KR20030059324A - 열가소성 폴리우레탄 발포체, 이의 제조방법 및 이로부터제조된 연마 패드 - Google Patents
열가소성 폴리우레탄 발포체, 이의 제조방법 및 이로부터제조된 연마 패드 Download PDFInfo
- Publication number
- KR20030059324A KR20030059324A KR10-2003-7007606A KR20037007606A KR20030059324A KR 20030059324 A KR20030059324 A KR 20030059324A KR 20037007606 A KR20037007606 A KR 20037007606A KR 20030059324 A KR20030059324 A KR 20030059324A
- Authority
- KR
- South Korea
- Prior art keywords
- foam
- thermoplastic polyurethane
- polyurethane
- pressure
- reactive gas
- Prior art date
Links
- 229920002803 thermoplastic polyurethane Polymers 0.000 title claims abstract description 105
- 239000004433 Thermoplastic polyurethane Substances 0.000 title claims abstract description 104
- 239000006260 foam Substances 0.000 title claims abstract description 93
- 238000005498 polishing Methods 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 33
- 230000008569 process Effects 0.000 title claims description 8
- 229920005830 Polyurethane Foam Polymers 0.000 claims abstract description 59
- 239000011496 polyurethane foam Substances 0.000 claims abstract description 59
- 125000005442 diisocyanate group Chemical group 0.000 claims abstract description 17
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 17
- 239000004970 Chain extender Substances 0.000 claims abstract description 16
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 7
- 239000007789 gas Substances 0.000 claims description 90
- 229920002635 polyurethane Polymers 0.000 claims description 41
- 239000004814 polyurethane Substances 0.000 claims description 41
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 40
- 150000002009 diols Chemical class 0.000 claims description 37
- 238000005187 foaming Methods 0.000 claims description 30
- 239000001569 carbon dioxide Substances 0.000 claims description 20
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 20
- 238000001746 injection moulding Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
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- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 230000006872 improvement Effects 0.000 abstract description 6
- 229920005862 polyol Polymers 0.000 abstract description 2
- 150000003077 polyols Chemical class 0.000 abstract description 2
- 238000004090 dissolution Methods 0.000 description 24
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 21
- 238000001125 extrusion Methods 0.000 description 19
- 238000002347 injection Methods 0.000 description 18
- 239000007924 injection Substances 0.000 description 18
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 13
- 239000002002 slurry Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 7
- -1 3,7-dimethyldecanedicarboxylic acid Aliphatic dicarboxylic acids Chemical class 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- DKTUZYVVPZKWAS-UHFFFAOYSA-N hexanedioic acid;3-methylpentane-1,1-diol Chemical compound CCC(C)CC(O)O.OC(=O)CCCCC(O)=O DKTUZYVVPZKWAS-UHFFFAOYSA-N 0.000 description 3
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- BJZYYSAMLOBSDY-QMMMGPOBSA-N (2s)-2-butoxybutan-1-ol Chemical compound CCCCO[C@@H](CC)CO BJZYYSAMLOBSDY-QMMMGPOBSA-N 0.000 description 2
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
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- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
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- 230000000704 physical effect Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
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- 239000000758 substrate Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- VEPOHXYIFQMVHW-PVJVQHJQSA-N (2r,3r)-2,3-dihydroxybutanedioic acid;(2s,3s)-3,4-dimethyl-2-phenylmorpholine Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O.O1CCN(C)[C@@H](C)[C@@H]1C1=CC=CC=C1 VEPOHXYIFQMVHW-PVJVQHJQSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- FEQGQQZPSMVQKP-UHFFFAOYSA-N 2-(2,7-dimethylnonyl)propanedioic acid Chemical compound CCC(C)CCCCC(C)CC(C(O)=O)C(O)=O FEQGQQZPSMVQKP-UHFFFAOYSA-N 0.000 description 1
- KRUQSJKOWIRXGZ-UHFFFAOYSA-N 2-(2-methylbutyl)propanedioic acid Chemical compound CCC(C)CC(C(O)=O)C(O)=O KRUQSJKOWIRXGZ-UHFFFAOYSA-N 0.000 description 1
- WTPYFJNYAMXZJG-UHFFFAOYSA-N 2-[4-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=C(OCCO)C=C1 WTPYFJNYAMXZJG-UHFFFAOYSA-N 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- JHDZAYOBNXRTKA-UHFFFAOYSA-N 2-octan-2-ylpropanedioic acid Chemical compound CCCCCCC(C)C(C(O)=O)C(O)=O JHDZAYOBNXRTKA-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- WDBZEBXYXWWDPJ-UHFFFAOYSA-N 3-(2-methylphenoxy)propanoic acid Chemical compound CC1=CC=CC=C1OCCC(O)=O WDBZEBXYXWWDPJ-UHFFFAOYSA-N 0.000 description 1
- GAYWCADKXYCKCG-UHFFFAOYSA-N 5-pyridin-3-yl-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound N1NC(=S)N=C1C1=CC=CN=C1 GAYWCADKXYCKCG-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- SYEOWUNSTUDKGM-UHFFFAOYSA-N beta-methyladipic acid Natural products OC(=O)CC(C)CCC(O)=O SYEOWUNSTUDKGM-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
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- 239000013078 crystal Substances 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
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- 230000032050 esterification Effects 0.000 description 1
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- 238000011156 evaluation Methods 0.000 description 1
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- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- XJRAOMZCVTUHFI-UHFFFAOYSA-N isocyanic acid;methane Chemical compound C.N=C=O.N=C=O XJRAOMZCVTUHFI-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- GLOBUAZSRIOKLN-UHFFFAOYSA-N pentane-1,4-diol Chemical compound CC(O)CCCO GLOBUAZSRIOKLN-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- 230000008719 thickening Effects 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/3469—Cell or pore nucleation
- B29C44/348—Cell or pore nucleation by regulating the temperature and/or the pressure, e.g. suppression of foaming until the pressure is rapidly decreased
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0895—Manufacture of polymers by continuous processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6603—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6607—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
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- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/12—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0041—Foam properties having specified density
- C08G2110/0066—≥ 150kg/m3
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Abstract
Description
Claims (16)
- 고분자 디올, 유기 디이소시아네이트 및 쇄연장제를 반응시켜 수득되며 이소시아네이트 그룹으로부터 유도된 질소 원자의 함량이 6중량% 이상이고 50℃에서의 동적 점탄성율 E′50가 5 ×109dyn/㎠ 이상인 열가소성 폴리우레탄을 포함하는, 밀도가 0.5 내지 1.0g/㎤이고 기포 크기가 5 내지 200㎛이며 경도(JIS-C 경도)가 90 이상인 폴리우레탄 발포체.
- 고분자 디올, 유기 디이소시아네이트 및 쇄연장제를 반응시켜 수득되며 이소시아네이트 그룹으로부터 유도된 질소 원자의 함량이 6중량% 이상이고 50℃에서의 동적 점탄성율 E′50가 5 ×109dyn/㎠ 이상인 열 가소성 폴리우레탄에 비반응성 가스를 가압 조건하에서 용해시킨 후, 압력을 개방하여, 당해 폴리우레탄을 연화 온도 이상의 온도에서 발포시켜 수득된, 밀도가 O.5 내지 1.0g/㎤이고 기포 크기가 5 내지 200㎛인 폴리우레탄 발포체.
- 제2항에 있어서, 비반응성 가스를 용해하는 열가소성 폴리우레탄이 용융 상태의 열가소성 폴리우레탄인 발포체.
- 제2항 또는 제3항에 있어서, 비반응성 가스가 이산화탄소 또는 질소인 발포체.
- 제1항 내지 제4항 중의 어느 한 항에 있어서, 열가소성 폴리우레탄의 0℃에서의 동적 점탄성율 E′0와 50℃에서의 동적 점탄성율 E′50의 비율(E′0/E′50)이 1.8 이하인 발포체.
- 제1항 내지 제5항 중의 어느 한 항에 있어서, 열가소성 폴리우레탄의 융해 피크 온도가 200℃ 이하인 발포체.
- 제1항 내지 제6항 중의 어느 한 항에 따르는 발포체를 포함하는 연마 패드.
- 제1항 내지 제6항 중의 어느 한 항에 따르는 발포체를 사용하는 화학적 기계적 연마 방법.
- 내압 용기에서, 압력이 3 내지 15MPa이고 온도가 50 내지 160℃인 조건하에,고분자 디올, 유기 디이소시아네이트 및 쇄연장제를 반응시켜 수득되며 이소시아네이트 그룹으로부터 유도된 질소 원자의 함량이 6중량% 이상이고 50℃에서의 동적 점탄성율 E′50가 5 ×109dyn/㎠ 이상인 열가소성 폴리우레탄으로부터 제조된 성형체에 비반응성 가스를 용해시키는 단계,당해 열가소성 폴리우레탄의 연화 온도보다 낮은 온도에서 내압 용기의 압력을 개방하는 단계 및비반응성 가스가 용해되어 있는 성형체를 열가소성 폴리우레탄의 연화 온도 이상의 온도로 가열하여, 당해 성형체를 발포시키는 단계를 포함하는 폴리우레탄 발포체의 제조방법.
- 내압 용기에서, 압력이 3 내지 15MPa이고 온도가 160 내지 200℃인 조건하에, 고분자 디올, 유기 디이소시아네이트 및 쇄연장제를 반응시켜 수득되며 이소시아네이트 그룹으로부터 유도된 질소 원자의 함량이 6중량% 이상이고 50℃에서의 동적 점탄성율 E′50가 5 ×109dyn/㎠ 이상인 열가소성 폴리우레탄으로부터 제조된 성형체에 비반응성 가스를 용해시키는 단계 및내압 용기의 압력을 개방하여 비반응성 가스가 용해되어 있는 성형체를 발포시키는 단계를 포함하는 폴리우레탄 발포체의 제조방법.
- 고분자 디올, 유기 디이소시아네이트 및 쇄연장제를 반응시켜 수득되며 이소시아네이트 그룹으로부터 유도된 질소 원자의 함량이 6중량% 이상이고 50℃에서의 동적 점탄성율 E′50가 5 ×109dyn/㎠ 이상인 용융 상태의 열가소성 폴리우레탄에 비반응성 가스를 가압 조건하에서 용해시키는 단계 및비반응성 가스가 용해되어 있는 열가소성 폴리우레탄을 발포 가능한 압력 하에서 압출성형 또는 사출성형하여 발포 성형체를 수득하는 단계를 포함하는, 밀도가 O.5 내지 1.Og/㎤이고 기포 크기가 5 내지 200㎛인 폴리우레탄 발포체의 제조방법.
- 고분자 디올, 유기 디이소시아네이트 및 쇄연장제를 반응시켜 수득되며 이소시아네이트 그룹으로부터 유도된 질소 원자의 함량이 6중량% 이상이고 50℃에서의 동적 점탄성율 E′50가 5 ×109dyn/㎠ 이상인 용융 상태의 열가소성 폴리우레탄에 비반응성 가스를 가압 조건하에서 용해시키는 단계,비반응성 가스가 용해되어 있는 열가소성 폴리우레탄을 발포가 생성되지 않는 압력이 유지되는 속도로 사출성형하여 미발포 성형체를 수득하는 단계 및당해 미발포 성형체를 당해 열가소성 폴리우레탄의 연화 온도 이상의 온도로 가열하여 발포시키는 단계를 포함하는, 밀도가 0.5 내지 1.0g/㎤이고 기포 크기가 5 내지 200㎛인 폴리우레탄 발포체의 제조방법.
- 고분자 디올, 유기 디이소시아네이트 및 쇄연장제를 반응시켜 수득되며 이소시아네이트 그룹으로부터 유도된 질소 원자의 함량이 6중량% 이상이고 50℃에서의동적 점탄성율 E′50가 5 ×109dyn/㎠ 이상인 용융 상태의 열가소성 폴리우레탄에 비반응성 가스를 가압 조건하에서 용해시키는 단계 및비반응성 가스가 용해되어 있는 열가소성 폴리우레탄을 발포가 생성되지 않는 압력이 유지되는 속도로 금형 내로 사출한 후, 당해 금형 내의 용적을 증가시킴으로써 발포 성형체를 수득하는 단계를 포함하는, 밀도가 0.5 내지 1.0g/㎤이고 기포 크기가 20 내지 200㎛인 폴리우레탄 발포체의 제조방법.
- 제9항 내지 제13항 중의 어느 한 항에 있어서, 열가소성 폴리우레탄의 0℃ 에서의 동적 점탄성율 E′0와 50℃에서의 동적 점탄성율 E′50의 비율(E′0/E′50)이 1.8 이하인 폴리우레탄 발포체의 제조방법.
- 제9항 내지 제14항 중의 어느 한 항에 있어서, 열가소성 폴리우레탄의 융해 피크 온도가 200℃ 이하인 폴리우레탄 발포체의 제조방법.
- 제9항 내지 제15항 중의 어느 한 항에 있어서, 비반응성 가스가 이산화탄소 또는 질소인 폴리우레탄 발포체의 제조방법.
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JP2001113465 | 2001-04-12 | ||
PCT/JP2001/010613 WO2002046283A1 (fr) | 2000-12-08 | 2001-12-05 | Mousse de polyurethane thermoplastique, son procede de fabrication et tampons de polissage a base de cette mousse |
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KR101144305B1 (ko) * | 2008-12-15 | 2012-05-11 | 주식회사 엘지화학 | 폴리우레탄 발포체의 제조방법 및 이로부터 제조된 다공성 연마 패드 |
KR20170089845A (ko) * | 2014-11-28 | 2017-08-04 | 주식회사 쿠라레 | 연마층용 성형체 및 연마 패드 |
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US6979701B2 (en) | 2005-12-27 |
CN1487965A (zh) | 2004-04-07 |
EP1354913A4 (en) | 2009-09-16 |
TW528657B (en) | 2003-04-21 |
WO2002046283A1 (fr) | 2002-06-13 |
CN1217981C (zh) | 2005-09-07 |
EP1354913A1 (en) | 2003-10-22 |
KR100784656B1 (ko) | 2007-12-12 |
EP1354913B1 (en) | 2016-10-26 |
US20040054023A1 (en) | 2004-03-18 |
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