KR20030002987A - 치환금 도금액 - Google Patents

치환금 도금액 Download PDF

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Publication number
KR20030002987A
KR20030002987A KR1020020024989A KR20020024989A KR20030002987A KR 20030002987 A KR20030002987 A KR 20030002987A KR 1020020024989 A KR1020020024989 A KR 1020020024989A KR 20020024989 A KR20020024989 A KR 20020024989A KR 20030002987 A KR20030002987 A KR 20030002987A
Authority
KR
South Korea
Prior art keywords
gold
plating
substitution
plating solution
nickel
Prior art date
Application number
KR1020020024989A
Other languages
English (en)
Korean (ko)
Inventor
하야시카츠노리
히로세요시마사
Original Assignee
니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤 filed Critical 니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤
Publication of KR20030002987A publication Critical patent/KR20030002987A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
KR1020020024989A 2001-06-29 2002-05-07 치환금 도금액 KR20030002987A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001197737A JP3482402B2 (ja) 2001-06-29 2001-06-29 置換金メッキ液
JPJP-P-2001-00197737 2001-06-29

Publications (1)

Publication Number Publication Date
KR20030002987A true KR20030002987A (ko) 2003-01-09

Family

ID=19035287

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020024989A KR20030002987A (ko) 2001-06-29 2002-05-07 치환금 도금액

Country Status (5)

Country Link
US (1) US6767392B2 (zh)
EP (1) EP1285979A1 (zh)
JP (1) JP3482402B2 (zh)
KR (1) KR20030002987A (zh)
TW (1) TW546408B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100832630B1 (ko) * 2004-11-15 2008-05-27 닛코킨조쿠 가부시키가이샤 무전해금도금액
KR100894127B1 (ko) * 2007-07-20 2009-04-20 한국생산기술연구원 무전해 니켈 도금액 및 비시안계 치환형 무전해 금 도금액

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液
WO2004108987A1 (ja) 2003-06-05 2004-12-16 Nikko Materials Co., Ltd. 無電解金めっき液
KR100767944B1 (ko) 2004-07-09 2007-10-17 닛코킨조쿠 가부시키가이샤 무전해 금도금액
JP2006111960A (ja) * 2004-09-17 2006-04-27 Shinko Electric Ind Co Ltd 非シアン無電解金めっき液及び無電解金めっき方法
WO2006090775A1 (ja) * 2005-02-23 2006-08-31 Daikin Industries, Ltd. コーティング膜、コーティング膜で被覆された物品及び耐食性コーティング方法
US20070275498A1 (en) * 2006-05-26 2007-11-29 Paul Beecher Enhancing performance in ink-jet printed organic semiconductors
US8323789B2 (en) 2006-08-31 2012-12-04 Cambridge Enterprise Limited Nanomaterial polymer compositions and uses thereof
EP2057211B1 (en) * 2006-08-31 2013-01-02 Cambridge Enterprise Limited Optical nanomaterial compositions
JP4881129B2 (ja) * 2006-11-07 2012-02-22 メタローテクノロジーズジャパン株式会社 金バンプ又は金配線形成用非シアン系電解金めっき浴
US9052289B2 (en) * 2010-12-13 2015-06-09 Schlumberger Technology Corporation Hydrogen sulfide (H2S) detection using functionalized nanoparticles
KR101444687B1 (ko) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH555894A (fr) * 1972-08-10 1974-11-15 Oxy Metal Industries Corp Utilisation de derives organophosphores dans les bains sulfitiques pour l'electrodeposition de l'or et des alliages d'or.
US4012294A (en) * 1972-08-10 1977-03-15 Oxy Metal Industries Corporation Gold sulfite baths containing organophosphorous compounds
DD268484A1 (de) * 1983-12-22 1989-05-31 Mittweida Ing Hochschule Cyanidfreies bad zur stromlosen abscheidung von hartgoldschichten
JPH05295558A (ja) 1992-04-17 1993-11-09 Okuno Chem Ind Co Ltd 高速置換型無電解金めっき液
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
WO1994012686A1 (en) * 1992-11-25 1994-06-09 Kanto Kagaku Kabushiki Kaisha Electroless gold plating bath
US5364460A (en) * 1993-03-26 1994-11-15 C. Uyemura & Co., Ltd. Electroless gold plating bath
JP2927142B2 (ja) * 1993-03-26 1999-07-28 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP3227505B2 (ja) 1993-07-16 2001-11-12 奥野製薬工業株式会社 置換型無電解金めっき液
US5910340A (en) * 1995-10-23 1999-06-08 C. Uyemura & Co., Ltd. Electroless nickel plating solution and method
JP3566498B2 (ja) 1997-05-14 2004-09-15 株式会社大和化成研究所 置換金めっき浴
WO1999018255A1 (en) * 1997-10-03 1999-04-15 Massachusetts Institute Of Technology Selective substrate metallization
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液
US6383269B1 (en) * 1999-01-27 2002-05-07 Shipley Company, L.L.C. Electroless gold plating solution and process
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
JP3466521B2 (ja) * 1999-10-04 2003-11-10 新光電気工業株式会社 置換型無電解金めっき液及び無電解金めっき方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100832630B1 (ko) * 2004-11-15 2008-05-27 닛코킨조쿠 가부시키가이샤 무전해금도금액
KR100894127B1 (ko) * 2007-07-20 2009-04-20 한국생산기술연구원 무전해 니켈 도금액 및 비시안계 치환형 무전해 금 도금액

Also Published As

Publication number Publication date
US6767392B2 (en) 2004-07-27
EP1285979A1 (en) 2003-02-26
TW546408B (en) 2003-08-11
JP3482402B2 (ja) 2003-12-22
US20030047108A1 (en) 2003-03-13
JP2003013249A (ja) 2003-01-15

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application