JP5806760B1 - 熱伝導性導電性接着剤組成物 - Google Patents
熱伝導性導電性接着剤組成物 Download PDFInfo
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- JP5806760B1 JP5806760B1 JP2014111769A JP2014111769A JP5806760B1 JP 5806760 B1 JP5806760 B1 JP 5806760B1 JP 2014111769 A JP2014111769 A JP 2014111769A JP 2014111769 A JP2014111769 A JP 2014111769A JP 5806760 B1 JP5806760 B1 JP 5806760B1
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- adhesive composition
- conductive
- acid
- mass
- curing agent
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J121/00—Adhesives based on unspecified rubbers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
Description
1.(A)導電性フィラー、(B)エポキシ樹脂、(C)反応性希釈剤および(D)硬化剤を含む熱伝導性導電性接着剤組成物であって、
前記(A)導電性フィラーは、1〜10μmの平均粒子径を有する銀粉であって、前記(A)導電性フィラーを、前記接着剤組成物の全体量に対して85〜94質量%の範囲で含有し、
前記(B)エポキシ樹脂は、1分子内に2個以上のエポキシ官能基および芳香環を有し、前記(B)エポキシ樹脂を、前記接着剤組成物の全体量に対して1〜8質量%の範囲で含有し、
前記(C)反応性希釈剤は、脂肪族炭化水素鎖に2個以上のグリシジルエーテル官能基を有し、かつ分子量が150〜600であり、前記(C)反応性希釈剤を、前記接着剤組成物の全体量に対して0.2〜5質量%の範囲で含有し、かつ
前記(D)硬化剤は、1分子内に2以上のフェノール官能基または1分子内に2以上のアニリン官能基を有する硬化剤、またはそれらの混合物であり、前記(D)硬化剤を、接着剤組成物の全体量に対して0.2〜3質量%の範囲で含有する
ことを特徴とする熱伝導性導電性接着剤組成物。
2.前記(D)硬化剤との反応性を示さない(E)ゴム系樹脂を、前記接着剤組成物の全体量に対して0.2〜2質量%の範囲でさらに含有する前記1に記載の熱伝導性導電性接着剤組成物。
3.熱伝導性導電性接着剤組成物中の前記(A)導電性フィラーを除いた組成物の回転式粘度計による回転数0.5rpmおよび5rpmの測定値より算出されるTI値(チクソトロピーインデックス)が、1〜3であることを特徴とする前記1に記載の熱伝導性導電性接着剤組成物。
中でも好ましくは、本発明の効果が向上するという観点から、ブタンジオールジグリシジルエーテル、シクロヘキサンジメタノールジグリシジルエーテル、ブチルフェニルグリシジルエーテル等が好ましい。
[式]ネッキング率(%)=100×「1+各導電性フィラー粒子に接続する粒子の総和」÷「導電性フィラー粒子数」
A.接着剤組成物の作製
表1に記載された各材料を三本ロールにて混練し、表1に示す組成の接着剤組成物を作製した(各材料の数値は接着剤組成物の総質量に対する質量%を表す。)。使用した材料は下記の通りである。なお、混練の順番は、(A)成分および(E)成分の混練をまず最初に行い、続いて、その他の各種成分を混合し各成分が均一分散されるように混練を行った。200℃で1時間加熱後に室温まで放冷し接着剤組成物の硬化体を得た。
・銀粉[平均粒子径:5.0μm、田中貴金属工業(株)製]タップ密度6.5g/cm3
・銀粉[平均粒子径:1.5μm、田中貴金属工業(株)製]タップ密度4.7g/cm3
・銀粉[平均粒子径:8.0μm、田中貴金属工業(株)製]タップ密度4.2g/cm3
・ビスフェノールF型エポキシ樹脂[EPICRON EXA−830CRP、DIC(株)製、室温で液状]
・フェノールノボラック型エポキシ樹脂(jER−152、三菱化学(株)社製、室温で液状)
・ナフタレン型エポキシ樹脂(DIC(株)社製HP4032D、室温で液状)
・1,4−ブタンジオールジグリシジルエーテル(分子量202.25)
・1,4−シクロヘキサンジメタノールジグリシジルエーテル(分子量256.34)
・1分子内に2個以上のフェノール官能基を有する化合物[明和化成(株)製MEH8000H]
・1分子内に2個以上のアニリン官能基を有する化合物[東京化成工業(株)製4,4’−ジアミノジフェニルスルホン]
・カルボキシ基を有するアクリロニトリルブタジエンゴム[宇部興産(株)製CTBN−1300×13NA]
・トルエンビスジメチルウレア[Carbon Scientific社製]
・イミダゾール系硬化促進剤[四国化成工業(株)社製2P4MHZ]
・γ−ブチロラクトン
・N−メチルピロリドン
・コアシェル粒[アイカ工業(株)製 AC−3355]
・シランカップリング剤(東レ・ダウコーニング(株)社製Z−6040)
(A)導電性フィラーを除いて接着剤組成物を調製し、その粘度を測定した。粘度は、回転式粘度計としてコーンプレート型粘度計を用い、温度25℃で3°×R14コーンプレートを用い回転数0.5ppmまたは5ppm、温度25℃で測定した。結果を表1に示す。
(A)導電性フィラーを除いて接着剤組成物を調製し、そのTI値を測定した。TI値は、上記回転式粘度計の回転数0.5ppmの測定値を5ppmの測定値で除して算出した。結果を表1に示す。
前記接着剤組成物の熱伝導特性を評価するため、該接着剤組成物の熱伝導率を測定した。熱伝導率λ(W/m・K)は、レーザーフラッシュ法熱定数測定装置 (TC−7000、ULVAC−RIKO社製)を用いてASTM−E1461に準拠して熱拡散aを測定し、ピクノメーター法により室温での比重dを算出し、示差走査熱量測定装置 (DSC7020、セイコー電子工業社製)を用いてJIS−K7123に準拠して室温での比熱Cpを測定して以下の式により算出した。結果を表1に示す。
λ=a×d×Cp
前記接着剤組成物の電気特性を評価するため、該接着剤組成物の体積抵抗率を測定した。体積抵抗率K(×10−4Ω・cm)は、直流電圧・発生源モニタ(R6243、ADVANTEST社製)を用いて、直流4端子法により出現抵抗Rを測定し、測定サンプルの幅W、厚みTおよび長さLから、以下の式により算出した。結果を表1に示す。
K=L/(R×W×T)
接着剤組成物を2×2mm四方の銀メッキされた銅製の基板上にディスペンサーで塗布した後、シリコン製の2×2mm四方の基板で接着剤組成物を銅板と挟む形で戴置し、200℃で1時間の熱処理した後、接着剤組成物の硬化体の垂直断面のSEM画像観察により、ネッキング率を評価した。具体的には、接着剤組成物の硬化体の断面画像の略中心部の任意の5箇所について、夫々30×30μm四方の画像を観察し、各導電性フィラー粒子に接続する粒子の数(1+接続粒子数)の和を導電性フィラー粒子数で序した数値(下記式)の平均値より算出した。算出結果を表1に示す。
[式]ネッキング率(%)=100×「1+各導電性フィラー粒子に接続する粒子の総和」÷「導電性フィラー粒子数」
Claims (3)
- (A)導電性フィラー、(B)エポキシ樹脂、(C)反応性希釈剤および(D)硬化剤を含む熱伝導性導電性接着剤組成物であって、
前記(A)導電性フィラーは、1〜10μmの平均粒子径を有する銀粉であって、前記(A)導電性フィラーを、前記接着剤組成物の全体量に対して85〜94質量%の範囲で含有し、
前記(B)エポキシ樹脂は、1分子内に2個以上のエポキシ官能基および芳香環を有し、前記(B)エポキシ樹脂を、前記接着剤組成物の全体量に対して1〜8質量%の範囲で含有し、
前記(C)反応性希釈剤は、脂肪族炭化水素鎖に2個以上のグリシジルエーテル官能基を有し、かつ分子量が150〜600であり、前記(C)反応性希釈剤を、前記接着剤組成物の全体量に対して0.2〜5質量%の範囲で含有し、かつ
前記(D)硬化剤は、1分子内に2以上のフェノール官能基または1分子内に2以上のアニリン官能基を有する硬化剤、またはそれらの混合物であり、前記(D)硬化剤を、接着剤組成物の全体量に対して0.2〜3質量%の範囲で含有する
ことを特徴とする熱伝導性導電性接着剤組成物。 - 前記(D)硬化剤との反応性を示さない(E)ゴム系樹脂を、前記接着剤組成物の全体量に対して0.2〜2質量%の範囲でさらに含有する請求項1に記載の熱伝導性導電性接着剤組成物。
- 熱伝導性導電性接着剤組成物中の前記(A)導電性フィラーを除いた組成物の回転式粘度計による回転数0.5rpmおよび5rpmの測定値より算出されるTI値(チクソトロピーインデックス)が、1〜3であることを特徴とする請求項1に記載の熱伝導性導電性接着剤組成物。
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