KR20010006061A - 박판지지용기 - Google Patents
박판지지용기 Download PDFInfo
- Publication number
- KR20010006061A KR20010006061A KR1019997009139A KR19997009139A KR20010006061A KR 20010006061 A KR20010006061 A KR 20010006061A KR 1019997009139 A KR1019997009139 A KR 1019997009139A KR 19997009139 A KR19997009139 A KR 19997009139A KR 20010006061 A KR20010006061 A KR 20010006061A
- Authority
- KR
- South Korea
- Prior art keywords
- thin plate
- container
- container body
- plate supporting
- lid
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Abstract
Description
Claims (9)
- 내부에 박판을 복수개 수납하는 용기본체와, 이 용기본체의 마주보는 측벽에 각각 설치되고 내부에 수납된 박판을 양쪽에서 지지하는 박판지지부를 구비하여 이루어지는 박판지지용기에 있어서,상기 용기본체를 막는 덮개체와, 이 덮개체를 상기 용기본체에 대해 용이하게 착탈할 수 있는 간이착탈기구를 구비하고,상기 간이착탈기구가, 상기 덮개체의 주변부에 설치되어 있는 걸쇠용 고정부와, 상기 용기본체 쪽에서 상기 걸쇠용 고정부에 마주하여 설치되고 이 걸쇠용 고정부가 고정되어 덮개체가 용기본체에 고정되는 피고정부와, 상기 덮개체 쪽의 걸쇠용 고정부에 일체적으로 설치되고 눌러 내려서 걸쇠용 고정부를 상기 피고정부에서 분리시키는 암과, 이 암으로 걸쇠용 고정부를 피고정부에서 분리시킬 때 상기 덮개체를 상기 용기본체에서 약간 잡아올리는 리프팅 기구로 구성된 것을 특징으로 하는 박판지지용기.
- 제1항에 있어서, 상기 용기본체의 아래쪽에 설치되고 용기본체를 세로로 둔 상태에서 안정하게 지지하는 족부와, 상기 덮개체의 위쪽면에 설치되고 상기 족부가 고정되는 족부 수부를 구비하는 것을 특징으로 하는 박판지지용기.
- 내부에 박판을 복수개 수납하는 용기본체와, 이 용기본체 내의 마주보는 측벽에 각각 설치되고 내부에 수납된 박판을 양쪽에서 지지하는 박판지지부를 구비하여 이루어진 박판지지용기에 있어서,상기 박판지지부가 용기본체에 대해 착탈이 자유롭게 설치된 것을 특징으로 하는 박판지지용기.
- 제3항에 있어서, 상기 박판지지부가,병렬로 일정간격을 두어 여러장 설치되고 각 박판을 1매씩 간격을 두어 지지하는 치판부(齒板部)와,각 치판부를 병렬로 일정간격을 두어 설치한 상태에서 적어도 가장 안쪽과 입구쪽을 일체적으로 지지하는 지지판부와,가장 안쪽의 지지판부와 상기 박판의 밀착면에 형성되고 상기 용기본체를 세로로 두었을 때 박판을 가장 안쪽부분에서 각 치판부 사이의 중앙으로 안내하여 지지하는 V자형 홈을 구비하여 구성된 것을 특징으로 하는 박판지지용기.
- 제4항에 있어서, 상기 박판이 원형상으로 형성됨과 함께 상기 치판부가 원형상의 박판의 주변을 따라 원호상으로 둥글게 형성되고, 박판의 주변을 따라 서로 약간 겹쳐지는 것을 특징으로 하는 박판지지용기.
- 제3항 내지 제5항의 어느 한 항에 있어서, 상기 박판지지부가, 크기 정밀도가 높게 마무리되는 성형성으로 우수한 합성수지에 의해 구성되는 것을 특징으로 하는 박판지지용기.
- 제1항 내지 제6항의 어느 한항에 있어서, 상기 용기본체에 반송장치의 암에 의해 파지되는 탑 플랜지와, 이동용 핸들을 각각 착탈이 자유롭게 설치하는 것을 특징으로 하는 박판지지용기.
- 제7항에 있어서, 상기 핸들을 용기본체의 세로방향과 가로방향의 중간위치의 방향으로 기울여서 설치한 것을 특징으로 하는 박판지지용기.
- 제1항 내지 제8항의 어느 한항에 있어서, 상기 용기본체 또는 덮개체에, 안쪽과 바깥쪽 사이에서 기체의 통과를 허용하여 내부기압을 외부기압과 일치시킴과 동시에, 진애 등의 통과를 제한하는 필터를 착탈이 자유롭게 설치한 것을 특징으로 하는 박판지지용기.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1998/000489 WO1999039994A1 (en) | 1998-02-06 | 1998-02-06 | Sheet support container |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010006061A true KR20010006061A (ko) | 2001-01-15 |
KR100460309B1 KR100460309B1 (ko) | 2004-12-04 |
Family
ID=14207567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-1999-7009139A KR100460309B1 (ko) | 1998-02-06 | 1998-02-06 | 박판지지용기 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1004524B1 (ko) |
JP (1) | JP3538204B2 (ko) |
KR (1) | KR100460309B1 (ko) |
TW (1) | TW469605B (ko) |
WO (1) | WO1999039994A1 (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3538204B2 (ja) * | 1998-02-06 | 2004-06-14 | 三菱住友シリコン株式会社 | 薄板支持容器 |
JP4146718B2 (ja) | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | 薄板支持容器 |
TWI276580B (en) | 2003-12-18 | 2007-03-21 | Miraial Co Ltd | Lid unit for thin-plate supporting container |
CN100389487C (zh) * | 2005-10-11 | 2008-05-21 | 中芯国际集成电路制造(上海)有限公司 | 湿腐蚀过程中防止晶片移位的固定装置 |
JP4809714B2 (ja) * | 2006-05-12 | 2011-11-09 | ミライアル株式会社 | 薄板収納容器 |
JP4825241B2 (ja) * | 2008-06-17 | 2011-11-30 | 信越ポリマー株式会社 | 基板収納容器 |
KR101589325B1 (ko) | 2008-06-23 | 2016-01-27 | 신에츠 폴리머 가부시키가이샤 | 지지체 및 기판 수납 용기 |
JP5268858B2 (ja) * | 2009-10-23 | 2013-08-21 | 信越ポリマー株式会社 | 基板収納容器 |
JP6000075B2 (ja) * | 2012-11-08 | 2016-09-28 | ミライアル株式会社 | 基板収納容器 |
JP2014120595A (ja) * | 2012-12-17 | 2014-06-30 | Mitsubishi Electric Corp | ウエハ収納キャリア |
WO2014192109A1 (ja) | 2013-05-29 | 2014-12-04 | ミライアル株式会社 | 基板収納容器 |
WO2014203359A1 (ja) * | 2013-06-19 | 2014-12-24 | ミライアル株式会社 | 基板収納容器 |
US9865487B2 (en) | 2013-09-11 | 2018-01-09 | Miraial Co., Ltd. | Substrate storage container |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4728405U (ko) * | 1971-03-30 | 1972-12-01 | ||
EP0343762A3 (en) * | 1988-05-24 | 1991-05-08 | Empak Inc. | Substrate package |
JPH06101515B2 (ja) * | 1991-03-29 | 1994-12-12 | 九州電子金属株式会社 | 半導体ウェーハの輸送用容器 |
JPH0563066A (ja) * | 1991-08-30 | 1993-03-12 | Shin Etsu Handotai Co Ltd | ウエーハ収納容器の係止構造 |
JPH062699U (ja) * | 1992-06-16 | 1994-01-14 | 株式会社柿崎製作所 | ウエハキャリアボックス |
US5387067A (en) * | 1993-01-14 | 1995-02-07 | Applied Materials, Inc. | Direct load/unload semiconductor wafer cassette apparatus and transfer system |
JPH0826380A (ja) * | 1994-05-10 | 1996-01-30 | Toshio Ishikawa | 基板用カセットにおけるサイドレール及び基板用カセット |
JPH07307380A (ja) * | 1994-05-12 | 1995-11-21 | Sony Corp | キャリアボックス |
WO1996009787A1 (en) * | 1994-09-26 | 1996-04-04 | Asyst Technologies, Inc. | Semiconductor wafer cassette |
JPH0964161A (ja) * | 1995-08-18 | 1997-03-07 | Kakizaki Seisakusho:Kk | 薄板用支持容器 |
JPH09107026A (ja) * | 1995-10-12 | 1997-04-22 | Shin Etsu Polymer Co Ltd | ウェーハ収納容器のウェーハカセット |
DE69526126T2 (de) * | 1995-10-13 | 2002-11-07 | Empak Inc | 300 mm behälter mit mikroumgebung und seitentür und erdungsleitung |
JPH09139421A (ja) * | 1995-11-16 | 1997-05-27 | Sumitomo Sitix Corp | 内圧調整機構付き薄板収納容器 |
JP3579183B2 (ja) * | 1996-05-14 | 2004-10-20 | 株式会社吉野工業所 | 密閉性容器 |
JP3538204B2 (ja) * | 1998-02-06 | 2004-06-14 | 三菱住友シリコン株式会社 | 薄板支持容器 |
-
1998
- 1998-02-06 JP JP54023099A patent/JP3538204B2/ja not_active Expired - Lifetime
- 1998-02-06 KR KR10-1999-7009139A patent/KR100460309B1/ko not_active IP Right Cessation
- 1998-02-06 EP EP98901527.6A patent/EP1004524B1/en not_active Expired - Lifetime
- 1998-02-06 WO PCT/JP1998/000489 patent/WO1999039994A1/ja active IP Right Grant
- 1998-03-02 TW TW087102957A patent/TW469605B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1999039994A1 (en) | 1999-08-12 |
TW469605B (en) | 2001-12-21 |
EP1004524B1 (en) | 2014-12-31 |
KR100460309B1 (ko) | 2004-12-04 |
EP1004524A4 (en) | 2007-11-14 |
EP1004524A1 (en) | 2000-05-31 |
JP3538204B2 (ja) | 2004-06-14 |
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