KR102753698B1 - 밀봉용 액상 수지 조성물 및 전자 부품 장치 - Google Patents

밀봉용 액상 수지 조성물 및 전자 부품 장치 Download PDF

Info

Publication number
KR102753698B1
KR102753698B1 KR1020197038170A KR20197038170A KR102753698B1 KR 102753698 B1 KR102753698 B1 KR 102753698B1 KR 1020197038170 A KR1020197038170 A KR 1020197038170A KR 20197038170 A KR20197038170 A KR 20197038170A KR 102753698 B1 KR102753698 B1 KR 102753698B1
Authority
KR
South Korea
Prior art keywords
resin composition
sealing
liquid resin
epoxy compound
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197038170A
Other languages
English (en)
Korean (ko)
Other versions
KR20200015584A (ko
Inventor
히데토시 이노우에
다카유키 마츠자키
히사토 다카하시
츠요시 가미무라
하루유키 요시이
Original Assignee
가부시끼가이샤 레조낙
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙, 나믹스 가부시끼가이샤 filed Critical 가부시끼가이샤 레조낙
Priority to KR1020257000609A priority Critical patent/KR20250009019A/ko
Publication of KR20200015584A publication Critical patent/KR20200015584A/ko
Application granted granted Critical
Publication of KR102753698B1 publication Critical patent/KR102753698B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1025—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by non-chemical features of one or more of its constituents
    • H01L23/295—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0243—Silica-rich compounds, e.g. silicates, cement, glass
    • C09K2200/0247—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Details Of Resistors (AREA)
KR1020197038170A 2017-05-31 2018-05-31 밀봉용 액상 수지 조성물 및 전자 부품 장치 Active KR102753698B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257000609A KR20250009019A (ko) 2017-05-31 2018-05-31 밀봉용 액상 수지 조성물 및 전자 부품 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-108715 2017-05-31
JP2017108715 2017-05-31
PCT/JP2018/021059 WO2018221681A1 (ja) 2017-05-31 2018-05-31 封止用液状樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257000609A Division KR20250009019A (ko) 2017-05-31 2018-05-31 밀봉용 액상 수지 조성물 및 전자 부품 장치

Publications (2)

Publication Number Publication Date
KR20200015584A KR20200015584A (ko) 2020-02-12
KR102753698B1 true KR102753698B1 (ko) 2025-01-14

Family

ID=64454806

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020197038170A Active KR102753698B1 (ko) 2017-05-31 2018-05-31 밀봉용 액상 수지 조성물 및 전자 부품 장치
KR1020257000609A Pending KR20250009019A (ko) 2017-05-31 2018-05-31 밀봉용 액상 수지 조성물 및 전자 부품 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020257000609A Pending KR20250009019A (ko) 2017-05-31 2018-05-31 밀봉용 액상 수지 조성물 및 전자 부품 장치

Country Status (8)

Country Link
US (1) US12131970B2 (https=)
EP (1) EP3620481B1 (https=)
JP (2) JP7148507B2 (https=)
KR (2) KR102753698B1 (https=)
CN (1) CN110785451A (https=)
PT (1) PT3620481T (https=)
TW (1) TWI786121B (https=)
WO (1) WO2018221681A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7302496B2 (ja) 2020-02-05 2023-07-04 味の素株式会社 樹脂組成物
TWI883181B (zh) 2020-06-23 2025-05-11 日商納美仕有限公司 液狀壓縮成型材
CN116390967A (zh) * 2020-10-21 2023-07-04 松下知识产权经营株式会社 液态树脂组合物及其固化物
JP7631828B2 (ja) * 2021-01-22 2025-02-19 味の素株式会社 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置
WO2023047702A1 (ja) 2021-09-22 2023-03-30 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置、および半導体装置の製造方法
KR20240081446A (ko) 2021-10-13 2024-06-07 나믹스 가부시끼가이샤 액상 봉지제, 전자 부품과 그 제조 방법, 및 반도체 장치
JPWO2024075343A1 (https=) * 2022-10-07 2024-04-11
KR102704455B1 (ko) * 2022-12-23 2024-09-09 (주)에버텍엔터프라이즈 반도체 소자 봉지용 액상 수지 조성물, 이를 포함하는 반도체 소자 봉지재 및 반도체 소자
WO2024134951A1 (ja) * 2022-12-23 2024-06-27 ナミックス株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置
KR20250162492A (ko) 2023-03-28 2025-11-18 나믹스 가부시끼가이샤 에폭시 수지 조성물, 전자 부품, 반도체 장치, 반도체 장치의 제조 방법
WO2025109864A1 (ja) * 2023-11-24 2025-05-30 ナミックス株式会社 半導体装置の製造方法及び封止体
JP7671555B1 (ja) * 2023-11-24 2025-05-02 ナミックス株式会社 半導体装置の製造方法及び封止体
WO2026009780A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
WO2026009778A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045123A (ja) * 2006-08-10 2008-02-28 Natl Starch & Chem Investment Holding Corp 熱伝導性材料
JP2009167372A (ja) 2008-01-21 2009-07-30 Sekisui Chem Co Ltd 電気部品用接着剤
JP2009221424A (ja) * 2008-03-18 2009-10-01 Sekisui Chem Co Ltd 電子部品用接着剤
JP2012077129A (ja) 2010-09-30 2012-04-19 Namics Corp 樹脂組成物、および、それを用いた封止材
JP2015013950A (ja) 2013-07-05 2015-01-22 ナガセケムテックス株式会社 エポキシ樹脂組成物

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189247A (ja) * 1984-10-08 1986-05-07 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JP4577536B2 (ja) 1998-12-28 2010-11-10 ナガセケムテックス株式会社 エポキシ樹脂組成物およびそれを用いてｌｓｉを封止する方法
JP5000053B2 (ja) * 2001-09-05 2012-08-15 三菱化学株式会社 液状エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP4047613B2 (ja) * 2002-03-29 2008-02-13 住友ベークライト株式会社 液状封止樹脂及びそれを用いた半導体装置
JP2003335923A (ja) * 2002-05-21 2003-11-28 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及び半導体装置
JP2004099636A (ja) 2002-09-04 2004-04-02 Kyocera Chemical Corp 絶縁ペースト
JP4892164B2 (ja) 2002-12-27 2012-03-07 日立化成工業株式会社 液状エポキシ樹脂組成物及び電子部品装置
JP2005239808A (ja) 2004-02-25 2005-09-08 Konica Minolta Medical & Graphic Inc インクジェット記録用インク
JP2006176678A (ja) 2004-12-22 2006-07-06 Matsushita Electric Works Ltd エポキシ樹脂組成物及び電子部品
JP5217119B2 (ja) 2005-06-15 2013-06-19 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP2007138002A (ja) 2005-11-17 2007-06-07 Yokohama Rubber Co Ltd:The 熱硬化性樹脂組成物
JP5692212B2 (ja) 2005-12-08 2015-04-01 日立化成株式会社 電子部品用液状樹脂組成物及びこれを用いた電子部品装置
JP2007182562A (ja) 2005-12-08 2007-07-19 Hitachi Chem Co Ltd 電子部品用液状樹脂組成物及び電子部品装置
JP5374818B2 (ja) 2006-12-20 2013-12-25 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP5574237B2 (ja) 2008-05-21 2014-08-20 ナガセケムテックス株式会社 電子部品封止用エポキシ樹脂組成物
JP2010118649A (ja) 2008-10-16 2010-05-27 Hitachi Chem Co Ltd 封止用液状樹脂組成物、及びこれを用いた電子部品装置
SG172343A1 (en) * 2008-12-25 2011-07-28 Sumitomo Bakelite Co Liquid resin composition and semiconductor device
SG177684A1 (en) * 2009-07-31 2012-03-29 Sumitomo Bakelite Co Liquid resin composition and semiconductor device formed using same
JP5629168B2 (ja) * 2010-09-10 2014-11-19 積水化学工業株式会社 半導体チップ実装体の製造方法及び半導体装置
JP5617495B2 (ja) 2010-09-29 2014-11-05 住友ベークライト株式会社 半導体装置の製造方法及び半導体装置
JP2012162585A (ja) 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
US9793456B2 (en) 2011-09-30 2017-10-17 Kaneka Corporation Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device
JP2013155363A (ja) 2012-02-01 2013-08-15 Shin-Etsu Chemical Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2013163747A (ja) 2012-02-10 2013-08-22 Sumitomo Bakelite Co Ltd 半導体封止用液状樹脂組成物及び半導体装置
JP6125262B2 (ja) 2013-02-13 2017-05-10 ナミックス株式会社 液状モールド剤、および液状モールド剤の製造方法
JP2014185296A (ja) 2013-03-25 2014-10-02 Asahi Kasei E-Materials Corp 液状樹脂組成物及び加工品
JP6460365B2 (ja) 2014-03-14 2019-01-30 Dic株式会社 樹脂組成物、熱伝導性接着剤及び積層体
JP6331570B2 (ja) 2014-03-28 2018-05-30 日立化成株式会社 アンダーフィル材及び該アンダーフィル材により封止する電子部品とその製造方法
JP5806760B1 (ja) * 2014-05-29 2015-11-10 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
CN105778409A (zh) * 2014-12-18 2016-07-20 北京首科化微电子有限公司 半导体封装用的环氧树脂组合物及其制备方法
KR101900268B1 (ko) 2014-12-25 2018-09-19 쇼와 덴코 가부시키가이샤 열경화성 수지 조성물
JP6539150B2 (ja) * 2015-08-17 2019-07-03 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP6586005B2 (ja) 2015-12-18 2019-10-02 グローブライド株式会社 魚釣用スピニングリール
TWI898612B (zh) * 2017-05-31 2025-09-21 日商力森諾科股份有限公司 壓縮成形用液狀樹脂組成物及電子零件裝置
US11760870B2 (en) 2018-01-23 2023-09-19 Nagase Chemtex Corporation Resin composition for encapsulation
JP2020029494A (ja) 2018-08-21 2020-02-27 日立化成株式会社 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045123A (ja) * 2006-08-10 2008-02-28 Natl Starch & Chem Investment Holding Corp 熱伝導性材料
JP2009167372A (ja) 2008-01-21 2009-07-30 Sekisui Chem Co Ltd 電気部品用接着剤
JP2009221424A (ja) * 2008-03-18 2009-10-01 Sekisui Chem Co Ltd 電子部品用接着剤
JP2012077129A (ja) 2010-09-30 2012-04-19 Namics Corp 樹脂組成物、および、それを用いた封止材
JP2015013950A (ja) 2013-07-05 2015-01-22 ナガセケムテックス株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
KR20200015584A (ko) 2020-02-12
EP3620481B1 (en) 2024-03-27
CN110785451A (zh) 2020-02-11
PT3620481T (pt) 2024-04-08
TW201902974A (zh) 2019-01-16
EP3620481A1 (en) 2020-03-11
JP2022179534A (ja) 2022-12-02
EP3620481A4 (en) 2020-12-09
US12131970B2 (en) 2024-10-29
WO2018221681A1 (ja) 2018-12-06
JP7531557B2 (ja) 2024-08-09
JP7148507B2 (ja) 2022-10-05
TWI786121B (zh) 2022-12-11
US20200194325A1 (en) 2020-06-18
KR20250009019A (ko) 2025-01-16
JPWO2018221681A1 (ja) 2020-07-09

Similar Documents

Publication Publication Date Title
KR102753698B1 (ko) 밀봉용 액상 수지 조성물 및 전자 부품 장치
KR102753702B1 (ko) 압축 성형용 액상 수지 조성물 및 전자 부품 장치
JP2009097013A (ja) 封止用液状樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP2009097014A (ja) 封止用液状樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
KR20180048674A (ko) 수지 조성물, 경화물, 봉지용 필름 및 봉지 구조체
JPWO2019146617A1 (ja) 封止用樹脂組成物
CN117795002A (zh) 环氧树脂组合物、液状压缩模制材料、顶部包封材料以及半导体装置
WO2024134951A1 (ja) エポキシ樹脂組成物、硬化物、及び半導体装置
WO2024202136A1 (ja) エポキシ樹脂組成物、電子部品、半導体装置、半導体装置の製造方法
JP2022060062A (ja) エポキシ樹脂組成物及び電子部品装置
JP2022063247A (ja) アンダーフィル用液状樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2022060063A (ja) エポキシ樹脂組成物及び電子部品装置
CN119562990A (zh) 环氧树脂组合物、半导体装置、以及半导体装置的制造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000