CN1819169A - 电子部件、电光学装置及电子机器 - Google Patents

电子部件、电光学装置及电子机器 Download PDF

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Publication number
CN1819169A
CN1819169A CNA2006100513898A CN200610051389A CN1819169A CN 1819169 A CN1819169 A CN 1819169A CN A2006100513898 A CNA2006100513898 A CN A2006100513898A CN 200610051389 A CN200610051389 A CN 200610051389A CN 1819169 A CN1819169 A CN 1819169A
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Prior art keywords
electronic unit
substrate
resin projection
chip substrate
resin
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CN100470780C (zh
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加藤洋树
田中秀一
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Seiko Epson Corp
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Seiko Epson Corp
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Abstract

一种电子部件，具有：在矩形的芯片基板(50)的能动面(50A)的一侧设置的凸垫(24)，沿着芯片基板(50)中的周边的各边设置的树脂突起(12)，由与所述凸垫(24)电连接、而且达到树脂突起(12)的表面的导电膜(20)形成的导电部(10)。而且，树脂突起(12)，由线状连续的突条体构成；在芯片基板(50)的至少1个边上，在该边的中央部形成间隙(S)地设置多个树脂突起(12)。提供既具有良好的树脂排出性，又不需要进行等离子体处理的可靠性高的电子部件、电光学装置及电子机器。

Description

电子部件、电光学装置及电子机器
技术领域
本发明涉及电子部件、电光学装置及电子机器。
背景技术
在现有技术的被各种电子机器搭载的电路基板及液晶显示装置等中，广泛采用了安装半导体IC等电子部件的技术。例如：在液晶显示装置中，安装着旨在驱动液晶屏的液晶驱动用的IC芯片(电子部件)。该IC芯片，有的直接安装在构成液晶屏的玻璃基板上，还有的安装在安装着液晶屏的挠性基板(FPC)上。可是，近几年来，伴随着电子机器的小型化，要求安装在它们中的IC芯片的小型化及窄间距化。
例如，在形成半导体元件的IC芯片的能动面上，设置用与电极连接的导电膜覆盖的树脂突起，在树脂具有的弹性力的作用下，压接结合后，能够减少热应力，实现IC芯片的高可靠性。因此，采用等离子体处理除去所述树脂突起之间，从而实现所述树脂突起的窄间距化的技术应运而生(例如，参照专利文献1)。
可是，在形成所述的树脂突起之际，采用等离子体处理后，由于等离子体形成的天线比(アンテナ比)的问题，在IC芯片上形成的布线部分带电(充电)，造成晶体管的特性变化。这样，晶体管的特性变化后，有可能导致IC芯片不良、制造成品率下降。
因此，考虑采用以下方法：沿着构成IC芯片的芯片基板的能动面一侧的四个边的各边，设置线状连续的树脂突起，在该树脂突起的表面上，设置多个由与IC芯片的凸垫连接的导电膜构成的导电部。这样，不进行形成所述树脂突起之间的等离子体处理、利用多个所述导电部实现窄间距化。此外，所述树脂突起，是只在成为所述IC芯片的四角的端部设置间隙的状态。
【专利文献1】特开2004-186333号公告
可是，在将这种具有线状连续的树脂突起的IC芯片安装到基板上之际，通常在所述基板的安装面上，设置厚度比所述树脂突起厚的树脂，然后一边压接·加热一边将所述IC芯片安装到基板上。于是，设置在所述IC芯片上的树脂突起，就推开(挤开)所述树脂。被推开的树脂，就从上述树脂突起之间的间隙，向IC芯片的外部排出。
这样，所述IC芯片被压接到基板上后，所述树脂突起以受损的状态，与所述基板的电极导电，在该状态下，使所述树脂硬化后，IC芯片就被安装到基板上。
可是，与设置了所述树脂突起之间的间隙的芯片基板的端部相比，不设置所述树脂突起之间的间隙的芯片基板的周边的中央部，不能良好地排出树脂。就是说，在设置了所述树脂突起之间的间隙的芯片基板的端部，与所述的芯片基板的中央部相比，所述树脂的排出量增多。这样，沿着所述芯片基板的周边设置的树脂突起，由于中央部和端部的树脂排出性的差异，使所述树脂突起不能被均匀地压扁。所以，将IC芯片安装到基板上时，导电性就随着IC芯片的位置而变，难以获得该IC芯片的可靠性。
发明内容
本发明就是针对上述情况研制的，其目的在于提供既具有良好的树脂排出性，又不需要进行等离子体处理的可靠性高的电子部件、电光学装置及电子机器。
本发明的电子部件，其特征在于，具有：在矩形的芯片基板的能动面的一侧设置的凸垫，沿着所述芯片基板中的周边的各边设置的树脂突起，由与所述凸垫电连接、而且达到所述树脂突起的表面的导电膜形成的导电部；所述树脂突起，由线状连续的突条体构成；在所述芯片基板的至少1个边上，在该边的中央部形成间隙地设置多个所述树脂突起。
采用本发明的电子部件后，例如通过厚度比所述树脂突起厚的树脂做媒介，将电子部件安装到基板上时，所述树脂突起推开、压坏所述树脂后，使所述基板的连接端字和所述树脂突起的表面上设置的导电部成为导通的状态。这时，由于在芯片基板的至少1个边上，在该边的中央部形成间隙地设置多个所述树脂突起，所以所述树脂就能够从所述树脂突起的间隙排出。因此，提高了所述电子部件的中央部中的树脂的排出性，能够在所述芯片基板的中央部及端部中均匀地排出树脂。这样，就能够使所述树脂突起成为被均匀地压坏的状态，提高了所述导电部和所述连接端子的贴紧性，成为可靠性高的电子部件。
另外，例如采用光刻蚀法等布图处理形成所述树脂突起，不需要等离子体处理，能够防止由等离子体处理导致的电子部件的晶体管的特性变化，成为可靠性高的电子部件。
另外，在所述电子部件中，最好沿着所述芯片基板中的周边的各边，在各边的中央部形成间隙地设置多个所述树脂突起。
这样，如前所述，在安装电子部件之际，能够从芯片基板的周边切实地排出树脂，能够将提高了树脂排出性的电子部件安装到所述的对方基板上。因此，成为电子部件的可靠性更高的产品。
另外，在所述电子部件中，所述树脂突起最好在与所述芯片基板的周边正交的方向设置多列。
这样，能够增加与凸垫连接的导电部的数量，在安装电子部件之际，即使一个导电部不能导通时，也能利用其它导电部与所述的对方基板的端子导通。因此，成为电子部件的安装时的可靠性更高的产品。
另外，在所述电子部件中，所述树脂突起最好沿着所述芯片基板的周边，交错状地配置。
这样，不会使树脂突起及在该树脂突起的表面上形成的导电部的数量变化，能够增大树脂突起的端部之间的间隙，提高上述电子部件安装时的树脂的排出性。
另外，在所述电子部件中，所述树脂突起最好对于和所述芯片基板的周边正交的方向，使所述树脂突起的端部的一部分重叠地配置。
可是，在芯片基板上不重叠地配置所述树脂突起的端部的一部分时，在所述树脂突起的间隙中，不能形成所述导电部。因此，采用本发明后，由于对于和所述芯片基板的周边正交的方向，具有树脂突起的端部的重叠部位，所以就在该重叠部位上形成导电部。这样，可以不减少所述树脂突起的间隙的数量，有效的利用树脂突起，能够维持前文讲述的电子部件安装时的树脂的排出性。
采用本发明的电光学装置后，其特征在于：所述的电子部件，安装在构成电光学屏的基板上及电路基板上的至少一个上。
采用本发明的电光学装置后，如前所述，具有良好的导通性，具有不需要进行等离子体处理的可靠性高的电子部件，因此具有它的电光学装置也成为可靠性高的产品。
采用本发明的电子机器后，其特征在于：具有所述的电光学装置。
采用本发明的电光学装置后，因为具有前文讲述的可靠性高的电光学装置，因此具有它的电子机器也成为可靠性高的产品。
附图说明
图1是第1实施方式涉及的电子部件的俯视图。
图2是图1中的A部分的主要部位的放大图。
图3是图2中的A-A线的电子部件的侧剖面图。
图4是第1实施方式涉及的电子部件的安装结构的说明图。
图5是第2实施方式涉及的电子部件的俯视图。
图6是第3实施方式涉及的电子部件的俯视图。
图7是液晶显示装置的示意立体图。
图8是表示手机的立体图。
具体实施方式
下面，讲述本发明的电子部件、电光学装置及电子机器。
首先，讲述本发明的电子部件中的第1实施方式。图1是本实施方式中的电子部件121的俯视图。
如图1所示，电子部件121具有：例如由硅构成的矩形的芯片基板50，和在该芯片基板50的形成集成电路的能动面50A一侧设置的、用铝等构成的矩形的凸垫24。另外，所述凸垫24，如图1中的虚线所示，沿着电子部件121的外周边缘部被设置多个。而且，在所述芯片基板50中，沿着该芯片基板50的能动面50A一侧的四边(周边)的各边，形成由线状连续的突条体构成的树脂突起12。在所述树脂突起12的表面，形成与所述凸垫24电连接的导电膜20。而且，由该导电膜20和所述树脂突起12，构成后文讲述的凸台电极(导电部)10。
所述树脂突起12，在所述芯片基板50的各边的中央部形成间隙地设置。另外，由于所述树脂突起12沿着所述芯片基板50的各边形成，所以在芯片基板50的各边的端部，一定会成为形成有间隙的状态。
具体地说，在本实施方式中，所述树脂突起12，在所述各凸垫24上设置，沿着所述凸垫24的排列方向配置。因此，在相邻的凸垫24上形成的所述树脂突起12之间，就在与该芯片基板50的外边正交的方向上，产生间隙S。因此，如图1所示，所述树脂突起12被在所述芯片基板50的四边的各边的中央部形成间隙S地配置。
另外，本实施方式的树脂突起12，在与所述芯片基板50的各边正交的方向上，形成2列。
此外，不必始终在所述凸垫24上形成所述树脂突起12，如果至少在所述芯片基板50的外边的中央部产生间隙S地配置，那么例如沿着各边，在相邻的凸垫24上形成也行。另外，沿着所述芯片基板50的四边，同样在各边的中央部产生间隙地形成多个所述树脂突起12。但如果至少在一个边上形成所述树脂突起12后，就能够使后文讲述的树脂的排出性足够好。
图2是用图1中的点划线A所示的部分中的所述电子部件121的电极结构的主要部位的放大图。另外，图3是图2中的A-A线观察的剖面图。
如图3所示，在所述凸垫24的表面，形成例如由SiN等绝缘材料构成的钝化膜等的保护膜26。然后，利用该保护膜26形成的开口，构成可以与凸垫24电连接的连接部22w、22x、22y、22z。
而且，在所述保护膜26的表面，形成树脂突起12。在本实施方式中，如前所述，在凸垫24上形成两列树脂突起12r、12s。该树脂突起12r、12s，例如在保护膜26的表面涂敷聚酰亚胺等弹性树脂材料，进行光刻蚀法等的布图处理后形成。此外，在本实施方式中，通过使用灰掩膜的光刻蚀法，从而使树脂突起12r、12s半球状地形成。这样，通过光刻蚀法等的布图处理形成树脂突起，能够防止由等离子体处理导致的电子部件的晶体管的特性变化。
如图2所示，与所述树脂突起12r、12s的线状方向垂直的方向中的断面，形成半圆形。这种突条的树脂突起，其高度尺寸能够高精度地形成。
而且，在所述树脂突起12r、12s的表面，如图2、图3所示，形成导电膜20。该导电膜20可以通过蒸镀及溅射Au、Cu、Ni等导电金属后成膜，再采用适当的布图处理后构成。另外，再用Au电镀等覆盖由Cu、Ni、Al等构成的基底的导电膜的表面，还能够提高导电接触性。
利用所述树脂突起12r、12s和所述导电膜20，就如图3所示，在所述芯片基板50上，形成半圆板状的凸台电极(导电部)10a、10b。
此外，本实施方式中的所述导电膜20，形成以所述凸台电极10a、10b为单位而被分割的状态。构成所述凸台电极10a、10b的各导电膜20a、20b，从树脂突起12r、12s的表面，延伸设置到在该树脂突起12的两侧配置的连接部22w、22x、22y、22z。这样，一个凸台电极10a成为在多个连接部22w、22x中与凸垫24导电连接的状态。另外，其它的凸台电极10b也成为在多个连接部22y、22z中与凸垫24导电连接的状态。
而且，在电子部件121上形成的多个凸台电极10a、10b，如后文所述，成为能够与基板的端子导电连接地安装。
可是，在所述树脂突起12r、12s的表面，形成所述导电膜20时，与通常的接合形态——金属间的合金连接相比，连接强度较低。假如导电膜20从树脂突起12的表面剥离时，凸台电极10与后文讲述的安装的基板的端子之间就有导电连接不良的危险。
因此，本实施方式中的电子部件121，采用在树脂突起12r、12s的表面，设置相互分离的多个导电膜20a、20b的结构。这样，就成为将电子部件121中的多个凸台电极10a、10b与安装的基板的端子导电连接的结构。所以，即使一个导电膜(例如20a)从树脂突起12上剥离，也能利用与相同的凸垫24导电连接的其它的导电膜(例如20b)，确保与对方的基板的端子的导电连接。
此外，所述凸台电极10a、10b，并不局限于半圆形，还可以采用台形、圆锥形等。这时，将树脂突起形成所述各形状后，可在其表面形成导电膜20。
另外，导电膜20，从树脂突起12a、12b的表面延伸设置到连接部22。这样，就形成对一个凸垫24而言，有多个凸台电极10a、10b与其导电连接的状态。
(安装结构体)
接着，讲述将本实施方式中的电子部件121安装到旨在构成后文讲述的电光学装置的基板111上的安装结构。
图4是在基板111上安装电子部件121的安装结构的说明图。
在讲述该安装结构体之际，先讲述将所述电子部件121安装到基板111上的方法。
为了形成所述安装结构体，在本实施方式中，在安装电子部件121之际，作为用于进行保持的树脂，例如使用NCF(Non Conductive Film)122等，安装到基板111上。此外，作为旨在安装电子部件121的树脂，不限于所述NCF122，可以适当使用具有相同效果的树脂层。
这时，预先在安装电子部件121的基板111上设置NCF122。此外，该NCF122，通常比电子部件121形成的凸台电极(树脂突起12)10的厚度厚。另外，该NCF122，比所述电子部件121的能动面50A更宽广地设置后，就可以利用所述NCF122，将所述电子部件121切实安装到基板111上。此外，还可以取代基板111，将所述NCF122贴到所述电子部件121的能动面50A上后，将该电子部件121安装到基板111上。
然后，采用加热加压的方式，将电子部件121安装到所述基板111上。这时，所述电子部件121的凸台电极10，推开NCF122。于是，就成为在所述基板111和所述电子部件121之间的间隙，被所述NCF122充填的状态。在该间隙中成为多余的NCF122，从构成所述凸台电极10的间隙S排出。
在这里，由于在所述树脂突起12之间形成的间隙S，影响NCF122的排出性，所以该间隙S的配置及数量，就影响到安装电子部件121之际的可靠性。具体地说，NCF122的排出性不良的区域，在所述电子部件121和基板111之间介有的NCF122的量就增多，所述电子部件121具备的树脂突起12，对基板111而言，就成为悬浮的状态。于是，正如后文所述，树脂突起12的挤扁量就要减少，凸台电极12与基板111上的电极111bx的贴紧性就要下降。这样，在电子部件121的能动面50A上的NCF122的排出性出现离差后，将电子部件121安装到基板111上时的可靠性就要下降。
本实施方式的电子部件121，是沿着芯片基板50的四边(周边)的各边，如前文所述，具备多个所述树脂突起12的部件。而且，在沿着所述芯片基板50的各边配列而成的树脂突起12之间，形成朝着芯片基板50的四边的各边的正交方向的间隙S。另外，如图3所示，该间隙S在各边的中央部及端部形成，所以电子部件121，将对所述电子部件121和基板111的间隙而言成为多余的NCF122，从该间隙S向基板111上排出。因此，能够切实从所述电子部件121的中央部排出NCF122。另外，在本实施方式中，如图1所示，由于在芯片基板50上，大致均等地设置树脂突起12之间的间隙，所以能够在所述芯片基板50的中央部及端部，均匀地排出所述NCF122。
这样，在基板111上将电子部件121加热加压后，由所述电子部件121的树脂突起12构成的凸台电极10，就与基板111上的端子111bx接触。进一步将电子部件121加热加压后，所述凸台电极10就被挤扁而弹性变形。然后，在这种状态下，停止对所述电子部件121的加热加压。于是，电子部件121和基板111的相对位置被固定，保持树脂突起12弹性变形的形状。这样，即使伴随温度变化，NCF122热膨胀后，也能保持凸台电极10和端子111bx的导电接触状态，所以能够切实地使电子部件121与基板111导电连接。
就是说，通过NCF122做媒介，电子部件121被安装到基板111上。
这时，如图4所示，所述树脂突起12被均匀压扁，在所述树脂突起12上设置的凸台电极10，和在基板111上设置的端子111bx导电接触，所以成为可靠性高的安装结构体。
这时，在本实施方式的电子部件121中，如前所述，成为使多个凸台电极10a、10b与一个凸垫24导电连接的状态。而且，图4所示的安装结构体，将在所述的一个凸垫24上设置的多个凸台电极10a、10b，与对方的基板111的一个端子111bx导电连接。因此，即使多个凸台电极10a、10b中的一个凸台电极(例如10a)中的导电膜20剥离时，也能利用与同一个凸垫24导电连接的其它凸台电极(例如10b)，确保所述凸垫24与基板111的一个端子111bx的导电连接。
另外，因为将多个凸台电极10a、10b与对方的基板111的一个端子111bx导电连接，所以降低了导电连接部的电阻。
可是，如前所述，电子部件121通过NCF122做媒介，被安装到基板111上。这时，如图2所示，削去没有形成导电膜20的树脂突条12的表面的一部分后，该树脂突起12的厚度变薄，在基板111和树脂突起12之间，就形成间隙，利用该间隙，还可以提高NCF122的排出性。
作为形成所述间隙的具体方法，如图2所示，将O2气体作为处理气体，通过不使电子部件121形成的晶体管特性变化的强度的等离子体腐蚀，削去没有形成导电膜20a、20b的树脂突起12r、12s的一部分。此外，本发明中的所谓“不需要等离子体处理”，是指只要是不使电子部件121形成的晶体管特性变化的强度的等离子体处理，就可以适当采用。
这时，由金属材料构成的导电膜20a、20b，与树脂材料相比，不易被干腐蚀，所以能够有选择地只除去导电膜20a、20b的非形成区域中的树脂突起12r、12s。
因此，成为提高了NCF122的排出性的、可靠性高的电子部件。
采用本发明的电子部件121后，通过厚度比树脂突起12厚的NCF122做媒介，安装到基板111上之际，所述树脂突起12推开、压扁所述NCF122后，使所述基板111上的端子111bx和所述树脂突起12上设置的凸台电极导通。这时，在芯片基板50的至少一个边上，多个所述树脂突起12被在该边的中央部形成间隙地设置，所以所述NCF122就被从所述树脂突起12的间隙S排出。因此，能够提高在所述电子部件121的中央部中的NCF122的排出性，能够在电子部件121的中央部及端部，均匀地排出NCF122。这样，所述树脂突起12成为被均匀压坏的状态，提高了所述凸台电极12和所述端子111bx的贴紧性，成为可靠性高的电子部件121。
另外，因为通过光刻蚀法等的布图处理形成所述树脂突起12，所以能够防止由等离子体处理导致的电子部件的晶体管的特性变化，成为可靠性高的电子部件121。
(第2实施方式)
下面，使用图5讲述本发明的第2实施方式。
图5是第2实施方式涉及的电子部件的俯视图。第2实施方式的电子部件，除了在所述芯片基板50上形成的树脂突起12的配置不同以外，与所述第1实施方式具有相同的结构。此外，对于成为和所述第1实施方式相同的结构的部分，赋予相同的符号，不再赘述。另外，在图5中，为了使说明简洁，省略了电子部件具有的凸垫24、与该凸垫连接的导电膜20及凸台电极10。
如图5所示，在第2实施方式涉及的电子部件中，所述树脂突起12，沿着矩形的所述芯片基板50的长边，交错状地配置。这时，在芯片基板50的长边的中央部形成间隙S地配置所述树脂突起12。此外，本实施方式中的所谓“在中央部设置的间隙S”，是排出所述芯片基板50的中央部分中的树脂(NCF122)的间隙。
另外，在该树脂突起12的表面，和所述第1实施方式一样，设置未图示的导电膜20，构成凸台电极10。
如本实施方式这样，交错状地在芯片基板50上形成所述树脂突起12时，与沿着芯片基板50的长边方向直线状地配置多个树脂突起12时相比，能够扩大相邻的树脂突起12之间的最小距离，加大其间隙。因此，和所述第1实施方式一样，通过NCF122做媒介，将所述电子部件121安装到基板111上时，能够进一步提高NCF122的排出性。因此，本实施方式的电子部件，成为安装时的可靠性高的产品。
此外，在本实施方式中，交错状地配置在芯片基板50的长边方向上形成的树脂突起12，但是交错状地配置沿着短边方向形成的树脂突起12时，也能够进一步提高NCF122的排出性。另外，在所述电子部件121上形成的树脂突起12，如前所述，还可以沿着芯片基板50的四边中的一个边交错状地配置。另外，增加交错状地配置的树脂突起12的数量后，还可以增加凸台电极10的数量，能够在不影响NCF122的排出性的前提下，进一步提高电子部件的连接可靠性。
(第3实施方式)
下面，使用图6讲述本发明的第3实施方式。
图6是第3实施方式涉及的电子部件的俯视图。第3实施方式的电子部件，除了在所述芯片基板50上形成的树脂突起12的配置位置不同以外，与所述第1实施方式及第2实施方式具有相同的结构。此外，对于成为和所述第1实施方式相同的结构的部分，赋予相同的符号，不再赘述。另外，在图6中，为了使说明简洁，省略了电子部件具有的由凸垫24及与该凸垫连接的导电膜20构成的凸台电极10。
如图6所示，树脂突起12，沿着芯片基板50的外边形成，沿着所述芯片基板50的长边，朝着与该芯片基板50的长边正交的方向，使所述树脂突起12的端部的一部分重叠地配置。另外，在该树脂突起12的表面，和所述第1实施方式一样，设置未图示的导电膜20，构成凸台电极10。此外，本实施方式中的所谓“在芯片基板50的周边的中央部设置的间隙S”，是排出所述芯片基板50的中央部分中的树脂(NCF122)的间隙。
这样，所述树脂突起12的端部的一部分重叠地形成后，例如直线状配置树脂突起12、在芯片基板50上不重叠地形成所述树脂突起12的端部的一部分时，在成为相邻的树脂突起12的间隙S的位置上，就不能形成凸台电极10。因此，在本实施方式中，在与所述芯片基板50的周边正交的方向中，使树脂突起12的端部的一部分重叠地形成。这时，在所述树脂突起12的端部重叠的部分，相邻的树脂突起12，形成沿着芯片基板50的周边的间隙。
此外，在成为所述的间隙的部分中，形成导电膜20。可是，该导电膜20的厚度，远比所述树脂突起12的厚度薄，所以NCF122能够在该间隙及导电膜20上通过，良好地向基板111的外面排出。另外，所述的间隙，如前所述，是沿着所述芯片基板50的长边方向。但在挤出NCF122等树脂之际，由于等方向扩大，所以能够良好地挤出所述芯片基板50的中央部的NCF122。
因此，能够有效的利用树脂突起12，维持前文讲述的电子部件安装的时的树脂的排出性。
就是说，由于沿着所述芯片基板50的长边方向配置的所述树脂突起12，不向与所述长边正交的方向形成间隙，所以能够提高沿着所述芯片基板50的长边方向，形成凸台电极10的位置的自由度。
采用本实施方式的电子部件后，因为能够在所述树脂突起12的端部中的重叠的部位形成凸台电极10，所以树脂突起12之间的间隙不会减少，NCF122的排出性不变化。另外，如前所述，树脂突起12的端部不重叠时，对于成为间隙的部分，也能够形成凸台电极10，能够有效地使用树脂突起12。
此外，本发明的电子部件，并不局限于所述的实施方式，可以有各种变更。例如：在所述实施方式中，在各凸垫24上形成的树脂突起12上形成多个凸台电极10。但也可以在各凸垫24上形成所述凸台电极10，进行电子部件121的窄间距化。
下面，讲述具有本发明的电子部件的电光学装置。
图7是表示电光学装置的一种实施方式——液晶显示装置的示意图。图7中的符号100，是液晶显示装置。该液晶显示装置100，具有液晶屏110和作为液晶驱动用IC芯片的本发明的例如第1实施方式的电子部件121。另外，根据需要，还可以适当设置未图示的偏光板、反射片、背景灯等附属部件。
(电光学装置)
液晶显示屏110，具有由玻璃及塑料等构成的所述基板111及112。所述基板111和相对基板112互相相对配置，在未图示的密封材料等的作用下，互相贴在一起。在基板111和相对基板112之间，封入未图示电光学物质——液晶。在该基板111的内壁上，形成用ITO(Indium Tin Oxide)等透明导体构成的电极111a；在相对基板112的内壁上，形成与所述电极111a相对配置的电极112a。此外，电极111a及电极112a正交地配置。然后，电极111a及电极112a被向基板伸出部111T抽出，在其端部分别形成电极端子111bx及电极端子111cx。另外，在基板伸出部111T的端部的边缘附近，形成输入布线111d；在其内端部，还形成端子111dx。
在基板伸出部111T上，例如通过前文讲述的NCF122做媒介，安装电子部件121。该电子部件121，例如是驱动液晶屏110的液晶驱动用IC芯片。在电子部件121的下面，形成未图示的多个凸台。这些凸台分别与基板伸出部111T上的端子111bx、111cx、111dx导电连接。
图7中的A-A线的侧面剖面，与前文讲述的表示将电子部件121安装到基板111上的安装结构体的图4对应。
如图4所示，该电子部件121，与在能动面一侧设置的凸垫24连接的多个凸台电极10的前端，与所述基板111的端子111bx、111dx直接导电接触后安装。这时，在所述凸台电极10和所述端子111bx、111dx之间的导电接触部分的周围，充填NCF122。
因此，如前所述，由于NCF122的排出性高，所以所述电子部件121使所述凸台电极10和所述端子111bx稳定地导通。
另外，在输入布线111d的外端部形成的输入端子111dy，通过各向异性导电膜124做媒介，被安装挠性布线基板123上。输入端子111dy，与挠性布线基板123上设置的、分别对应的未图示的布线导电连接。然后，通过挠性布线基板123，从外部向输入端子111dy供给控制信号、图象信号、电源电位等，在电子部件121中生成液晶驱动用的驱动信号，供给液晶屏110。
这样，本实施方式的液晶显示装置100，通过所述电子部件121，在电极111a及电极112a之间外加适当的电压后，能够使两电极111a、112a相对配置的象素部分的液晶重新取向后，对光进行调制。这样，能够在液晶屏110内的排列象素的显示区域形成所需的图象。
采用本发明的液晶显示装置100后，如前所述，具有良好的导电性，具有不需要进行等离子体处理的可靠性高的电子部件121。所以具备它的液晶显示装置100，也成为可靠性高的产品。
(电子机器)
图8是表示本发明涉及的电子机器的一个示例的立体图。该图所示的手机300，作为小尺寸的显示部310，具有所述的电光学装置，还具有多个操作按钮302、听筒303及话筒304。
上述电光学装置，并不局限于所述的手机，还可以列举电子书、个人用电子计算机、数码相机、液晶电视机、取景器型或监视型的视频磁带录像机、导航装置、页式阅读机、电子笔记本、电子计算器、文字处理机、工作站、可视电话、POS终端、具有触摸屏的电子产品等，能够作为图象显示单元适当使用，都能够提供电连接的可靠性优异的电子机器。
采用本发明的手机300，因为具有前文讲述的可靠性高的电光学装置，所以具有上述装置的手机300也可靠性高。
此外，本发明的技术范围，并不局限于以上讲述的各实施方式，在不违背本发明的宗旨的范围内，包含对上述实施方式进行各种变更。就是说，各实施方式列举的具体的材料及结构等，只不过是一个示例，可以进行适当变更。

Claims (7)

1、一种电子部件，其特征在于，具有：在矩形的芯片基板的能动面侧设置的凸垫、沿着所述芯片基板的周边的各边所设置的树脂突起、以及与所述凸垫电连接而且由达到所述树脂突起的表面的导电膜所形成的导电部；
所述树脂突起，由线状地连续的突条体构成；在所述芯片基板的至少1个边上，以在该边的中央部形成间隙的方式来设置多个所述树脂突起。
2、如权利要求1所述的电子部件，其特征在于：沿着所述芯片基板的周边的各边，以在各边的中央部形成间隙的方式来设置多个所述树脂突起。
3、如权利要求1或2所述的电子部件，其特征在于：所述树脂突起，被在与所述芯片基板的周边正交的方向设置多列。
4、如权利要求1或2所述的电子部件，其特征在于：所述树脂突起，沿着所述芯片基板的周边，交错状地配置。
5、如权利要求1或2所述的电子部件，其特征在于：配置所述树脂突起，使所述树脂突起的端部的一部分在与所述芯片基板的周边正交的方向重叠。
6、一种电光学装置，其特征在于：如权利要求1～5任一项所述的电子部件，安装在构成电光学屏的基板上及电路基板上的至少一个上。
7、一种电子机器，其特征在于：具有权利要求6所述的电光学装置。
CNB2006100513898A 2005-01-14 2006-01-04 电子部件、电光学装置及电子机器 Expired - Fee Related CN100470780C (zh)

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