KR20030048012A - 다결정 반도체 부재 및 그 작성방법 - Google Patents

다결정 반도체 부재 및 그 작성방법

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Publication number
KR20030048012A
KR20030048012A KR10-2003-7002280A KR20037002280A KR20030048012A KR 20030048012 A KR20030048012 A KR 20030048012A KR 20037002280 A KR20037002280 A KR 20037002280A KR 20030048012 A KR20030048012 A KR 20030048012A
Authority
KR
South Korea
Prior art keywords
thin film
zinc oxide
oxide thin
cvd method
film
Prior art date
Application number
KR10-2003-7002280A
Other languages
English (en)
Other versions
KR100811154B1 (ko
Inventor
하가고이치
Original Assignee
토호쿠 테크노 아르크 코포레이션 리미티드
샤프 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토호쿠 테크노 아르크 코포레이션 리미티드, 샤프 가부시키가이샤 filed Critical 토호쿠 테크노 아르크 코포레이션 리미티드
Publication of KR20030048012A publication Critical patent/KR20030048012A/ko
Application granted granted Critical
Publication of KR100811154B1 publication Critical patent/KR100811154B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
    • C03C17/3417—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials all coatings being oxide coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3605—Coatings of the type glass/metal/inorganic compound
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3615—Coatings of the type glass/metal/other inorganic layers, at least one layer being non-metallic
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3649—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
    • C03C17/3671—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use as electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/16—Oxides

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Thin Film Transistor (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
KR1020037002280A 2000-08-18 2001-05-14 다결정 반도체 부재 및 그 작성방법 KR100811154B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2000/005575 WO2002016679A1 (fr) 2000-08-18 2000-08-18 Matiere semi-conductrice polycristalline
IBPCT/JP00/05575 2000-08-18
PCT/JP2001/003998 WO2002017368A1 (fr) 2000-08-18 2001-05-14 Composant de polysilicium a semi-conducteur et son procede de fabrication

Publications (2)

Publication Number Publication Date
KR20030048012A true KR20030048012A (ko) 2003-06-18
KR100811154B1 KR100811154B1 (ko) 2008-03-07

Family

ID=11736374

Family Applications (1)

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KR1020037002280A KR100811154B1 (ko) 2000-08-18 2001-05-14 다결정 반도체 부재 및 그 작성방법

Country Status (7)

Country Link
US (1) US6838308B2 (ko)
EP (1) EP1313134B1 (ko)
JP (1) JP4392477B2 (ko)
KR (1) KR100811154B1 (ko)
DE (1) DE60141211D1 (ko)
TW (1) TW505946B (ko)
WO (2) WO2002016679A1 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100907400B1 (ko) * 2007-08-28 2009-07-10 삼성모바일디스플레이주식회사 박막 트랜지스터 및 이를 이용한 발광표시장치
US7863607B2 (en) 2007-06-14 2011-01-04 Samsung Electronics Co., Ltd. Thin film transistor array panel and manufacturing method thereof
KR101329849B1 (ko) * 2009-11-28 2013-11-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
KR101490112B1 (ko) * 2008-03-28 2015-02-05 삼성전자주식회사 인버터 및 그를 포함하는 논리회로
US9711655B2 (en) 2010-12-03 2017-07-18 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6998656B2 (en) * 2003-02-07 2006-02-14 Hewlett-Packard Development Company, L.P. Transparent double-injection field-effect transistor
JP4089858B2 (ja) * 2000-09-01 2008-05-28 国立大学法人東北大学 半導体デバイス
US7189992B2 (en) * 2002-05-21 2007-03-13 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Transistor structures having a transparent channel
US7339187B2 (en) * 2002-05-21 2008-03-04 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Transistor structures
US7105868B2 (en) * 2002-06-24 2006-09-12 Cermet, Inc. High-electron mobility transistor with zinc oxide
AU2003267230A1 (en) * 2002-09-16 2004-04-30 Massachusetts Institute Of Technology Method for p-type doping wide band gap oxide semiconductors
JP2004227468A (ja) * 2003-01-27 2004-08-12 Canon Inc 情報提供装置、情報提供方法
US7250930B2 (en) * 2003-02-07 2007-07-31 Hewlett-Packard Development Company, L.P. Transparent active-matrix display
US7235920B2 (en) * 2003-02-24 2007-06-26 Osram Opto Semiconductors Gmbh Display device and method of its manufacture
US7161173B2 (en) * 2003-05-20 2007-01-09 Burgener Ii Robert H P-type group II-VI semiconductor compounds
US7227196B2 (en) * 2003-05-20 2007-06-05 Burgener Ii Robert H Group II-VI semiconductor devices
US7141489B2 (en) * 2003-05-20 2006-11-28 Burgener Ii Robert H Fabrication of p-type group II-VI semiconductors
US7172813B2 (en) * 2003-05-20 2007-02-06 Burgener Ii Robert H Zinc oxide crystal growth substrate
US20050017244A1 (en) * 2003-07-25 2005-01-27 Randy Hoffman Semiconductor device
US7262463B2 (en) 2003-07-25 2007-08-28 Hewlett-Packard Development Company, L.P. Transistor including a deposited channel region having a doped portion
JP2005227745A (ja) * 2004-01-14 2005-08-25 Seiko Epson Corp 液晶表示装置及び電子機器
US7297977B2 (en) * 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
US7242039B2 (en) * 2004-03-12 2007-07-10 Hewlett-Packard Development Company, L.P. Semiconductor device
US7145174B2 (en) * 2004-03-12 2006-12-05 Hewlett-Packard Development Company, Lp. Semiconductor device
US7642573B2 (en) * 2004-03-12 2010-01-05 Hewlett-Packard Development Company, L.P. Semiconductor device
US7282782B2 (en) * 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
US7675133B2 (en) * 2004-06-17 2010-03-09 Burgener Ii Robert H Persistent p-type group II-IV semiconductors
US7575979B2 (en) * 2004-06-22 2009-08-18 Hewlett-Packard Development Company, L.P. Method to form a film
US20060003485A1 (en) * 2004-06-30 2006-01-05 Hoffman Randy L Devices and methods of making the same
US7547647B2 (en) * 2004-07-06 2009-06-16 Hewlett-Packard Development Company, L.P. Method of making a structure
EP1812969B1 (en) * 2004-11-10 2015-05-06 Canon Kabushiki Kaisha Field effect transistor comprising an amorphous oxide
US20060220023A1 (en) * 2005-03-03 2006-10-05 Randy Hoffman Thin-film device
JP2006344849A (ja) * 2005-06-10 2006-12-21 Casio Comput Co Ltd 薄膜トランジスタ
JP5396579B2 (ja) * 2005-08-18 2014-01-22 国立大学法人山梨大学 酸化亜鉛薄膜の製造方法及び製造装置
KR100786498B1 (ko) * 2005-09-27 2007-12-17 삼성에스디아이 주식회사 투명박막 트랜지스터 및 그 제조방법
JP5037808B2 (ja) * 2005-10-20 2012-10-03 キヤノン株式会社 アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置
CN100445422C (zh) * 2006-03-21 2008-12-24 电子科技大学 一种用于制备氧化锌薄膜的有机锌源及其制备方法
US8243027B2 (en) * 2006-06-09 2012-08-14 Apple Inc. Touch screen liquid crystal display
KR101217555B1 (ko) * 2006-06-28 2013-01-02 삼성전자주식회사 접합 전계 효과 박막 트랜지스터
US7906415B2 (en) * 2006-07-28 2011-03-15 Xerox Corporation Device having zinc oxide semiconductor and indium/zinc electrode
US7651896B2 (en) * 2006-08-30 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
ES2374744T3 (es) * 2006-09-08 2012-02-21 Pilkington Group Limited Procedimiento a baja temperatura para fabricar un artículo revestido con óxido de cinc.
JP4616359B2 (ja) * 2007-01-09 2011-01-19 韓國電子通信研究院 電子素子用ＺｎＯ半導体膜の形成方法及び前記半導体膜を含む薄膜トランジスタ
US8207063B2 (en) 2007-01-26 2012-06-26 Eastman Kodak Company Process for atomic layer deposition
KR100858088B1 (ko) * 2007-02-28 2008-09-10 삼성전자주식회사 박막 트랜지스터 및 그 제조 방법
JP5320746B2 (ja) * 2007-03-28 2013-10-23 凸版印刷株式会社 薄膜トランジスタ
KR101345376B1 (ko) * 2007-05-29 2013-12-24 삼성전자주식회사 ＺｎＯ 계 박막 트랜지스터 및 그 제조방법
CN101681928B (zh) * 2007-05-31 2012-08-29 佳能株式会社 使用氧化物半导体的薄膜晶体管的制造方法
JP5242083B2 (ja) * 2007-06-13 2013-07-24 出光興産株式会社 結晶酸化物半導体、及びそれを用いてなる薄膜トランジスタ
FR2918791B1 (fr) * 2007-07-13 2009-12-04 Saint Gobain Substrat pour la croissance epitaxiale de nitrure de gallium
KR101270172B1 (ko) * 2007-08-29 2013-05-31 삼성전자주식회사 산화물 박막 트랜지스터 및 그 제조 방법
JP5219529B2 (ja) * 2008-01-23 2013-06-26 キヤノン株式会社 電界効果型トランジスタ及び、該電界効果型トランジスタを備えた表示装置
KR101513601B1 (ko) * 2008-03-07 2015-04-21 삼성전자주식회사 트랜지스터
KR20090124527A (ko) * 2008-05-30 2009-12-03 삼성모바일디스플레이주식회사 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치
US8822263B2 (en) * 2008-06-30 2014-09-02 National University Corporation Tokyo University Of Agriculture And Technology Epitaxial growth method of a zinc oxide based semiconductor layer, epitaxial crystal structure, epitaxial crystal growth apparatus, and semiconductor device
JP2010050165A (ja) * 2008-08-19 2010-03-04 Sumitomo Chemical Co Ltd 半導体装置、半導体装置の製造方法、トランジスタ基板、発光装置、および、表示装置
WO2010029866A1 (en) 2008-09-12 2010-03-18 Semiconductor Energy Laboratory Co., Ltd. Display device
JP5361651B2 (ja) 2008-10-22 2013-12-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2010047288A1 (en) 2008-10-24 2010-04-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductordevice
US8741702B2 (en) 2008-10-24 2014-06-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR101667909B1 (ko) 2008-10-24 2016-10-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제조방법
EP2180518B1 (en) 2008-10-24 2018-04-25 Semiconductor Energy Laboratory Co, Ltd. Method for manufacturing semiconductor device
TWI633605B (zh) 2008-10-31 2018-08-21 半導體能源研究所股份有限公司 半導體裝置及其製造方法
TWI508304B (zh) 2008-11-28 2015-11-11 Semiconductor Energy Lab 半導體裝置和其製造方法
JP5658452B2 (ja) * 2008-12-16 2015-01-28 富士フイルム株式会社 積層体の製造方法
TWI540647B (zh) * 2008-12-26 2016-07-01 半導體能源研究所股份有限公司 半導體裝置及其製造方法
KR101648927B1 (ko) 2009-01-16 2016-08-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
US8492756B2 (en) 2009-01-23 2013-07-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20100213458A1 (en) * 2009-02-23 2010-08-26 Micron Technology, Inc. Rigid semiconductor memory having amorphous metal oxide semiconductor channels
US8704216B2 (en) 2009-02-27 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101671210B1 (ko) 2009-03-06 2016-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
EP2256814B1 (en) 2009-05-29 2019-01-16 Semiconductor Energy Laboratory Co, Ltd. Oxide semiconductor device and method for manufacturing the same
KR101782176B1 (ko) 2009-07-18 2017-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제조 방법
KR102386147B1 (ko) 2009-07-31 2022-04-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 디바이스 및 그 형성 방법
WO2011013523A1 (en) 2009-07-31 2011-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN103489871B (zh) 2009-07-31 2016-03-23 株式会社半导体能源研究所 半导体装置及其制造方法
CN102473734B (zh) 2009-07-31 2015-08-12 株式会社半导体能源研究所 半导体装置及其制造方法
KR101823852B1 (ko) * 2009-09-16 2018-03-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 트랜지스터 및 표시 장치
KR102321565B1 (ko) 2009-09-24 2021-11-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
KR102223595B1 (ko) 2009-11-06 2021-03-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
WO2011065216A1 (en) * 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Stacked oxide material, semiconductor device, and method for manufacturing the semiconductor device
WO2011065210A1 (en) 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Stacked oxide material, semiconductor device, and method for manufacturing the semiconductor device
KR101396102B1 (ko) 2009-12-04 2014-05-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102333270B1 (ko) * 2009-12-04 2021-12-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101945171B1 (ko) * 2009-12-08 2019-02-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101878206B1 (ko) * 2010-03-05 2018-07-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막의 제작 방법 및 트랜지스터의 제작 방법
KR101803730B1 (ko) 2010-04-09 2017-12-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US8629438B2 (en) * 2010-05-21 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI562285B (en) * 2010-08-06 2016-12-11 Semiconductor Energy Lab Co Ltd Semiconductor device and method for manufacturing the same
US8685787B2 (en) * 2010-08-25 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
TWI525818B (zh) 2010-11-30 2016-03-11 半導體能源研究所股份有限公司 半導體裝置及半導體裝置之製造方法
US8829512B2 (en) * 2010-12-28 2014-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR101800888B1 (ko) * 2010-12-29 2017-11-24 엘지디스플레이 주식회사 산화물 반도체를 포함한 박막 트랜지스터 기판
US8686416B2 (en) * 2011-03-25 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US8476927B2 (en) * 2011-04-29 2013-07-02 Semiconductor Energy Laboratory Co., Ltd. Programmable logic device
US9166055B2 (en) * 2011-06-17 2015-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR20130007426A (ko) 2011-06-17 2013-01-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
JP6076038B2 (ja) 2011-11-11 2017-02-08 株式会社半導体エネルギー研究所 表示装置の作製方法
JP6122275B2 (ja) 2011-11-11 2017-04-26 株式会社半導体エネルギー研究所 表示装置
TWI562361B (en) 2012-02-02 2016-12-11 Semiconductor Energy Lab Co Ltd Semiconductor device
JP5871190B2 (ja) * 2012-03-30 2016-03-01 三菱マテリアル株式会社 サーミスタ用金属窒化物膜及びその製造方法並びにフィルム型サーミスタセンサ
KR102330543B1 (ko) 2012-04-13 2021-11-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
TWI478344B (zh) * 2012-07-04 2015-03-21 E Ink Holdings Inc 電晶體與其製造方法
JP2013153178A (ja) * 2013-03-01 2013-08-08 Semiconductor Energy Lab Co Ltd 半導体装置
US9805952B2 (en) * 2013-09-13 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP6327548B2 (ja) * 2013-11-26 2018-05-23 国立研究開発法人物質・材料研究機構 薄膜トランジスタ及びその製造方法
CN104952881A (zh) * 2015-05-06 2015-09-30 合肥京东方光电科技有限公司 薄膜晶体管及制备方法、阵列基板及制备方法、显示装置
JP2015207779A (ja) * 2015-06-16 2015-11-19 株式会社半導体エネルギー研究所 半導体装置
CN105489618B (zh) * 2016-01-22 2019-04-26 深圳市华星光电技术有限公司 薄膜晶体管阵列基板及薄膜晶体管阵列基板的制备方法
CN108987529B (zh) * 2018-07-15 2019-09-24 吉林建筑大学 一种柔性氧化锌光敏晶体管的制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062123A (ja) * 1992-06-23 1994-01-11 Mitsubishi Heavy Ind Ltd スパッタリング成膜装置
JP2000137342A (ja) * 1998-10-30 2000-05-16 Tohoku Ricoh Co Ltd 感光体、電子写真装置及び感光体用容器
JP3276930B2 (ja) * 1998-11-17 2002-04-22 科学技術振興事業団 トランジスタ及び半導体装置

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7863607B2 (en) 2007-06-14 2011-01-04 Samsung Electronics Co., Ltd. Thin film transistor array panel and manufacturing method thereof
US7652287B2 (en) 2007-08-28 2010-01-26 Samsung Mobile Display Co., Ltd. Thin film transistor, light-emitting display device having the same and associated methods
KR100907400B1 (ko) * 2007-08-28 2009-07-10 삼성모바일디스플레이주식회사 박막 트랜지스터 및 이를 이용한 발광표시장치
KR101490112B1 (ko) * 2008-03-28 2015-02-05 삼성전자주식회사 인버터 및 그를 포함하는 논리회로
US9214520B2 (en) 2009-11-28 2015-12-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8748881B2 (en) 2009-11-28 2014-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8779420B2 (en) 2009-11-28 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101396015B1 (ko) * 2009-11-28 2014-05-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101329849B1 (ko) * 2009-11-28 2013-11-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
US9887298B2 (en) 2009-11-28 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US10263120B2 (en) 2009-11-28 2019-04-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device and method for manufacturing liquid crystal display panel
US10608118B2 (en) 2009-11-28 2020-03-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US11133419B2 (en) 2009-11-28 2021-09-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US11710795B2 (en) 2009-11-28 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor with c-axis-aligned crystals
US9711655B2 (en) 2010-12-03 2017-07-18 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US10103277B2 (en) 2010-12-03 2018-10-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing oxide semiconductor film
US10916663B2 (en) 2010-12-03 2021-02-09 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device

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