CN112391135B - 粘合组合物及其制备方法和应用 - Google Patents
粘合组合物及其制备方法和应用 Download PDFInfo
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- CN112391135B CN112391135B CN201910751599.5A CN201910751599A CN112391135B CN 112391135 B CN112391135 B CN 112391135B CN 201910751599 A CN201910751599 A CN 201910751599A CN 112391135 B CN112391135 B CN 112391135B
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- 239000000203 mixture Substances 0.000 title claims abstract description 262
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 247
- 239000000853 adhesive Substances 0.000 title claims abstract description 243
- 238000002360 preparation method Methods 0.000 title claims abstract description 31
- 239000002994 raw material Substances 0.000 claims abstract description 71
- 239000004332 silver Substances 0.000 claims abstract description 71
- 229910052709 silver Inorganic materials 0.000 claims abstract description 71
- 239000003822 epoxy resin Substances 0.000 claims abstract description 63
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 63
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 47
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000002156 mixing Methods 0.000 claims description 55
- 239000004094 surface-active agent Substances 0.000 claims description 43
- 239000007822 coupling agent Substances 0.000 claims description 39
- 239000003963 antioxidant agent Substances 0.000 claims description 36
- 239000003085 diluting agent Substances 0.000 claims description 35
- 239000004014 plasticizer Substances 0.000 claims description 35
- 230000003078 antioxidant effect Effects 0.000 claims description 34
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 claims description 33
- 239000002518 antifoaming agent Substances 0.000 claims description 25
- 239000013530 defoamer Substances 0.000 claims description 24
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 19
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 19
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- APQIUTYORBAGEZ-UHFFFAOYSA-N 1,1-dibromoethane Chemical compound CC(Br)Br APQIUTYORBAGEZ-UHFFFAOYSA-N 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 9
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 8
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 8
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 7
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 7
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 7
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 7
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 68
- 238000001723 curing Methods 0.000 description 58
- 239000002245 particle Substances 0.000 description 38
- RNMDNPCBIKJCQP-UHFFFAOYSA-N 5-nonyl-7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-ol Chemical compound C(CCCCCCCC)C1=C2C(=C(C=C1)O)O2 RNMDNPCBIKJCQP-UHFFFAOYSA-N 0.000 description 9
- -1 polyoxyethylene nonylphenol Polymers 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000013508 migration Methods 0.000 description 8
- 230000005012 migration Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 230000003685 thermal hair damage Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004925 denaturation Methods 0.000 description 2
- 230000036425 denaturation Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
电阻率(10-4Ω·cm) | 粘结力(Mpa) | |
实施例1 | 1.6 | 25.2 |
实施例2 | 1.8 | 26.0 |
实施例3 | 1.5 | 26.8 |
实施例4 | 1.5 | 28.3 |
实施例5 | 1.7 | 28.9 |
实施例6 | 1.3 | 30.4 |
实施例7 | 1.2 | 28.8 |
实施例8 | 1.0 | 29.1 |
实施例9 | 1.5 | 23.4 |
实施例10 | 1.6 | 22.8 |
实施例11 | 5.9 | 24.0 |
实施例12 | 8.2 | 25.6 |
实施例13 | 9.5 | 26.3 |
对比例 | 5.5 | 28.5 |
Claims (16)
Priority Applications (1)
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CN201910751599.5A CN112391135B (zh) | 2019-08-14 | 2019-08-14 | 粘合组合物及其制备方法和应用 |
Applications Claiming Priority (1)
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CN201910751599.5A CN112391135B (zh) | 2019-08-14 | 2019-08-14 | 粘合组合物及其制备方法和应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112391135A CN112391135A (zh) | 2021-02-23 |
CN112391135B true CN112391135B (zh) | 2023-10-13 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910751599.5A Active CN112391135B (zh) | 2019-08-14 | 2019-08-14 | 粘合组合物及其制备方法和应用 |
Country Status (1)
Country | Link |
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CN (1) | CN112391135B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113088215A (zh) * | 2021-04-16 | 2021-07-09 | 厦门韦尔通科技有限公司 | 一种用于手机摄像头模组封装的导电胶及其使用方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU1657522A1 (ru) * | 1989-02-13 | 1991-06-23 | Предприятие П/Я А-1120 | Токопровод ща клеева композици |
CN1076934A (zh) * | 1992-04-03 | 1993-10-06 | 国际壳牌研究有限公司 | 位阻环氧化聚合物的一种化学交联法 |
JPH06333415A (ja) * | 1993-05-21 | 1994-12-02 | Hitachi Chem Co Ltd | 導電ペースト |
CN1542076A (zh) * | 2002-12-02 | 2004-11-03 | 日东电工株式会社 | 粘合剂组合物,粘合膜及使用其的半导体器件 |
CN1788062A (zh) * | 2003-02-28 | 2006-06-14 | 国家淀粉及化学投资控股公司 | 用于电子设备的具有电稳定性和良好抗冲击性的导电性粘合剂组合物 |
CN1978483A (zh) * | 2005-11-30 | 2007-06-13 | 北京航空航天大学 | 一种活性环氧增韧固化剂及其制备方法 |
KR20100000726A (ko) * | 2008-06-25 | 2010-01-06 | 주식회사 엘지화학 | 안트라센계 에폭시 수지를 포함하는 이방 도전성 접착재료및 이를 이용하는 회로접속 구조체 |
CN102212246A (zh) * | 2010-04-07 | 2011-10-12 | 信越化学工业株式会社 | 光半导体密封用环氧组成物及其制造方法,及硬化物 |
CN106459718A (zh) * | 2014-05-29 | 2017-02-22 | 田中贵金属工业株式会社 | 导热性导电性粘接剂组合物 |
CN109486462A (zh) * | 2018-11-20 | 2019-03-19 | 东莞市新懿电子材料技术有限公司 | 一种导电银胶及其制备方法 |
-
2019
- 2019-08-14 CN CN201910751599.5A patent/CN112391135B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU1657522A1 (ru) * | 1989-02-13 | 1991-06-23 | Предприятие П/Я А-1120 | Токопровод ща клеева композици |
CN1076934A (zh) * | 1992-04-03 | 1993-10-06 | 国际壳牌研究有限公司 | 位阻环氧化聚合物的一种化学交联法 |
JPH06333415A (ja) * | 1993-05-21 | 1994-12-02 | Hitachi Chem Co Ltd | 導電ペースト |
CN1542076A (zh) * | 2002-12-02 | 2004-11-03 | 日东电工株式会社 | 粘合剂组合物,粘合膜及使用其的半导体器件 |
CN1788062A (zh) * | 2003-02-28 | 2006-06-14 | 国家淀粉及化学投资控股公司 | 用于电子设备的具有电稳定性和良好抗冲击性的导电性粘合剂组合物 |
CN1978483A (zh) * | 2005-11-30 | 2007-06-13 | 北京航空航天大学 | 一种活性环氧增韧固化剂及其制备方法 |
KR20100000726A (ko) * | 2008-06-25 | 2010-01-06 | 주식회사 엘지화학 | 안트라센계 에폭시 수지를 포함하는 이방 도전성 접착재료및 이를 이용하는 회로접속 구조체 |
CN102212246A (zh) * | 2010-04-07 | 2011-10-12 | 信越化学工业株式会社 | 光半导体密封用环氧组成物及其制造方法,及硬化物 |
CN106459718A (zh) * | 2014-05-29 | 2017-02-22 | 田中贵金属工业株式会社 | 导热性导电性粘接剂组合物 |
CN109486462A (zh) * | 2018-11-20 | 2019-03-19 | 东莞市新懿电子材料技术有限公司 | 一种导电银胶及其制备方法 |
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