CN1683961A - 电子部件、安装结构体、电光装置和电子设备 - Google Patents

电子部件、安装结构体、电光装置和电子设备 Download PDF

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Publication number
CN1683961A
CN1683961A CNA2005100646058A CN200510064605A CN1683961A CN 1683961 A CN1683961 A CN 1683961A CN A2005100646058 A CNA2005100646058 A CN A2005100646058A CN 200510064605 A CN200510064605 A CN 200510064605A CN 1683961 A CN1683961 A CN 1683961A
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mentioned
pad
electronic unit
conducting film
resin projection
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斋藤淳
田中秀一
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Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN1683961A publication Critical patent/CN1683961A/zh
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Abstract

本发明提供冗余性优良的电子部件。这是一种通过在有源面上形成的焊盘(24)导电连接到对方一侧基板上的电子部件(121)，其特征在于：用在有源面上形成的树脂突起(12)和在树脂突起(12)的表面上形成的导电膜(20)构成凸点电极(10)，多个凸点电极(10a、10b)与1个焊盘(24)导电连接。

Description

电子部件、安装结构体、电光装置 和电子设备
技术领域
本发明涉及电子部件、安装结构体、电光装置和电子设备。
现有的技术
从前，在要安装到各种的电子设备内的电路基板或液晶显示装置等中，一直使用安装半导体IC等的电子部件的技术。例如，在液晶显示装置中，要安装用来驱动液晶面板的液晶驱动用IC芯片。该IC芯片，既有要直接安装到构成液晶面板的玻璃基板上的情况，也有要安装到被安装在液晶面板上的柔性基板(FPC)上边的情况。由前者得到的安装结构叫做COG(玻板基芯片，Chip On Glass)构造，后者则叫做COF(FPC上的芯片，Chip OnFPC)构造。
在COG构造的液晶显示装置的液晶驱动用IC芯片的安装工序中，如图9(a)所示，通过已使导电性粒子222a分散到热硬化性树脂222b内的各向异性导电膜(ACF，Anisotropic Conductive Film)222，把IC芯片21配置到玻璃基板11上边。然后，采用对两者进行加热、加压的办法，通过上述导电性粒子222a使IC芯片21的凸点电极(バンプ電極)21B、21B在玻璃基板11上边的电极端子11bx、11dx的排列部分上成为导电接触的状态。然后，借助于硬化后的热硬化性树脂222b保持该导电接触状态。
通常，为了提高金属凸点电极21B与电极端子11bx、11dx之间的导电连接的可靠性，需要在使位于两者间的导电性粒子222a发生了弹性变形的状态下把IC芯片21与玻璃基板11之间的相对位置固定起来。这是因为在该情况下即使是热硬化性树脂222b由于温度变化而发生了热膨胀，也可以维持中间存在着导电性粒子222a的导电接触状态。
然而，对于微细的导电性粒子222a来说，要确保规定的弹性变形量是极其困难的。
于是，如图9(b)所示，人们提出了在IC芯片21的有源面上形成树脂突起12，在该树脂突起12的表面上形成导电膜20，而构成凸点电极10的方案(例如参看专利文献1)。另外，还要预先在IC芯片21的焊盘24的表面上形成绝缘膜26，使该绝缘膜26的一部分变成为开口，形成焊盘24的连接部22。然后，通过相对该连接部22延伸设置凸点电极10的导电膜20，可以使该凸点电极10发挥IC芯片21的电极端子的作用。
当把该凸点电极10推压到玻璃基板的端子上时，构成凸点电极10的树脂突起12就进行弹性变形。另外，由于构成凸点电极10的树脂突起12，与含于ACF中的导电性粒子相比足够地大，故可以确保规定的弹性变形量。在该状态下，如果借助于热硬化性树脂把IC芯片21固定到玻璃基板上，则即使是由于温度变化而使得热硬化性树脂产生了热膨胀，也可以维持中间存在着凸点电极10的导电接触状态。
专利文献1：特开平2-272737号公报
然而，在树脂突起12的表面上形成金属导电膜20的情况下，与在金属构件的表面上形成金属导电膜的情况下相比，金属导电膜20的结合性减弱。假定在金属导电膜20从树脂突起12的表面上剥离下来的情况下，就存在着凸点电极10与玻璃基板的电极端子之间的导电连接变成为不可能(失效)的可能性。
此外，由于上述连接部22，是通过使焊盘24表面的绝缘膜26开口而形成的，故在该连接部22上残存有绝缘膜等的情况下，就存在着凸点电极10与焊盘24之间的导电接触变成为不可能的可能性。
因此，在这些情况下，就存在着不可能把IC芯片21与玻璃基板导电连接起来的问题。因此，由于冗余性的提高而产生的导电连接的可靠性的提高就变成为技术上的课题。
本发明就是为解决上述课题而完成的，目的在于提供冗余性优良的电子部件和安装结构体。
此外，目的还在于提供电连接可靠性优良的电光装置和电子设备。
发明内容
为了实现上述目的，本发明的电子部件具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其中通过上述导电膜与对方一侧基板导电连接，其特征在于：对于1个上述焊盘形成有多个上述树脂突起。
倘采用该构成，则即使是在多个树脂突起之中的1个树脂突起的导电膜剥离下来的情况下，也可以借助于已导电连接到同一焊盘上的别的导电膜，确保与对方一侧的基板的电极端子之间的导电连接。因此，可以提供冗余性优良的电子部件。
此外，本发明的另一电子部件具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其中通过上述导电膜与对方一侧基板导电连接，其特征在于：对于1个上述焊盘，上述导电膜具有多个上述电连接部。
倘采用该构成，即使是在多个电连接部之中的1个电连接部变成不能导通的情况下，也可以借助于别的电连接部，确保该导电膜和焊盘的导电连接。因此，可以提供冗余性优良的电子部件。
此外，本发明的另一电子部件具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其中通过上述导电膜与对方一侧基板导电连接，其特征在于：对于1个上述焊盘，具有多个上述树脂突起和上述导电膜具有的多个上述电连接部。
此外，本发明的另一电子部件具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其中通过上述导电膜与对方一侧基板导电连接，优选地对于1个上述焊盘，具有多个上述树脂突起和多个上述导电膜分别具有的多个上述电连接部。
倘采用该构成，即使是在多个电连接部之中的1个电连接部变成不能导通的情况下，也可以借助于别的电连接部，确保该导电膜与焊盘之间的导电连接。此外，即使是在多个树脂突起之中的1个树脂突起的导电膜剥离下来的情况下，也可以借助于已导电连接到同一焊盘上的别的导电膜，确保与对方一侧的基板的电极端子之间的导电连接。再有，1个树脂突起的导电膜的剥离，不会诱发别的树脂突起的导电膜的剥离。因此，可以提供冗余性优良的电子部件。
此外，理想的是上述树脂突起形成为线状连续的突条。
另外，理想的是上述树脂突起被形成为：在形成了线状连续的突条后，仅仅分离成上述多个导电膜的形成区域。
倘采用该构成，由于可以精度良好地形成树脂突起的高度尺寸，故可以提供导电连接的可靠性优良的电子设备。此外，在把电子部件安装到对方一侧基板上时，还可以确保密封树脂的流动。
此外，理想的是上述树脂突起被形成为半球状。
倘采用该构成，由于可以用小的力使树脂突起产生弹性变形，故可以防止电子设备的破损。
另一方面，本发明的安装结构体，是一种构成为把电子部件安装到对方一侧基板上的安装结构体，其中，所述电子部件具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其特征在于：导电连接到一个上述焊盘上的上述导电膜，被导电连接到上述对方一侧基板的一个电端子上。
倘采用该构成，即使是用多个树脂突起之中的1个树脂突起与对方一侧端子之间的导电连接是不可能的，也可以借助于别的树脂突起确保与对方一侧端子之间的导电连接。因此，可以提供冗余性优良的电子部件。
另一方面，本发明的电光装置，其特征在于：其构成为上述电子部件安装到构成电光面板的基板上边和/或电路基板上边。
由于上述电子部件的冗余性是优良的，故可以提供电连接的可靠性优良的电光装置。
另一方面，本发明的电子设备，其特征在于：具备上述电光装置。
倘采用该构成，则可以提供电连接的可靠性优良的电子设备。
附图说明
图1的模式图示出了液晶显示装置；
图2是液晶显示装置的电子部件的安装结构的说明图；
图3是实施形态1的电子部件的电极构造的说明图；
图4是实施形态1的电子部件的安装结构的说明图；
图5是实施形态2的电子部件的电极构造的说明图；
图6是实施形态3的电子部件的电极构造的说明图；
图7是实施形态3的电子部件的变形例的说明图；
图8是移动电话的透视图；
图9是现有的电子部件的安装结构的说明图。
符号说明
10、10a、10b...凸点电极  12...树脂突起  24...焊盘  121...电子部件
具体实施方式
以下参看附图对本发明的实施形态进行说明。在以下用于说明的各图中，为使各部件具有可识别的大小，适当地对各部件进行了缩尺(缩放)。
[实施形态1]
首先，对本发明的实施形态1进行说明。
图1的模式图示出了作为电光装置的一个实施形态的液晶显示装置。图示的液晶显示装置100具有液晶面板110和电子部件(液晶驱动用IC芯片)121。此外，还可以根据需要，适宜设置未画出来的偏振片、反射板、背光源等的附属部件。
[电光装置]
液晶面板110具备用玻璃或塑料等构成的基板(衬底)111和112。基板111和112彼此相向配置，并借助于未画出来的密封材料等彼此粘贴起来。在基板111和基板112之间封入有未画出来的本身为电光物质的液晶。在基板111的内面上，形成有用ITO(氧化铟锡)等的透明导体构成的电极111a，在基板112的内面上形成有与上述电极111a相向配置的电极112a。而且电极111a和电极112a垂直地配置。另外电极111a和电极112a被引出到基板伸出部111T，在其端部上分别形成电极端子111bx和电极端子111cx。此外，在基板伸出部111T的边缘附近形成有输入布线111d，在其内端部上还形成有端子111dx。
在基板伸出部111T上，通过用未硬化状态(A阶段状态)或半硬化状态(B阶段状态)的热硬化性树脂构成的密封树脂122安装电子部件121。该电子部件121，例如，为驱动液晶面板110的液晶驱动用IC芯片。在电子部件121的下面形成有未画出来的多个凸点，这些凸点将分别导电连接到基板伸出部111T上的端子111bx、111cx、111dx上。
此外，在输入布线111d的外端部上形成的输入端子111dy上，通过各向异性导电膜124安装柔性布线基板123。输入端子111dy分别导电连接到设置在柔性布线基板123上的、对应的未画出来的布线上。从而可从外部通过柔性布线基板123向输入端子111dy供给控制信号、图像信号、电源电位等，在电子部件121中产生液晶驱动用的驱动信号，供往液晶面板110。
倘采用像以上那样地构成的本实施形态的液晶显示装置100，通过电子部件121把适宜的电压施加到电极111a和电极112a之间，可以使相向配置两电极111a、112a的像素部分的液晶重新取向而对光进行调制，借助于此，就可以在把液晶面板110内的像素排列起来的显示区域内形成所希望的图像。
图2是图1的A-A线处的侧剖面图，是上述液晶显示装置110的电子部件121的安装结构的说明图。在电子部件121的有源面(图示的下面)上，作为IC侧端子设置有多个凸点电极10，其顶端直接与上述基板111的端子111bx、111dx导电接触。在凸点电极10与端子111bx、111dx之间的导电接触部分的周围填充有用热硬化性树脂等构成并硬化的密封树脂122。
[电子部件]
图3是本实施形态的电子部件的电极构造的说明图，图3(a)是相当于图2的B部分的扩大图，图3(b)是电子部件的底视图。电子部件121，是例如构成为在硅基板上边形成有适宜的电路的集成电路芯片。在电子部件121的表面(图示下表面)上边形成有由铝等构成的焊盘24。该焊盘24沿着电子部件121的周缘部分排列形成。在焊盘24的表面上形成有由SiN等的绝缘材料构成的钝化膜等的保护膜26。从而，借助于在该保护膜26上形成的开口27，构成与焊盘24之间的电连接部22。
此外，在保护膜26的表面上，形成有树脂突起12。该树脂突起12，采用把聚酰亚胺等的弹性树脂材料涂敷到保护膜26的表面上，进行光刻等的图形化处理的办法形成。通过进行使用灰掩模(グレ一マスク)的光刻，把树脂突起12形成为半球状。在本实施形态中，靠近连接部22地形成多个树脂突起12。在图3中，把连接部22夹在中间在其两侧形成有树脂突起12a、12b。
此外，在树脂突起12a、12b的表面上，形成有导电膜20。该导电膜20可以采用借助于蒸镀或溅射等使Au、Cu、Ni等的导电性金属成膜，进行适宜的图形化处理的办法构成。此外，也可以再用镀金等把由Cu、Ni、Al等构成的基底的导电膜的表面被覆起来，提高导电接触性。
借助于如上所述地构成的树脂突起12a、12b和导电膜20，在电子部件121的表面上形成半球状的凸点电极10a、10b。另外，凸点电极并不限于半球状，也可以做成为圆锥台形状、角锥台形状、圆柱状、棱柱状等。在该情况下，可以把树脂突起形成为上述各个形状，然后在其表面上形成导电膜。
此外，导电膜20从树脂突起12a、12b的表面向连接部22延伸。借助于此，就变成为多个凸点电极10a、10b与1个焊盘24导电连接的状态。
[安装结构体]
图4是本实施形态的电子部件的安装结构的说明图，是图2的B部分的扩大图。电子部件121，通过由热硬化性树脂构成的密封树脂122安装到基板111上。电子部件121的安装，采用把薄膜状或薄片状的密封树脂122配置到基板111上，然后在该基板111上一边加热电子部件121同时进行加压的办法进行。在该情况下，电子部件121的凸点电极10挤开密封树脂122前进，接触到基板111上的端子111bx。然后采用对电子部件加压的办法，使树脂突起12溃缩发生弹性变形。然后，如果在该状态下继续加热使密封树脂122热硬化，则电子部件121与基板111之间的相对位置就被固定起来，就可以以树脂突起12弹性变形后的状态进行保持。如此，即使是伴随着温度变化热硬化性树脂22b进行热膨胀，由于凸点电极10与端子111bx之间的导电接触状态得以保持，故可以使电子部件121相对基板111可靠地进行导电连接。
另外，用玻璃等构成的基板111和用ITO等构成的端子111bx都是透明的，故可以从基板111的背面观看凸点电极10的顶部与端子111bx之间的接触面。由于凸点电极10形成为半球状，故由于与端子111bx之间的接触而会出现接触面。该接触面的直径将与凸点电极10的弹性变形量成比例地进行增减。因此，通过从基板111的背面观察接触面的有无、形状、宽度等，就可以容易地知道凸点电极10与端子111bx之间的接触状态。
然而，当在树脂突起12的表面上形成金属导电膜20的情况下，与在金属构件的表面上形成金属导电膜的情况比较，金属导电膜20的结合性降低。假定在金属导电膜20从树脂突起12的表面上剥离下来的情况下，就存在着凸点电极10与端子111bx之间的导电连接变成为不可能的可能性。
于是，在图3所示的本实施形态的电子部件中，做成为对于1个焊盘24导电连接多个凸点电极10a、10b的构成。除此之外，在图4所示的本实施形态的安装结构体中，构成为把电子部件121的多个凸点电极10a、10b导电连接到对方一侧基板111上的1个端子111bx上。倘采用该构成，则即使是在图3所示的多个凸点电极10a、10b中的1个凸点电极(例如10a)中导电膜20剥离下来的情况下，也可以借助于导电连接到同一焊盘24上的别的凸点电极(例如10b)确保电子部件121与图4所示对方一侧基板111的端子111bx之间的导电连接。因此，可以提供可以确保电子部件121与对方一侧基板111之间的导电连接，冗余性优良的电子部件和安装结构体。
此外，由于构成为多个凸点电极10a、10b导电连接到对方一侧基板111上的1个端子111bx上，故还可以减小导电连接部的电阻。
[实施形态2]
其次，用图5对本发明的实施形态2进行说明。
图5是实施形态2的电子部件的电极构造的说明图，是相当于图2的B部分的扩大图。实施形态2的电子部件，在借助于多个电连接部22x、22y、22z把1个凸点电极(例如10a)连接到焊盘4上这一点，与实施形态1不同。另外，对于与实施形态1同样的构成的部分，赋予同一标号而省略详细的说明。
在实施形态2的电子部件中，在形成于焊盘24的表面上的保护膜26上，形成有多个开口27。如此，构成有对应焊盘24的连接部22x、22y、22z。
此外，在保护膜26的表面上还形成有半球状的树脂突起12。在图5中，在各个连接部22x、22y、22z之间分别配置有树脂突起12a、12b。
此外，形成有1个导电膜20以使其把所有的树脂突起12a、12b的表面都被覆起来。从而用树脂突起12a、12b和导电膜20构成凸点电极10a、10b。
除此之外，从树脂突起12a、12b的表面开始向所有的连接部22x、22y、22z延伸地设置有导电膜20。借助于此，凸点电极10a在多个连接部22x、22y、22z中就变成为导电连接到焊盘24上的状态。此外，凸点电极10b在多个连接部22x、22y、22z中也变成为导电连接到焊盘24上的状态。
此外，上述连接部22x、22y、22z使通过在焊盘24的表面上形成的由绝缘材料构成的保护膜开口而形成为此，当在连接部上剩有保护膜的情况下等，在焊盘24的表面上附着有绝缘材料的情况下，就存在着连接部处的焊盘24与导电膜20之间的导电连接会成为不可能的可能性。
但是，在本实施形态的电子部件中，构成为各个凸点电极10a、10b在多个连接部22x、22y、22z中导电连接到焊盘24上。倘采用该构成，则即使是在多个连接部中的1个连接部(例如22x)变成为不能导电的情况下，也可以借助于别的连接部(例如22y、22z)确保焊盘24与凸点电极10a、10b之间的导电连接。此外，由于把该凸点电极10a、10b导电连接到对方一侧基板的端子上，故可以确保电子部件121与对方一侧基板之间的导电连接。因此，可以提供冗余性优良的电子部件和安装结构体。
[实施形态3]
其次，用图6对本发明的实施形态3进行说明。
图6是实施形态3的电子部件的电极构造的说明图，图6(a)是与图2B部分相当的部分的扩大图，图6(b)是电子部件的底视图。实施形态3的电子部件，在树脂突起12(12r、12s)被形成为线状的连续突条这一点，以及导电膜20分离形成多个(20a、20b)，且分别导电连接到焊盘24上这一点上，与实施形态1、2不同。另外，对于那些构成与实施形态1和2同样的部分，赋予同一标号而省略其详细的说明。
在实施形态3的电子部件中，树脂突起12r、12s沿着焊盘24的排列方向被形成为线状的连续突条。与该树脂突起12r、12s的连续方向垂直的方向上的截面被做成为半圆状。这样的突条的树脂突起，与半球状的树脂突起比较，可以精度良好地形成高度尺寸。为此，通过使用突条的树脂突起12r、12s形成凸点电极，就可以制作成电连接可靠性优良的电子部件。
而在树脂突起12r、12s的两侧形成保护膜26的开口，构成与焊盘24之间的连接部22w、22x、22y、22z。
此外，在实施形态3的电子部件中，导电膜被分离成多个，形成有导电膜20a、20b。各个导电膜在树脂突起12r、12s的表面上形成。用该树脂突起12r、12s和导电膜20a、20b构成凸点电极10a、10b。
此外，各个导电膜20a、20b，从树脂突起12r、12s的表面开始延伸设置到配置在该树脂突起的两侧的连接部22w、22x、22y、22z。借助于此，与实施形态2同样，就变成为把1个凸点电极10a在多个连接部22w、22x中导电连接到焊盘24上的状态。此外，1个凸点电极10b也变成为在多个连接部22y、22z中导电连接到焊盘24上的状态。
然后，把在电子部件121上形成的多个凸点电极10a、10b导电连接到对方一侧基板111的1个端子111bx上(参看图4)。
然而，就如在实施形态1中所述的那样，当在树脂突起12的表面上形成金属导电膜20的情况下，金属导电膜20的结合性降低，存在着金属导电膜20从树脂突起12的表面上剥离下来的可能性。但是，在实施形态3的电子部件中，构成为在树脂突起12r、12s的表面上设置彼此分离开来的多个导电膜20a、20b。除此之外，还构成为电子部件的多个凸点电极10a、10b导电连接到对方一侧基板111的1个端子111bx上(参看图4)。借助于此，即使是1个导电膜(例如20a)从树脂突起上剥离开来，也可以借助于导电连接到同一焊盘24上的别的导电膜(例如20b)来确保与对方一侧基板的端子之间的导电连接。因此，可以提供可以确保电子部件与对方一侧基板之间的导电连接、冗余性优良的电子部件和安装结构体。
此外，就如在实施形态2中所述的那样，在连接部的焊盘24的表面上附着有绝缘材料的情况下，存在着焊盘24与导电膜20之间的导电连接变成为不可能的可能性。但是，在实施形态3的电子部件中，已构成为各个凸点电极(例如10a)在多个连接部(例如22w、22x)中导电连接到焊盘24上。倘采用该构成，即使是多个连接部之中的1个连接部(例如22w)变成为不能导通的情况下，也可以借助于别的连接部(例如22x)确保焊盘24与凸点电极(10a)之间的导电连接。从而，就可以采用把该凸点电极(10a)导电连接到对方一侧基板的端子上的办法，确保电子部件与对方一侧基板之间的导电连接。因此，可以提供冗余性优良的电子部件和安装结构体。
另外，在图6所示的实施形态3中，虽然树脂突起12r、12s被形成为沿着焊盘24的排列方向的线状的连续突条，但是，如图7所示，也可以除去不存在导电膜20a、20b的部分的树脂突起12r、12s，把每一个突起分离开来。具体地说，首先，与实施形态3同样，把树脂突起12r、12s形成为突条，在其表面上形成多个导电膜20a、20b。其次，进行把氧气当作处理气体的等离子蚀刻。由于由金属材料构成的导电膜20a、20b比树脂材料难于干刻，故可以选择性地仅仅除去导电膜20a、20b的非形成区域上的树脂突起12r、12s。
然而，如图4所示，电子部件121通过由热硬化性树脂构成的密封树脂122安装到基板111上。这时，只要预先除去突条的树脂突起的一部分，就可以确保密封树脂122的流动。借助于此，就可以相对于对方一侧基板111可靠地安装电子部件121。
[电子设备]
图8的透视图示出了本发明的电子设备的一个例子。该图所示的移动电话1300构成为作为小尺寸的显示部1301具备上述电光装置，具备多个操作按键1302，受话器口1303和送话口1304。
上述电光装置，并不限于移动电话，也可以优选地作为电子书籍、个人计算机、数字静态照相机、液晶电视、取景器型或监视器直视型的磁带录像机、汽车导航装置、呼机、电子记事簿、计算器、文字处理器、工作站、电视电话、POS终端和具备触摸面板的设备等的图像显示装置使用，不论在哪一种情况下，都可以提供电连接的可靠性优良的电子设备。
另外，本发明的技术范围，并不限于上述各个实施形态，包括在不偏离本发明的宗旨的范围内，对上述实施形态加以种种的变更的形态。就是说，在各个实施形态中所举出的具体的材料或构成只不过是一个例子，适宜变更是可能的。

Claims (10)

1.一种电子部件，它具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其中通过上述导电膜与对方一侧基板导电连接，其特征在于：
对于1个上述焊盘形成有多个上述树脂突起。
2.一种电子部件，它具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其中通过上述导电膜与对方一侧基板导电连接，其特征在于：
对于1个上述焊盘，上述导电膜具有多个上述电连接部。
3.一种电子部件，它具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其中通过上述导电膜与对方一侧基板导电连接，其特征在于：
对于1个上述焊盘，具有多个上述树脂突起和上述导电膜具有的多个上述电连接部。
4.一种电子部件，它具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其中通过上述导电膜与对方一侧基板导电连接，其特征在于：
对于1个上述焊盘，具有多个上述树脂突起和多个上述导电膜分别具有的多个上述电连接部。
5.根据权利要求1到4中的任何一项所述的电子部件，其特征在于：上述树脂突起形成为线状连续的突条。
6.根据权利要求1到4中的任何一项所述的电子部件，其特征在于：上述树脂突起被形成为：在形成了线状连续的突条后，仅仅分离成上述多个导电膜的形成区域。
7.根据权利要求1到4中的任何一项所述的电子部件，其特征在于：上述树脂突起被形成为半球状。
8.一种构成为把电子部件安装到对方一侧基板上的安装结构体，其中，所述电子部件具备：在有源面上形成的焊盘、在保护上述焊盘的保护膜上形成的树脂突起、和在上述树脂突起的表面上形成的具有与上述焊盘的电连接部的导电膜，其特征在于：
导电连接到一个上述焊盘上的上述导电膜，被导电连接到上述对方一侧基板的一个电端子上。
9.一种电光装置，其特征在于：如权利要求1-7中任一项所述的电子部件安装在构成电光面板的基板上和/或电路基板上。
10.一种电子设备，其特征在于：具备权利要求9所述的电光装置。
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