KR20030043645A - 인덕터부품 및 그 인덕턴스값 조정방법 - Google Patents
인덕터부품 및 그 인덕턴스값 조정방법 Download PDFInfo
- Publication number
- KR20030043645A KR20030043645A KR1020020068844A KR20020068844A KR20030043645A KR 20030043645 A KR20030043645 A KR 20030043645A KR 1020020068844 A KR1020020068844 A KR 1020020068844A KR 20020068844 A KR20020068844 A KR 20020068844A KR 20030043645 A KR20030043645 A KR 20030043645A
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- Prior art keywords
- pattern
- inductance value
- insulating substrate
- coil pattern
- electrode
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000000206 photolithography Methods 0.000 claims abstract description 15
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 18
- 239000010408 film Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 239000012212 insulator Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 239000006089 photosensitive glass Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910003322 NiCu Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/045—Trimming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
Claims (8)
- 직사각형 형상의 절연성기판; 및포토리소그래피법으로 형성되고, 상기 절연성기판 상을 주회하는 1개 이상의 코일패턴을 구비하고,상기 코일패턴에 있어서, 상기 절연성기판의 2개의 짧은 변 중 1개 이상의 짧은 변의 근방에 짧은 변 방향에 대하여 대략 평행하게 설치되어 있는 패턴부분의 전극폭이 나머지 패턴부분의 전극폭보다 굵은 것을 특징으로 하는 인덕터부품.
- 직사각형 형상의 절연성기판; 및포토리소그래피법으로 형성되고, 상기 절연성기판 상을 주회하는 1개 이상의 코일패턴을 구비하고,상기 코일패턴에 있어서, 상기 절연성기판의 2개의 짧은 변 중 1개 이상의 짧은 변의 근방에 짧은 변 방향에 대하여 대략 평행하게 설치되어 있는 패턴부분의 전극간격이 나머지 패턴부분의 전극간격보다 넓은 것을 특징으로 하는 인덕터부품.
- 제 1항 또는 제 2항에 있어서, 상기 코일패턴이 소용돌이패턴인 것을 특징으로 하는 인덕터부품.
- 직사각형 형상의 절연성기판과, 포토리소그래피법으로 형성되고, 상기 절연성기판 상을 주회하는 1개 이상의 코일패턴을 구비한 인덕터부품의 인덕턴스값 조정방법으로서,상기 코일패턴에 있어서, 상기 절연성기판의 1개 이상의 짧은 변의 근방에 상기 짧은 변 방향에 대하여 대략 평행하게 설치되어 있는 패턴부분의 전극폭의 치수를 증가 또는 감소시킴으로써, 인덕턴스값을 조정하는 것을 특징으로 하는 인덕터부품의 인덕턴스값 조정방법.
- 직사각형 형상의 절연성기판과, 포토리소그래피법으로 형성되고, 상기 절연성기판 상을 주회하는 1개 이상의 코일패턴을 구비한 인덕터부품의 인덕턴스값 조정방법으로서,상기 코일패턴에 있어서, 상기 절연성기판의 1개 이상의 짧은 변의 근방에 상기 짧은 변 방향에 대하여 대략 평행하게 설치되어 있는 패턴부분의 전극간격의 치수를 증가 또는 감소시킴으로써, 인덕턴스값을 조정하는 것을 특징으로 하는 인덕터부품의 인덕턴스값 조정방법.
- 직사각형 형상의 절연성기판과, 포토리소그래피법으로 형성되고, 상기 절연성기판 상을 주회하는 1개 이상의 코일패턴을 구비한 인덕터부품의 인덕턴스값 조정방법으로서,상기 코일패턴에 있어서, 상기 절연성기판의 1개 이상의 긴 변의 근방에 상기 긴 변 방향에 대하여 대략 평행하게 설치되어 있는 패턴부분의 전극폭의 치수를감소시킴으로써, 인덕턴스값을 올리는 것을 특징으로 하는 인덕터부품의 인덕턴스값 조정방법.
- 직사각형 형상의 절연성기판과, 포토리소그래피법으로 형성되고, 상기 절연성기판 상을 주회하는 1개 이상의 코일패턴을 구비한 인덕터부품의 인덕턴스값 조정방법으로서,상기 코일패턴에 있어서, 상기 절연성기판의 1개 이상의 긴 변의 근방에 상기 긴 변 방향에 대하여 대략 평행하게 설치되어 있는 패턴부분의 전극간격의 치수를 감소시킴으로써, 인덕턴스값을 올리는 것을 특징으로 하는 인덕터부품의 인덕턴스값 조정방법.
- 제 4항 내지 제 7항 중 어느 한 항에 있어서, 상기 코일패턴이 소용돌이패턴인 것을 특징으로 하는 인덕터부품의 인덕턴스값 조정방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00359405 | 2001-11-26 | ||
JP2001359405A JP3755453B2 (ja) | 2001-11-26 | 2001-11-26 | インダクタ部品およびそのインダクタンス値調整方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030043645A true KR20030043645A (ko) | 2003-06-02 |
KR100474032B1 KR100474032B1 (ko) | 2005-03-11 |
Family
ID=19170422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-0068844A KR100474032B1 (ko) | 2001-11-26 | 2002-11-07 | 인덕터부품 및 그 인덕턴스값 조정방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6727571B2 (ko) |
JP (1) | JP3755453B2 (ko) |
KR (1) | KR100474032B1 (ko) |
CN (1) | CN1271648C (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100862489B1 (ko) * | 2007-06-11 | 2008-10-08 | 삼성전기주식회사 | 스파이럴 인덕터 |
KR20170086348A (ko) | 2016-01-18 | 2017-07-26 | 삼성전기주식회사 | 코일 부품 |
US10515750B2 (en) | 2015-05-29 | 2019-12-24 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component with distance between lead portion and coil pattern greater than distance between adjacent coil patterns |
US10593465B2 (en) | 2017-04-19 | 2020-03-17 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip bead |
Families Citing this family (31)
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JP3815679B2 (ja) * | 2003-05-19 | 2006-08-30 | Tdk株式会社 | 積層型電子部品 |
JP2005243752A (ja) * | 2004-02-25 | 2005-09-08 | Jfe Steel Kk | 平面磁気素子 |
JP2006041357A (ja) * | 2004-07-29 | 2006-02-09 | Fujikura Ltd | 半導体装置およびその製造方法 |
KR100688858B1 (ko) | 2004-12-30 | 2007-03-02 | 삼성전기주식회사 | 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법 |
US7714688B2 (en) * | 2005-01-20 | 2010-05-11 | Avx Corporation | High Q planar inductors and IPD applications |
US9129741B2 (en) | 2006-09-14 | 2015-09-08 | Qualcomm Incorporated | Method and apparatus for wireless power transmission |
CN1929134B (zh) * | 2006-10-10 | 2010-04-14 | 威盛电子股份有限公司 | 芯片内建电感元件 |
KR100834744B1 (ko) * | 2006-12-20 | 2008-06-05 | 삼성전자주식회사 | 다층의 대칭형 헬리컬 인덕터 |
JP5180625B2 (ja) * | 2007-03-12 | 2013-04-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
TWI339548B (en) * | 2007-06-01 | 2011-03-21 | Ind Tech Res Inst | Inductor devices |
JP4895039B2 (ja) * | 2007-06-08 | 2012-03-14 | 日本電気株式会社 | インダクタ、配線基板、および半導体装置 |
TW201001457A (en) * | 2008-06-30 | 2010-01-01 | Delta Electronics Inc | Magnetic component |
JP5131260B2 (ja) * | 2009-09-29 | 2013-01-30 | 株式会社村田製作所 | 積層型コイル装置 |
CN102013556A (zh) * | 2010-09-14 | 2011-04-13 | 北京握奇数据系统有限公司 | 天线及具有该天线的装置 |
JP2012244763A (ja) * | 2011-05-19 | 2012-12-10 | Sony Corp | 給電装置、給電システムおよび電子機器 |
KR20130058340A (ko) | 2011-11-25 | 2013-06-04 | 삼성전기주식회사 | 인덕터 및 그 제조 방법 |
JP6283158B2 (ja) * | 2012-04-12 | 2018-02-21 | 新光電気工業株式会社 | 配線基板、及び、配線基板の製造方法 |
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CN103377811B (zh) * | 2012-04-24 | 2016-08-10 | 乾坤科技股份有限公司 | 电磁器件及其线圈结构 |
WO2014181755A1 (ja) | 2013-05-08 | 2014-11-13 | 株式会社村田製作所 | 電子部品 |
US9251948B2 (en) * | 2013-07-24 | 2016-02-02 | International Business Machines Corporation | High efficiency on-chip 3D transformer structure |
JP5757376B1 (ja) * | 2013-11-28 | 2015-07-29 | 株式会社村田製作所 | 多層基板の製造方法、多層基板および電磁石 |
KR20160043796A (ko) * | 2014-10-14 | 2016-04-22 | 삼성전기주식회사 | 칩 전자부품 |
KR101892689B1 (ko) | 2014-10-14 | 2018-08-28 | 삼성전기주식회사 | 칩 전자부품 및 칩 전자부품의 실장 기판 |
EP3026684B1 (de) * | 2014-11-27 | 2017-11-15 | Brusa Elektronik AG | Sendespule für ein kontaktloses Energieübertragungssystem mit verbesserter Kopplung und verbessertem Streufeld |
EP3340372A4 (en) * | 2015-08-20 | 2019-04-03 | Toray Industries, Inc. | MANUFACTURING METHOD FOR ANTENNA SUBSTRATE, MANUFACTURING METHOD FOR WIRING AND ELECTRODE ANTENNA SUBSTRATE, AND METHOD OF MANUFACTURING RFID ELEMENT |
JP6613857B2 (ja) * | 2015-12-08 | 2019-12-04 | 株式会社村田製作所 | Dc‐dcコンバータモジュール |
JP7288056B2 (ja) * | 2018-12-20 | 2023-06-06 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 高精度インダクタを含む多層電子デバイス |
JP7176435B2 (ja) * | 2019-02-15 | 2022-11-22 | 株式会社村田製作所 | インダクタ部品 |
CN110660554B (zh) * | 2019-09-29 | 2021-06-11 | 苏州科技大学 | 一种高磁导率高频率平面电感及其制备方法 |
JP2022065910A (ja) * | 2020-10-16 | 2022-04-28 | イビデン株式会社 | コイル基板とモータ用コイル基板、モータ |
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JP3166720B2 (ja) * | 1998-08-25 | 2001-05-14 | 株式会社村田製作所 | インダクタの製造方法 |
US6303423B1 (en) * | 1998-12-21 | 2001-10-16 | Megic Corporation | Method for forming high performance system-on-chip using post passivation process |
JP2001085230A (ja) * | 1999-09-14 | 2001-03-30 | Murata Mfg Co Ltd | インダクタ |
JP4420586B2 (ja) * | 2001-09-28 | 2010-02-24 | Jfeケミカル株式会社 | 平面磁気素子およびスイッチング電源 |
-
2001
- 2001-11-26 JP JP2001359405A patent/JP3755453B2/ja not_active Expired - Lifetime
-
2002
- 2002-11-07 KR KR10-2002-0068844A patent/KR100474032B1/ko active IP Right Grant
- 2002-11-08 US US10/290,404 patent/US6727571B2/en not_active Expired - Lifetime
- 2002-11-21 CN CNB021522561A patent/CN1271648C/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100862489B1 (ko) * | 2007-06-11 | 2008-10-08 | 삼성전기주식회사 | 스파이럴 인덕터 |
US10515750B2 (en) | 2015-05-29 | 2019-12-24 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component with distance between lead portion and coil pattern greater than distance between adjacent coil patterns |
KR20170086348A (ko) | 2016-01-18 | 2017-07-26 | 삼성전기주식회사 | 코일 부품 |
US10593465B2 (en) | 2017-04-19 | 2020-03-17 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip bead |
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JP3755453B2 (ja) | 2006-03-15 |
CN1421879A (zh) | 2003-06-04 |
JP2003158015A (ja) | 2003-05-30 |
US6727571B2 (en) | 2004-04-27 |
CN1271648C (zh) | 2006-08-23 |
US20030098496A1 (en) | 2003-05-29 |
KR100474032B1 (ko) | 2005-03-11 |
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