CN1172285C - 液晶显示器 - Google Patents
液晶显示器 Download PDFInfo
- Publication number
- CN1172285C CN1172285C CNB011440228A CN01144022A CN1172285C CN 1172285 C CN1172285 C CN 1172285C CN B011440228 A CNB011440228 A CN B011440228A CN 01144022 A CN01144022 A CN 01144022A CN 1172285 C CN1172285 C CN 1172285C
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- CN
- China
- Prior art keywords
- piece
- iob
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims description 50
- 239000002245 particle Substances 0.000 description 41
- 102100036464 Activated RNA polymerase II transcriptional coactivator p15 Human genes 0.000 description 25
- 101000713904 Homo sapiens Activated RNA polymerase II transcriptional coactivator p15 Proteins 0.000 description 25
- 229910004444 SUB1 Inorganic materials 0.000 description 25
- 239000010408 film Substances 0.000 description 10
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 229910004438 SUB2 Inorganic materials 0.000 description 8
- 101100311330 Schizosaccharomyces pombe (strain 972 / ATCC 24843) uap56 gene Proteins 0.000 description 8
- 101150018444 sub2 gene Proteins 0.000 description 8
- 230000003321 amplification Effects 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- 244000287680 Garcinia dulcis Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP392324/2000 | 2000-12-25 | ||
JP2000392324A JP3781967B2 (ja) | 2000-12-25 | 2000-12-25 | 表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1361512A CN1361512A (zh) | 2002-07-31 |
CN1172285C true CN1172285C (zh) | 2004-10-20 |
Family
ID=18858330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011440228A Expired - Lifetime CN1172285C (zh) | 2000-12-25 | 2001-12-25 | 液晶显示器 |
Country Status (5)
Country | Link |
---|---|
US (3) | US6678028B2 (zh) |
JP (1) | JP3781967B2 (zh) |
KR (1) | KR100453152B1 (zh) |
CN (1) | CN1172285C (zh) |
TW (1) | TW583485B (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100375310C (zh) * | 1999-12-21 | 2008-03-12 | 造型逻辑有限公司 | 喷墨制作的集成电路 |
JP3756418B2 (ja) * | 2001-02-28 | 2006-03-15 | 株式会社日立製作所 | 液晶表示装置及びその製造方法 |
JP2003046212A (ja) * | 2001-07-27 | 2003-02-14 | Seiko Epson Corp | 電子デバイス並びにその製造方法及びその設計方法、回路基板並びに電子機器 |
TWI292836B (zh) * | 2001-10-31 | 2008-01-21 | Chi Mei Optoelectronics Corp | |
JP3757899B2 (ja) * | 2002-05-07 | 2006-03-22 | 株式会社豊田自動織機 | 駆動用半導体装置及び表示装置ならびに輝度バランス調整方法 |
KR100923056B1 (ko) * | 2002-09-16 | 2009-10-22 | 삼성전자주식회사 | 표시 장치 및 이의 제조방법 |
KR20040075377A (ko) * | 2003-02-20 | 2004-08-30 | 삼성전자주식회사 | 구동 아이씨 및 이를 갖는 디스플레이 장치 |
KR100654338B1 (ko) * | 2003-10-04 | 2006-12-07 | 삼성전자주식회사 | 테이프 배선 기판과 그를 이용한 반도체 칩 패키지 |
JP4651367B2 (ja) * | 2004-05-27 | 2011-03-16 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
KR100669375B1 (ko) | 2004-05-31 | 2007-01-15 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 |
KR101075599B1 (ko) * | 2004-06-23 | 2011-10-20 | 삼성전자주식회사 | 표시장치 |
JP4202300B2 (ja) * | 2004-06-24 | 2008-12-24 | 三菱電機株式会社 | 液晶表示装置及び液晶表示装置の検査方法 |
JP3979405B2 (ja) * | 2004-07-13 | 2007-09-19 | セイコーエプソン株式会社 | 電気光学装置、実装構造体及び電子機器 |
TWI288267B (en) * | 2004-09-03 | 2007-10-11 | Innolux Display Corp | Liquid crystal display panel and method of fabricating the circuit substrate of the liquid crystal display panel |
US11842972B2 (en) | 2004-09-28 | 2023-12-12 | Rohm Co., Ltd. | Semiconductor device with a semiconductor chip connected in a flip chip manner |
JP2006100385A (ja) | 2004-09-28 | 2006-04-13 | Rohm Co Ltd | 半導体装置 |
US7342312B2 (en) | 2004-09-29 | 2008-03-11 | Rohm Co., Ltd. | Semiconductor device |
JP2006106077A (ja) * | 2004-09-30 | 2006-04-20 | Seiko Epson Corp | 電気光学装置及び電子機器 |
KR100720895B1 (ko) * | 2005-07-05 | 2007-05-22 | 제일모직주식회사 | 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물 |
TW200720738A (en) * | 2005-11-18 | 2007-06-01 | Innolux Display Corp | Liquid crystal display panel |
JP5168286B2 (ja) * | 2007-10-26 | 2013-03-21 | 富士通株式会社 | 液晶表示パネル |
TWI373107B (en) * | 2008-04-24 | 2012-09-21 | Hannstar Display Corp | Chip having a driving integrated circuit and liquid crystal display having the same |
US8299631B2 (en) * | 2008-09-01 | 2012-10-30 | Sharp Kabushiki Kaisha | Semiconductor element and display device provided with the same |
JP5395407B2 (ja) * | 2008-11-12 | 2014-01-22 | ルネサスエレクトロニクス株式会社 | 表示装置駆動用半導体集積回路装置および表示装置駆動用半導体集積回路装置の製造方法 |
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
WO2012117960A1 (ja) * | 2011-03-02 | 2012-09-07 | シャープ株式会社 | 半導体素子および表示パネル |
WO2012117959A1 (ja) * | 2011-03-02 | 2012-09-07 | シャープ株式会社 | 半導体素子および表示パネル |
JP2015076486A (ja) * | 2013-10-08 | 2015-04-20 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2015076485A (ja) * | 2013-10-08 | 2015-04-20 | 株式会社ジャパンディスプレイ | 表示装置 |
CN104808358B (zh) * | 2015-04-15 | 2018-03-23 | 深超光电(深圳)有限公司 | 主动元件阵列基板及显示装置 |
WO2016190197A1 (ja) * | 2015-05-22 | 2016-12-01 | シャープ株式会社 | 半導体装置 |
US9960151B2 (en) * | 2016-08-02 | 2018-05-01 | Novatek Microelectronics Corp. | Semiconductor device, display panel assembly, semiconductor structure |
KR20210043790A (ko) * | 2019-10-11 | 2021-04-22 | 삼성디스플레이 주식회사 | 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법 |
CN110706603A (zh) * | 2019-11-19 | 2020-01-17 | 江苏上达电子有限公司 | 一种基于柔性封装基板的高分辨率点阵式电子驱动方法 |
CN111710312B (zh) * | 2020-07-06 | 2021-08-27 | 北京显芯科技有限公司 | 驱动电路、lcd显示屏以及电子设备 |
US20230225051A1 (en) * | 2022-01-11 | 2023-07-13 | Himax Technologies Limited | Display system and a pad configuration adaptable thereto |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0593917A (ja) * | 1991-10-01 | 1993-04-16 | Canon Inc | 液晶パネル用外部回路接続構造の製造方法 |
JPH07235564A (ja) * | 1993-12-27 | 1995-09-05 | Toshiba Corp | 半導体装置 |
JPH07273119A (ja) | 1994-03-29 | 1995-10-20 | Toshiba Corp | 半導体装置 |
TW457287B (en) * | 1997-02-27 | 2001-10-01 | Seiko Epson Corp | Connecting structural body, liquid crystal device, electronic apparatus, anisotropic conductive adhesive and the manufacturing method of the same |
KR100529567B1 (ko) * | 1997-08-08 | 2006-02-08 | 삼성전자주식회사 | 구동집적회로및이를포함하는표시장치 |
KR200301797Y1 (ko) * | 1997-12-17 | 2003-03-31 | 주식회사 현대 디스플레이 테크놀로지 | 액정표시모듈의탭본딩용전극패드 |
KR100551439B1 (ko) * | 1998-09-04 | 2006-05-12 | 삼성전자주식회사 | 엘씨디 모듈 |
KR100551440B1 (ko) * | 1998-09-15 | 2006-05-16 | 삼성전자주식회사 | 칩 온 글라스 타입의 엘씨디 패널 |
JP3730037B2 (ja) * | 1998-11-20 | 2005-12-21 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
JP3808224B2 (ja) * | 1998-12-02 | 2006-08-09 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
JP3826605B2 (ja) * | 1999-03-08 | 2006-09-27 | セイコーエプソン株式会社 | 半導体装置の実装構造の製造方法、液晶装置、および電子機器 |
JP2000276073A (ja) | 1999-03-26 | 2000-10-06 | Toshiba Corp | 平面表示装置 |
JP3649042B2 (ja) * | 1999-05-28 | 2005-05-18 | セイコーエプソン株式会社 | Icチップの接続方法及び液晶装置の製造方法 |
JP2000347206A (ja) | 1999-06-02 | 2000-12-15 | Hitachi Ltd | 液晶表示装置 |
JP2001077154A (ja) * | 1999-09-03 | 2001-03-23 | Rohm Co Ltd | 半導体チップの実装方法、半導体チップの実装構造、およびチップ一体型の液晶表示モジュール |
JP3119357B2 (ja) * | 1999-10-01 | 2000-12-18 | 株式会社日立製作所 | 液晶表示装置 |
-
2000
- 2000-12-25 JP JP2000392324A patent/JP3781967B2/ja not_active Expired - Fee Related
-
2001
- 2001-12-14 TW TW090130993A patent/TW583485B/zh not_active IP Right Cessation
- 2001-12-20 US US10/022,259 patent/US6678028B2/en not_active Expired - Lifetime
- 2001-12-24 KR KR10-2001-0083861A patent/KR100453152B1/ko active IP Right Grant
- 2001-12-25 CN CNB011440228A patent/CN1172285C/zh not_active Expired - Lifetime
-
2004
- 2004-01-08 US US10/752,567 patent/US7068340B2/en not_active Expired - Lifetime
-
2005
- 2005-11-23 US US11/285,144 patent/US7449787B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3781967B2 (ja) | 2006-06-07 |
US6678028B2 (en) | 2004-01-13 |
KR100453152B1 (ko) | 2004-10-15 |
US20040140572A1 (en) | 2004-07-22 |
US7068340B2 (en) | 2006-06-27 |
US20060081997A1 (en) | 2006-04-20 |
US7449787B2 (en) | 2008-11-11 |
TW583485B (en) | 2004-04-11 |
JP2002196353A (ja) | 2002-07-12 |
CN1361512A (zh) | 2002-07-31 |
US20020080318A1 (en) | 2002-06-27 |
KR20020052970A (ko) | 2002-07-04 |
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C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: PANASONIC LCD CO., LTD. Free format text: FORMER OWNER: IPS ALPHA SUPPORT CO., LTD. Owner name: IPS ALPHA SUPPORT CO., LTD. Free format text: FORMER OWNER: HITACHI DEVICE ENGINEERING CO., LTD. Owner name: HITACHI DISPLAY CO., LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20111122 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111122 Address after: Chiba County, Japan Co-patentee after: Panasonic Liquid Crystal Display Co.,Ltd. Patentee after: Hitachi Displays, Ltd. Address before: Chiba County, Japan Co-patentee before: IPS pioneer support society Patentee before: Hitachi Displays, Ltd. Effective date of registration: 20111122 Address after: Chiba County, Japan Co-patentee after: IPS Pioneer Support Society Patentee after: Hitachi Displays, Ltd. Address before: Chiba County, Japan Patentee before: Hitachi Displays, Ltd. Effective date of registration: 20111122 Address after: Chiba County, Japan Patentee after: Hitachi Displays, Ltd. Address before: Chiba County, Japan Co-patentee before: Hitachi Device Engineering Co.,Ltd. Patentee before: Hitachi Displays, Ltd. Effective date of registration: 20111122 Address after: Chiba County, Japan Co-patentee after: Hitachi Device Engineering Co.,Ltd. Patentee after: Hitachi Displays, Ltd. Address before: Tokyo, Japan Co-patentee before: Hitachi Device Engineering Co.,Ltd. Patentee before: Hitachi, Ltd. |
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C56 | Change in the name or address of the patentee |
Owner name: JAPAN DISPLAY, INC. Free format text: FORMER NAME: APAN DISPLAY EAST, INC. Owner name: APAN DISPLAY EAST, INC. Free format text: FORMER NAME: HITACHI DISPLAY CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Chiba County, Japan Patentee after: JAPAN DISPLAY Inc. Patentee after: Panasonic Liquid Crystal Display Co.,Ltd. Address before: Chiba County, Japan Patentee before: Japan Display East Inc. Patentee before: Panasonic Liquid Crystal Display Co.,Ltd. Address after: Chiba County, Japan Patentee after: Japan Display East Inc. Patentee after: Panasonic Liquid Crystal Display Co.,Ltd. Address before: Chiba County, Japan Patentee before: Hitachi Displays, Ltd. Patentee before: Panasonic Liquid Crystal Display Co.,Ltd. |
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CP02 | Change in the address of a patent holder |
Address after: Tokyo, Japan Patentee after: JAPAN DISPLAY Inc. Patentee after: Panasonic Liquid Crystal Display Co.,Ltd. Address before: Chiba County, Japan Patentee before: JAPAN DISPLAY Inc. Patentee before: Panasonic Liquid Crystal Display Co.,Ltd. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20020731 Assignee: BOE TECHNOLOGY GROUP Co.,Ltd. Assignor: JAPAN DISPLAY Inc.|Panasonic Liquid Crystal Display Co.,Ltd. Contract record no.: 2013990000688 Denomination of invention: Power source managemnt system for LCD Granted publication date: 20041020 License type: Common License Record date: 20131016 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20041020 |