CN100389487C - 湿腐蚀过程中防止晶片移位的固定装置 - Google Patents
湿腐蚀过程中防止晶片移位的固定装置 Download PDFInfo
- Publication number
- CN100389487C CN100389487C CNB2005100303804A CN200510030380A CN100389487C CN 100389487 C CN100389487 C CN 100389487C CN B2005100303804 A CNB2005100303804 A CN B2005100303804A CN 200510030380 A CN200510030380 A CN 200510030380A CN 100389487 C CN100389487 C CN 100389487C
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- Prior art keywords
- etching tank
- wafer
- fixture
- top cover
- fixed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
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Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100303804A CN100389487C (zh) | 2005-10-11 | 2005-10-11 | 湿腐蚀过程中防止晶片移位的固定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100303804A CN100389487C (zh) | 2005-10-11 | 2005-10-11 | 湿腐蚀过程中防止晶片移位的固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1949471A CN1949471A (zh) | 2007-04-18 |
CN100389487C true CN100389487C (zh) | 2008-05-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2005100303804A Expired - Fee Related CN100389487C (zh) | 2005-10-11 | 2005-10-11 | 湿腐蚀过程中防止晶片移位的固定装置 |
Country Status (1)
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CN (1) | CN100389487C (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06177030A (ja) * | 1992-12-02 | 1994-06-24 | Daido Steel Co Ltd | 成膜基盤処理装置 |
JPH11233486A (ja) * | 1997-08-27 | 1999-08-27 | Motorola Inc | 半導体基板上の誘電体層をエッチングする方法および装置 |
EP1004524A1 (en) * | 1998-02-06 | 2000-05-31 | Sumitomo Metal Industries Limited | Sheet support container |
US20020079055A1 (en) * | 2000-12-27 | 2002-06-27 | Kim Jong Soo | Etching device for glass substrate |
US20030141217A1 (en) * | 2002-01-28 | 2003-07-31 | Park Dong-Jin | Workpiece container assembly and apparatus for opening/closing the same |
JP2004143545A (ja) * | 2002-10-25 | 2004-05-20 | Canon Inc | 処理方法 |
-
2005
- 2005-10-11 CN CNB2005100303804A patent/CN100389487C/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06177030A (ja) * | 1992-12-02 | 1994-06-24 | Daido Steel Co Ltd | 成膜基盤処理装置 |
JPH11233486A (ja) * | 1997-08-27 | 1999-08-27 | Motorola Inc | 半導体基板上の誘電体層をエッチングする方法および装置 |
EP1004524A1 (en) * | 1998-02-06 | 2000-05-31 | Sumitomo Metal Industries Limited | Sheet support container |
US20020079055A1 (en) * | 2000-12-27 | 2002-06-27 | Kim Jong Soo | Etching device for glass substrate |
US20030141217A1 (en) * | 2002-01-28 | 2003-07-31 | Park Dong-Jin | Workpiece container assembly and apparatus for opening/closing the same |
JP2004143545A (ja) * | 2002-10-25 | 2004-05-20 | Canon Inc | 処理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1949471A (zh) | 2007-04-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111205 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111205 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080521 Termination date: 20181011 |