CN1344025A - 布线基板、其制造方法、显示装置和电子装置 - Google Patents
布线基板、其制造方法、显示装置和电子装置 Download PDFInfo
- Publication number
- CN1344025A CN1344025A CN01132988A CN01132988A CN1344025A CN 1344025 A CN1344025 A CN 1344025A CN 01132988 A CN01132988 A CN 01132988A CN 01132988 A CN01132988 A CN 01132988A CN 1344025 A CN1344025 A CN 1344025A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- basis material
- integrated circuit
- conductor
- installation region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000278871 | 2000-09-13 | ||
JP278871/2000 | 2000-09-13 | ||
JP278871/00 | 2000-09-13 | ||
JP212079/2001 | 2001-07-12 | ||
JP2001212079A JP3741005B2 (ja) | 2000-09-13 | 2001-07-12 | 配線基板、その製造方法、表示装置および電子機器 |
JP212079/01 | 2001-07-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1344025A true CN1344025A (zh) | 2002-04-10 |
CN1174489C CN1174489C (zh) | 2004-11-03 |
Family
ID=26599938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011329882A Expired - Lifetime CN1174489C (zh) | 2000-09-13 | 2001-09-12 | 布线基板、其制造方法、显示装置和电子装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6486412B2 (zh) |
JP (1) | JP3741005B2 (zh) |
KR (1) | KR100424240B1 (zh) |
CN (1) | CN1174489C (zh) |
TW (1) | TW526569B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103809314A (zh) * | 2012-11-13 | 2014-05-21 | 美格纳半导体有限公司 | 柔性电路板、半导体封装件及制造柔性电路板的方法 |
CN105451402A (zh) * | 2014-08-18 | 2016-03-30 | 力志国际光电股份有限公司 | Oled平面照明装置 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002268079A (ja) * | 2001-03-09 | 2002-09-18 | Seiko Epson Corp | 電気光学装置と電子機器 |
EP1500314A1 (en) * | 2002-04-11 | 2005-01-26 | Koninklijke Philips Electronics N.V. | Electrically insulating body, and electronic device |
JP4720069B2 (ja) | 2002-04-18 | 2011-07-13 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
JPWO2004068445A1 (ja) * | 2003-01-30 | 2006-05-25 | 東芝松下ディスプレイテクノロジー株式会社 | ディスプレイ、配線基板及びその製造方法 |
JP2004304167A (ja) * | 2003-03-20 | 2004-10-28 | Advanced Lcd Technologies Development Center Co Ltd | 配線、表示装置及び、これらの形成方法 |
JP4112448B2 (ja) * | 2003-07-28 | 2008-07-02 | 株式会社東芝 | 電気光配線基板及び半導体装置 |
WO2005013360A1 (ja) * | 2003-08-05 | 2005-02-10 | Lintec Corporation | フリップチップ実装用基板 |
KR101001549B1 (ko) * | 2003-11-20 | 2010-12-17 | 삼성모바일디스플레이주식회사 | 유기 전계 발광 소자 |
US7768405B2 (en) * | 2003-12-12 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and manufacturing method thereof |
US7727854B2 (en) | 2003-12-19 | 2010-06-01 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
JP4306590B2 (ja) * | 2004-11-05 | 2009-08-05 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
JP2008124317A (ja) * | 2006-11-14 | 2008-05-29 | Toshiba Matsushita Display Technology Co Ltd | フレキシブルプリント基板 |
KR100896775B1 (ko) | 2007-10-05 | 2009-05-11 | 에이디반도체(주) | Mid 기술이 적용된 터치 윈도우 |
JP5157602B2 (ja) * | 2008-04-03 | 2013-03-06 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
WO2012067019A1 (ja) * | 2010-11-16 | 2012-05-24 | シャープ株式会社 | 配線基板、表示パネル、電子機器 |
JP6484983B2 (ja) * | 2014-09-30 | 2019-03-20 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
KR102399821B1 (ko) * | 2017-03-28 | 2022-05-19 | 삼성전자주식회사 | 커넥터 및 서로 다른 전위의 그라운드들을 포함하는 pcb 및 이를 포함하는 전자 장치 |
JP2019045777A (ja) * | 2017-09-06 | 2019-03-22 | セイコーエプソン株式会社 | 電気光学装置、電子機器及びプロジェクター |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4495377A (en) * | 1982-12-30 | 1985-01-22 | International Business Machines Corporation | Substrate wiring patterns for connecting to integrated-circuit chips |
US4750092A (en) * | 1985-11-20 | 1988-06-07 | Kollmorgen Technologies Corporation | Interconnection package suitable for electronic devices and methods for producing same |
JP2574510B2 (ja) | 1989-04-17 | 1997-01-22 | 松下電器産業株式会社 | 高周波半導体装置 |
JPH03244140A (ja) | 1990-02-22 | 1991-10-30 | Sony Corp | 半導体装置 |
JP2956199B2 (ja) | 1990-11-06 | 1999-10-04 | セイコーエプソン株式会社 | 半導体装置の構造 |
JP2990968B2 (ja) | 1992-09-17 | 1999-12-13 | 富士通株式会社 | 半導体チップの実装構造 |
US5491364A (en) * | 1994-08-31 | 1996-02-13 | Delco Electronics Corporation | Reduced stress terminal pattern for integrated circuit devices and packages |
JP3140330B2 (ja) | 1995-06-08 | 2001-03-05 | 松下電子工業株式会社 | 半導体装置の製造方法 |
TW353223B (en) * | 1995-10-10 | 1999-02-21 | Acc Microelectronics Corp | Semiconductor board providing high signal pin utilization |
JP3613098B2 (ja) | 1998-12-21 | 2005-01-26 | セイコーエプソン株式会社 | 回路基板ならびにそれを用いた表示装置および電子機器 |
-
2001
- 2001-07-12 JP JP2001212079A patent/JP3741005B2/ja not_active Expired - Lifetime
- 2001-08-20 TW TW090120422A patent/TW526569B/zh not_active IP Right Cessation
- 2001-09-12 CN CNB011329882A patent/CN1174489C/zh not_active Expired - Lifetime
- 2001-09-12 KR KR10-2001-0056127A patent/KR100424240B1/ko active IP Right Grant
- 2001-09-13 US US09/951,341 patent/US6486412B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103809314A (zh) * | 2012-11-13 | 2014-05-21 | 美格纳半导体有限公司 | 柔性电路板、半导体封装件及制造柔性电路板的方法 |
CN105451402A (zh) * | 2014-08-18 | 2016-03-30 | 力志国际光电股份有限公司 | Oled平面照明装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100424240B1 (ko) | 2004-03-24 |
JP3741005B2 (ja) | 2006-02-01 |
KR20020021051A (ko) | 2002-03-18 |
JP2002164628A (ja) | 2002-06-07 |
CN1174489C (zh) | 2004-11-03 |
US20020030978A1 (en) | 2002-03-14 |
TW526569B (en) | 2003-04-01 |
US6486412B2 (en) | 2002-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160523 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Address before: Hongkong, China Patentee before: BOE Technology (Hongkong) Co.,Ltd. Effective date of registration: 20160523 Address after: Hongkong, China Patentee after: BOE Technology (Hongkong) Co.,Ltd. Address before: Tokyo, Japan Patentee before: Seiko Epson Corp. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20041103 |