-06 | Toshiba Kawasaki Kk | Nichtflüchtige Halbleiterspeichervorrichtung |
| GB9424598D0 (en) * | 1994-12-06 | 1995-01-25 | Philips Electronics Uk Ltd | Semiconductor memory with non-volatile memory transistor |
| US5703382A (en) * | 1995-11-20 | 1997-12-30 | Xerox Corporation | Array having multiple channel structures with continuously doped interchannel regions |
| US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
| US5751012A (en) * | 1995-06-07 | 1998-05-12 | Micron Technology, Inc. | Polysilicon pillar diode for use in a non-volatile memory cell |
| AU7475196A (en) * | 1995-10-25 | 1997-05-15 | Nvx Corporation | Semiconductor non-volatile memory device having a nand cell structure |
| KR100253868B1 (ko) * | 1995-11-13 | 2000-05-01 | 니시무로 타이죠 | 불휘발성 반도체기억장치 |
| US5814853A (en) * | 1996-01-22 | 1998-09-29 | Advanced Micro Devices, Inc. | Sourceless floating gate memory device and method of storing data |
| WO1997047041A2 (en) * | 1996-06-05 | 1997-12-11 | Philips Electronics N.V. | Programmable, non-volatile memory device, and method of manufacturing such a device |
| KR100210846B1 (ko) * | 1996-06-07 | 1999-07-15 | 구본준 | 낸드셀 어레이 |
| US5912489A (en) * | 1996-06-18 | 1999-06-15 | Advanced Micro Devices, Inc. | Dual source side polysilicon select gate structure utilizing single tunnel oxide for NAND array flash memory |
| US5715194A (en) * | 1996-07-24 | 1998-02-03 | Advanced Micro Devices, Inc. | Bias scheme of program inhibit for random programming in a nand flash memory |
| TW338165B (en) * | 1996-09-09 | 1998-08-11 | Sony Co Ltd | Semiconductor nand type flash memory with incremental step pulse programming |
| KR100206709B1 (ko) * | 1996-09-21 | 1999-07-01 | 윤종용 | 멀티비트 불휘발성 반도체 메모리의 셀 어레이의 구조 및 그의 구동방법 |
| US5835396A (en) * | 1996-10-17 | 1998-11-10 | Zhang; Guobiao | Three-dimensional read-only memory |
| JPH10223866A (ja) * | 1997-02-03 | 1998-08-21 | Toshiba Corp | 半導体記憶装置 |
| KR100272037B1 (ko) * | 1997-02-27 | 2000-12-01 | 니시무로 타이죠 | 불휘발성 반도체 기억 장치 |
| JP3489958B2 (ja) * | 1997-03-19 | 2004-01-26 | 富士通株式会社 | 不揮発性半導体記憶装置 |
| NO972803D0 (no) * | 1997-06-17 | 1997-06-17 | Opticom As | Elektrisk adresserbar logisk innretning, fremgangsmåte til elektrisk adressering av samme og anvendelse av innretning og fremgangsmåte |
| KR19990029775A (ko) * | 1997-09-11 | 1999-04-26 | 오카모토 세이시 | 불휘발성 반도체 기억 장치 |
| US6005270A (en) * | 1997-11-10 | 1999-12-21 | Sony Corporation | Semiconductor nonvolatile memory device and method of production of same |
| JP3959165B2 (ja) * | 1997-11-27 | 2007-08-15 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| KR100297602B1 (ko) * | 1997-12-31 | 2001-08-07 | 윤종용 | 비휘발성메모리장치의프로그램방법 |
| JP3999900B2 (ja) * | 1998-09-10 | 2007-10-31 | 株式会社東芝 | 不揮発性半導体メモリ |
| US5991202A (en) * | 1998-09-24 | 1999-11-23 | Advanced Micro Devices, Inc. | Method for reducing program disturb during self-boosting in a NAND flash memory |
| US6034882A (en) * | 1998-11-16 | 2000-03-07 | Matrix Semiconductor, Inc. | Vertically stacked field programmable nonvolatile memory and method of fabrication |
| JP3866460B2 (ja) * | 1998-11-26 | 2007-01-10 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| US6411548B1 (en) * | 1999-07-13 | 2002-06-25 | Kabushiki Kaisha Toshiba | Semiconductor memory having transistors connected in series |
| JP2001028427A (ja) * | 1999-07-14 | 2001-01-30 | Mitsubishi Electric Corp | 不揮発性半導体記憶装置 |
| JP3863330B2 (ja) * | 1999-09-28 | 2006-12-27 | 株式会社東芝 | 不揮発性半導体メモリ |
| JP4899241B2 (ja) * | 1999-12-06 | 2012-03-21 | ソニー株式会社 | 不揮発性半導体記憶装置およびその動作方法 |
| US6888750B2 (en) * | 2000-04-28 | 2005-05-03 | Matrix Semiconductor, Inc. | Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication |
| US6856572B2 (en) * | 2000-04-28 | 2005-02-15 | Matrix Semiconductor, Inc. | Multi-headed decoder structure utilizing memory array line driver with dual purpose driver device |
| US6567287B2 (en) * | 2001-03-21 | 2003-05-20 | Matrix Semiconductor, Inc. | Memory device with row and column decoder circuits arranged in a checkerboard pattern under a plurality of memory arrays |
| US6420215B1 (en) * | 2000-04-28 | 2002-07-16 | Matrix Semiconductor, Inc. | Three-dimensional memory array and method of fabrication |
| JP4002712B2 (ja) * | 2000-05-15 | 2007-11-07 | スパンション エルエルシー | 不揮発性半導体記憶装置および不揮発性半導体記憶装置のデータ保持方法 |
| JP3810985B2 (ja) * | 2000-05-22 | 2006-08-16 | 株式会社東芝 | 不揮発性半導体メモリ |
| JP4477199B2 (ja) * | 2000-06-16 | 2010-06-09 | 株式会社ルネサステクノロジ | 磁気ランダムアクセスメモリ、磁気ランダムアクセスメモリへのアクセス方法および磁気ランダムアクセスメモリの製造方法 |
| JP3672803B2 (ja) * | 2000-07-28 | 2005-07-20 | Necエレクトロニクス株式会社 | 不揮発性記憶装置 |
| JP5792918B2 (ja) * | 2000-08-14 | 2015-10-14 | サンディスク・スリー・ディ・リミテッド・ライアビリティ・カンパニーSandisk 3D Llc | 高集積メモリデバイス |
| US6515888B2 (en) * | 2000-08-14 | 2003-02-04 | Matrix Semiconductor, Inc. | Low cost three-dimensional memory array |
| US6335890B1 (en) * | 2000-11-01 | 2002-01-01 | International Business Machines Corporation | Segmented write line architecture for writing magnetic random access memories |
| JP3730508B2 (ja) * | 2000-11-13 | 2006-01-05 | 株式会社東芝 | 半導体記憶装置およびその動作方法 |
| KR100385226B1 (ko) * | 2000-11-22 | 2003-05-27 | 삼성전자주식회사 | 프로그램 디스터브를 방지할 수 있는 플래시 메모리 장치및 그것을 프로그램하는 방법 |
| US6326269B1 (en) * | 2000-12-08 | 2001-12-04 | Macronix International Co., Ltd. | Method of fabricating self-aligned multilevel mask ROM |
| KR100385230B1 (ko) * | 2000-12-28 | 2003-05-27 | 삼성전자주식회사 | 불휘발성 반도체 메모리 장치의 프로그램 방법 |
| US6611453B2 (en) * | 2001-01-24 | 2003-08-26 | Infineon Technologies Ag | Self-aligned cross-point MRAM device with aluminum metallization layers |
| US6490194B2 (en) * | 2001-01-24 | 2002-12-03 | Infineon Technologies Ag | Serial MRAM device |
| US6512694B2 (en) * | 2001-03-16 | 2003-01-28 | Simtek Corporation | NAND stack EEPROM with random programming capability |
| US6545898B1 (en) * | 2001-03-21 | 2003-04-08 | Silicon Valley Bank | Method and apparatus for writing memory arrays using external source of high programming voltage |
| JP3829088B2 (ja) * | 2001-03-29 | 2006-10-04 | 株式会社東芝 | 半導体記憶装置 |
| JP4796238B2 (ja) * | 2001-04-27 | 2011-10-19 | Okiセミコンダクタ株式会社 | ワード線駆動回路 |
| US6671204B2 (en) * | 2001-07-23 | 2003-12-30 | Samsung Electronics Co., Ltd. | Nonvolatile memory device with page buffer having dual registers and methods of using the same |
| US6597609B2 (en) * | 2001-08-30 | 2003-07-22 | Micron Technology, Inc. | Non-volatile memory with test rows for disturb detection |
| US6473328B1 (en) * | 2001-08-30 | 2002-10-29 | Micron Technology, Inc. | Three-dimensional magnetic memory array with a minimal number of access conductors therein |
| US6456528B1 (en) * | 2001-09-17 | 2002-09-24 | Sandisk Corporation | Selective operation of a multi-state non-volatile memory system in a binary mode |
| US6925007B2 (en) * | 2001-10-31 | 2005-08-02 | Sandisk Corporation | Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements |
| US6542407B1 (en) * | 2002-01-18 | 2003-04-01 | Sandisk Corporation | Techniques of recovering data from memory cells affected by field coupling with adjacent memory cells |
| US6498747B1 (en) * | 2002-02-08 | 2002-12-24 | Infineon Technologies Ag | Magnetoresistive random access memory (MRAM) cross-point array with reduced parasitic effects |
| US20030155582A1 (en) * | 2002-02-19 | 2003-08-21 | Maitreyee Mahajani | Gate dielectric structures for integrated circuits and methods for making and using such gate dielectric structures |
| US6853587B2 (en) * | 2002-06-21 | 2005-02-08 | Micron Technology, Inc. | Vertical NROM having a storage density of 1 bit per 1F2 |
| US6859410B2 (en) * | 2002-11-27 | 2005-02-22 | Matrix Semiconductor, Inc. | Tree decoder structure particularly well-suited to interfacing array lines having extremely small layout pitch |
| JP3863485B2 (ja) * | 2002-11-29 | 2006-12-27 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| US6849905B2 (en) * | 2002-12-23 | 2005-02-01 | Matrix Semiconductor, Inc. | Semiconductor device with localized charge storage dielectric and method of making same |
| US7505321B2 (en) * | 2002-12-31 | 2009-03-17 | Sandisk 3D Llc | Programmable memory array structure incorporating series-connected transistor strings and methods for fabrication and operation of same |
| US7233522B2 (en) * | 2002-12-31 | 2007-06-19 | Sandisk 3D Llc | NAND memory array incorporating capacitance boosting of channel regions in unselected memory cells and method for operation of same |
| US6960794B2 (en) * | 2002-12-31 | 2005-11-01 | Matrix Semiconductor, Inc. | Formation of thin channels for TFT devices to ensure low variability of threshold voltages |
| US7005350B2 (en) * | 2002-12-31 | 2006-02-28 | Matrix Semiconductor, Inc. | Method for fabricating programmable memory array structures incorporating series-connected transistor strings |
| JP2004241558A (ja) * | 2003-02-05 | 2004-08-26 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法、半導体集積回路及び不揮発性半導体記憶装置システム |
| US6822903B2 (en) * | 2003-03-31 | 2004-11-23 | Matrix Semiconductor, Inc. | Apparatus and method for disturb-free programming of passive element memory cells |
| US6977842B2 (en) * | 2003-09-16 | 2005-12-20 | Micron Technology, Inc. | Boosted substrate/tub programming for flash memories |
| US7423304B2 (en) * | 2003-12-05 | 2008-09-09 | Sandisck 3D Llc | Optimization of critical dimensions and pitch of patterned features in and above a substrate |
-
2003
- 2003-12-05 US US10/729,865 patent/US20050128807A1/en not_active Abandoned
-
2004
- 2004-12-02 KR KR1020067013554A patent/KR20070003818A/ko not_active Withdrawn
- 2004-12-02 WO PCT/US2004/040283 patent/WO2005057586A2/en not_active Ceased
- 2004-12-02 EP EP04812730A patent/EP1695356A2/en not_active Withdrawn
- 2004-12-02 CN CNA2004800408960A patent/CN1906700A/zh active Pending
- 2004-12-02 JP JP2006542728A patent/JP2007513455A/ja not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7924629B2 (en) | 2007-12-28 | 2011-04-12 | Samsung Electronics Co., Ltd. | Three-dimensional memory device and programming method |
| KR101054554B1 (ko) * | 2009-07-15 | 2011-08-04 | 가부시끼가이샤 도시바 | 불휘발성 반도체 기억 장치 |
| KR20130007417A (ko) * | 2011-06-23 | 2013-01-18 | 매크로닉스 인터내셔널 컴퍼니 리미티드 | 메모리 스트링 내에 다이오드를 구비하는 3차원 어레이의 메모리 구조 |
| KR20240013012A (ko) * | 2022-07-21 | 2024-01-30 | 경북대학교 산학협력단 | 공핍모드 및 다중 문턱전압을 갖는 mosfet을 사용하는 3진 논리 회로 설계 방법 및 이를 수행하기 위한 장치 및 기록 매체 |
| US12530514B2 (en) | 2022-07-21 | 2026-01-20 | Kyungpook National University Industry-Academic Cooperation Foundation | Method of designing ternary logic circuit using MOSFETs having depletion-mode and multi-VTHS, and device and recording medium for performing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| US20050128807A1 (en) | 2005-06-16 |
| WO2005057586A3 (en) | 2005-09-09 |
| EP1695356A2 (en) | 2006-08-30 |
| JP2007513455A (ja) | 2007-05-24 |
| WO2005057586A2 (en) | 2005-06-23 |
| CN1906700A (zh) | 2007-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20070003818A (ko) | 다중 직렬 선택 장치들을 통합하는 낸드 메모리 어레이 및상기 어레이의 동작 방법 | |
| KR20070007267A (ko) | 개별 메모리 셀들의 다중 기입 펄스 프로그래밍을 통합하는낸드 메모리 어레이 및 상기 어레이의 동작 방법 | |
| US7221588B2 (en) | Memory array incorporating memory cells arranged in NAND strings | |
| US7233522B2 (en) | NAND memory array incorporating capacitance boosting of channel regions in unselected memory cells and method for operation of same | |
| US11164888B2 (en) | Semiconductor memory device | |
| KR100441586B1 (ko) | 반도체 기억 장치 | |
| US7177191B2 (en) | Integrated circuit including memory array incorporating multiple types of NAND string structures | |
| KR100632953B1 (ko) | 메모리 소자, 상기 메모리 소자를 위한 메모리 배열 및 상기 메모리 배열의 구동 방법 | |
| US8085598B2 (en) | Nonvolatile semiconductor memory device | |
| US9711226B2 (en) | Semiconductor memory device | |
| JP5524134B2 (ja) | 不揮発性半導体記憶装置 | |
| KR100738119B1 (ko) | 공통 비트 라인을 갖는 낸드 구조의 비휘발성 메모리 소자 | |
| US8503248B2 (en) | Nonvolatile semiconductor memory device | |
| TW201943058A (zh) | 具有橫向耦合結構和單層閘極的非揮發性記憶體裝置 | |
| US7697336B2 (en) | Non-volatile memory device and method of operating the same | |
| CN107863124B (zh) | 半导体存储器设备及其制造方法 | |
| US20030218910A1 (en) | Semiconductor memory device capable of accurately writing data | |
| WO2004061861A2 (en) | Nand memory array incorporating capacitance boosting of channel regions in unselected memory cells and method for operation of same | |
| US9373403B1 (en) | 3D NAND memory device and operation thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20060705 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |