KR20060045689A - 전자 부품, 실장 구조체, 전기 광학 장치 및 전자기기 - Google Patents
전자 부품, 실장 구조체, 전기 광학 장치 및 전자기기 Download PDFInfo
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- KR20060045689A KR20060045689A KR1020050030905A KR20050030905A KR20060045689A KR 20060045689 A KR20060045689 A KR 20060045689A KR 1020050030905 A KR1020050030905 A KR 1020050030905A KR 20050030905 A KR20050030905 A KR 20050030905A KR 20060045689 A KR20060045689 A KR 20060045689A
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- electronic component
- conductive film
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Abstract
Description
Claims (10)
- 능동면에 형성된 패드와, 상기 패드를 보호하는 보호막 상에 형성된 수지 돌기(resin bump)와, 상기 수지 돌기의 표면에 형성되어, 상기 패드와의 전기적 접속부를 갖는 도전막을 구비하여, 상기 도전막을 통해 상대측 기판에 도전 접속되는 전자 부품으로서,하나의 상기 패드에 대하여, 복수의 상기 수지 돌기가 형성되어 이루어지는 것을 특징으로 하는 전자 부품.
- 능동면에 형성된 패드와, 상기 패드를 보호하는 보호막 상에 형성된 수지 돌기와, 상기 수지 돌기의 표면에 형성되어, 상기 패드와의 전기적 접속부를 갖는 도전막을 구비하여, 상기 도전막을 통해 상대측 기판에 도전 접속되는 전자 부품으로서,하나의 상기 패드에 대하여, 상기 도전막은 복수의 상기 전기적 접속부를 구비하여 이루어지는 것을 특징으로 하는 전자 부품.
- 능동면에 형성된 패드와, 상기 패드를 보호하는 보호막 상에 형성된 수지 돌기와, 상기 수지 돌기의 표면에 형성되어, 상기 패드와의 전기적 접속부를 갖는 도 전막을 구비하여, 상기 도전막을 통해 상대측 기판에 도전 접속되는 전자 부품으로서,하나의 상기 패드에 대하여, 복수의 상기 수지 돌기와, 상기 도전막이 복수의 상기 전기적 접속부를 구비하여 이루어지는 것을 특징으로 하는 전자 부품.
- 능동면에 형성된 패드와, 상기 패드를 보호하는 보호막 상에 형성된 수지 돌기와, 상기 수지 돌기의 표면에 형성되어, 상기 패드와의 전기적 접속부를 갖는 도전막을 구비하여, 상기 도전막을 통해 상대측 기판에 도전 접속되는 전자 부품으로서,하나의 상기 패드에 대하여, 복수의 상기 수지 돌기와, 복수의 상기 도전막이 각각 복수의 상기 전기적 접속부를 구비하여 이루어지는 것을 특징으로 하는 전자 부품.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 수지 돌기는 선형으로 연속하는 돌기 스트립(linear convex strip)으로 형성되어 있는 것을 특징으로 하는 전자 부품.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 수지 돌기는 선형으로 연속하는 돌기 스트립으로 형성된 후, 상기 복수의 도전막의 형성 영역에만 분리하여 형성되어 있는 것을 특징으로 하는 전자 부품.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 수지 돌기는 반구 형상으로 형성되어 있는 것을 특징으로 하는 전자 부품.
- 전자 부품이 상대측 기판에 실장되어 이루어지는 실장 구조체로서,상기 전자 부품은 능동면에 형성된 패드와, 상기 패드를 보호하는 보호막 상에 형성된 수지 돌기와, 상기 수지 돌기의 표면에 형성되어, 상기 패드와의 전기적 접속부를 갖는 도전막을 구비하고,하나의 상기 패드에 도전 접속되어 있는 상기 도전막이 상기 상대측 기판에 있어서의 하나의 전기 단자에 도전 접속되어 있는 것을 특징으로 하는 실장 구조체.
- 청구항 1 내지 청구항 4 중 어느 한 항에 기재된 전자 부품이 전기 광학 패널을 구성하는 기판 위 및/또는 회로 기판 위에 실장되어 이루어지는 것을 특징으로 하는 전기 광학 장치.
- 청구항 9에 기재된 전기 광학 장치를 구비하는 것을 특징으로 하는 전자기기.
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JPJP-P-2004-00121645 | 2004-04-16 | ||
JP2004121645A JP3873986B2 (ja) | 2004-04-16 | 2004-04-16 | 電子部品、実装構造体、電気光学装置および電子機器 |
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KR100699666B1 KR100699666B1 (ko) | 2007-03-23 |
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US (1) | US7166920B2 (ko) |
EP (1) | EP1587142A1 (ko) |
JP (1) | JP3873986B2 (ko) |
KR (1) | KR100699666B1 (ko) |
CN (1) | CN1683961A (ko) |
TW (1) | TWI263251B (ko) |
Cited By (1)
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US8823183B2 (en) | 2010-10-19 | 2014-09-02 | SK Hynix Inc. | Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package |
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WO2006112383A1 (ja) * | 2005-04-14 | 2006-10-26 | Matsushita Electric Industrial Co., Ltd. | 電子回路装置およびその製造方法 |
JP4221606B2 (ja) | 2005-06-28 | 2009-02-12 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP4284544B2 (ja) | 2005-06-29 | 2009-06-24 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
JP4269173B2 (ja) | 2005-07-06 | 2009-05-27 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
JP4224717B2 (ja) | 2005-07-11 | 2009-02-18 | セイコーエプソン株式会社 | 半導体装置 |
JP4645832B2 (ja) * | 2005-08-02 | 2011-03-09 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
JP4708148B2 (ja) | 2005-10-07 | 2011-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4305667B2 (ja) | 2005-11-07 | 2009-07-29 | セイコーエプソン株式会社 | 半導体装置 |
JP4862390B2 (ja) * | 2005-12-20 | 2012-01-25 | セイコーエプソン株式会社 | 電子基板の製造方法 |
JP4887948B2 (ja) * | 2006-07-10 | 2012-02-29 | セイコーエプソン株式会社 | 半導体装置及び半導体モジュール |
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JP4273356B2 (ja) * | 2007-02-21 | 2009-06-03 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP4572376B2 (ja) * | 2007-07-30 | 2010-11-04 | セイコーエプソン株式会社 | 半導体装置の製造方法および電子デバイスの製造方法 |
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TWI377632B (en) * | 2008-03-27 | 2012-11-21 | Taiwan Tft Lcd Ass | Contact structure and forming method thereof and connecting structure thereof |
TWI364146B (en) * | 2008-03-27 | 2012-05-11 | Taiwan Tft Lcd Ass | Contact structure and connecting structure |
WO2010013530A1 (ja) * | 2008-07-28 | 2010-02-04 | シャープ株式会社 | 表示パネル及びそれを備えた表示装置 |
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KR101594484B1 (ko) * | 2012-11-20 | 2016-02-16 | 제일모직주식회사 | 이방성 도전 필름 및 반도체 장치 |
CN105259720B (zh) * | 2015-10-23 | 2018-11-27 | 深超光电(深圳)有限公司 | 阵列基板以及使用该阵列基板的显示面板 |
KR102581793B1 (ko) | 2016-09-01 | 2023-09-26 | 삼성디스플레이 주식회사 | 회로 기판, 이를 포함하는 표시 장치 및 회로 기판의 제조 방법 |
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US8823183B2 (en) | 2010-10-19 | 2014-09-02 | SK Hynix Inc. | Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package |
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EP1587142A1 (en) | 2005-10-19 |
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US7166920B2 (en) | 2007-01-23 |
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US20050230773A1 (en) | 2005-10-20 |
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