CN106190008A - 一种led用高热导率导电胶的制备工艺 - Google Patents
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Abstract
本发明涉及一种LED用高热导率导电胶的制备工艺，制备步骤如下：1)合金粉的制备，称取纳米银粉、五氧化二钒、纳米氧化钡、铝粉、甲基三乙氧基硅烷、丙酮；将各原料按配比在1500℃～1650℃、低于10‑3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；2)导电胶的制备，按质量百分含量计，将有机硅树脂、二乙醇胺、环氧丙烯酸树脂、表面活性剂、固化剂，搅拌均匀，缓慢加入合金粉，搅拌均匀，真空除泡，制得所述LED用高热导率导电胶。本发明的技术优点在于：本发明导电胶配方中的合金粉具有较好的分散稳定性，制得的导电胶电阻率低、热导率高、粘结性能佳、使用寿命长。
Description
技术领域
本发明属于电子材料技术领域，具体涉及一种LED用高热导率导电胶的制备工艺。
背景技术
LED用导电胶，是用于LED芯片和基材的连接，能够同时实现导热和导电的功能。导电胶粘剂也称导电胶，是由基体树脂、固化剂及导电填料构成的在一定温度下固化或者干燥后即能有效地粘接基板材料，又能具有导电性能的特殊胶粘剂。导电胶按基体组成可分为结构型和填充型两大类。结构型是指作为导电胶基体的高分子材料本身即具有导电性的导电胶；填充型是指通常胶粘剂作为基体，而依靠添加导电性填料使胶液具有导电作用的导电胶。目前导电高分子材料的制备离实际应用还有较大的距离，因此广泛使用的均为填充型导电胶。如环氧树脂胶黏剂可以在室温至150℃固化，远低于锡铅焊接的200℃以上的焊接温度，这就避免了焊接高温可能导致的材料变形、电子器件的热损伤和内应力的形成。同时，由于电子元件的小型化、微型化及印刷电路板的高密度化和高度集成化的迅速发展，铅锡焊接的0.65mm的最小节距远远满足不了导电连接的实际需求，而导电胶可以制成浆料，实现很高的线分辨率。
LED产业的发展方向是朝高亮度、超高亮度的大功率方向发展，从而对导电胶提出了更高的要求，大功率LED对导电胶的散热性，传统的导热胶热导率低于10W/m·K，而高亮度大功率LED芯片的散热要求高于20W/m·K；开发合适的固化体系，使导电胶能在室温下长时间储存，避免高昂的运输成本和储存成本；接触电阻的稳定性和电气性能的可靠性。因此，如何开发电阻率低、热导率高、粘结性能佳的LED用导电胶日益迫切。
发明内容
本发明的目的在于提供一种LED用高热导率导电胶的制备工艺，有效解决大功率LED芯片长期工作后的散热性问题。
实现本发明的目的的技术方案为：一种LED用高热导率导电胶的制备工艺，制备步骤如下：
1)合金粉的制备
称取纳米银粉80～100份、五氧化二钒8～15份、氧化钡20～30份、铝粉40～50份、甲基三乙氧基硅烷10～15份、丙酮6～10份；将各原料按配比在1500℃～1650℃、低于10- 3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；
2)导电胶的制备
按质量百分含量计，将有机硅树脂10％～15％、二乙醇胺2％～5％、环氧丙烯酸树脂4％～6％、表面活性剂0.3％～0.7％、固化剂3％～8％，搅拌均匀，缓慢加入步骤1)所得到的合金粉65％～75％，搅拌均匀，真空除泡，制得所述LED用高热导率导电胶。
优选的，本发明所述的固化剂为四氢苯酐、甲基四氢苯酐、六氢苯酐、甲基六氢苯酐、甲基纳迪克酸酐、十二烷基顺丁烯二酸酐中的一种或多种混合物。
优选的，本发明所述的表面活性剂为椰油酸二乙醇酰胺、脂肪醇聚氧乙烯醚、壬基酚聚氧乙烯醚中的一种或多种混合物。
优选的，本发明所述的步骤1)使用的活性低的气体是选自氩气或氮气。
本发明的技术优点在于：本发明导电胶配方中的合金粉具有较好的分散稳定性，制得的导电胶电阻率低、热导率高、粘结性能佳、使用寿命长。
具体实施方式
下面结合实施例对本发明做进一步的描述。
一种LED用高热导率导电胶的制备工艺，制备步骤如下：
实施例1：
1)合金粉的制备
称取纳米银粉80份、五氧化二钒8份、氧化钡20份、铝粉40份、甲基三乙氧基硅烷10份、丙酮6份；将各原料按配比在1500℃～1650℃、低于10-3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；
2)导电胶的制备
按质量百分含量计，将有机硅树脂10％、二乙醇胺2％、环氧丙烯酸树脂4％、表面活性剂0.3％、固化剂3％，搅拌均匀，缓慢加入步骤1)所得到的合金粉65％，搅拌均匀，真空除泡，制得所述LED用高热导率导电胶。
实施例2
1)合金粉的制备
称取纳米银粉100份、五氧化二钒15份、氧化钡30份、铝粉50份、甲基三乙氧基硅烷15份、丙酮10份；将各原料按配比在1500℃～1650℃、低于10-3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；
2)导电胶的制备
按质量百分含量计，将有机硅树脂15％、二乙醇胺5％、环氧丙烯酸树脂6％、表面活性剂0.7％、固化剂8％，搅拌均匀，缓慢加入步骤1)所得到的合金粉75％，搅拌均匀，真空除泡，制得所述LED用高热导率导电胶。
上述实施例1～2中，所选的固化剂为四氢苯酐、甲基四氢苯酐、六氢苯酐、甲基六氢苯酐、甲基纳迪克酸酐、十二烷基顺丁烯二酸酐中的一种或多种混合物。所选的表面活性剂为椰油酸二乙醇酰胺、脂肪醇聚氧乙烯醚、壬基酚聚氧乙烯醚中的一种或多种混合物。所选的活性低的气体是选自氩气或氮气。
对实施例1～2所制得的导电胶进行性能的测试，体积电阻率约10-5～10-4Ω·cm，导热系数约24.0W/m·K，粘度约48000mPa.s。
同时，将实施例1～2所制得的导电胶室温放置2个月后进行粘度的测试，粘度约48100mPa.s，可以看出制得的导电胶具有很好的粘度稳定性。
上述各实施方案是对本发明的上述内容作出的进一步说明，但不应理解为本发明上述主题的范围仅限于上述实施例。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
Claims (4)
1.一种LED用高热导率导电胶的制备工艺，其特征在于制备步骤如下：
1)合金粉的制备
称取纳米银粉80～100份、五氧化二钒8～15份、氧化钡20～30份、铝粉40～50份、甲基三乙氧基硅烷10～15份、丙酮6～10份；将各原料按配比在1500℃～1650℃、低于10-3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；
2)导电胶的制备
按质量百分含量计，将有机硅树脂10％～15％、二乙醇胺2％～5％、环氧丙烯酸树脂4％～6％、表面活性剂0.3％～0.7％、固化剂3％～8％，搅拌均匀，缓慢加入步骤1)所得到的合金粉65％～75％，搅拌均匀，真空除泡，制得所述LED用高热导率导电胶。
2.根据权利要求1所述的一种或多种混合物LED用高热导率导电胶的制备工艺，其特征在于：步骤2)中所述的固化剂为四氢苯酐、甲基四氢苯酐、六氢苯酐、甲基六氢苯酐、甲基纳迪克酸酐、十二烷基顺丁烯二酸酐中的一种或多种混合物。
3.根据权利要求1所述的一种或多种混合物LED用高热导率导电胶的制备工艺，其特征在于：步骤2)中所述的表面活性剂为椰油酸二乙醇酰胺、脂肪醇聚氧乙烯醚、壬基酚聚氧乙烯醚中的一种或多种混合物。
4.根据权利要求1所述的一种或多种混合物LED用高热导率导电胶的制备工艺，其特征在于：所述的步骤1)使用的活性低的气体是选自氩气或氮气。
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106700994A (zh) * | 2016-12-13 | 2017-05-24 | 安徽兆利光电科技有限公司 | 一种led灯用银胶 |
| CN106800803A (zh) * | 2016-12-13 | 2017-06-06 | 安徽兆利光电科技有限公司 | 一种用于led灯银胶中的改性纳米银粉的制备方法 |
| CN112143235A (zh) * | 2020-09-26 | 2020-12-29 | 追信数字科技有限公司 | 一种合氏合金制耐蚀耐热换热管及其制造方法 |
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| CN102646458A (zh) * | 2011-02-16 | 2012-08-22 | 中国钢铁股份有限公司 | 无铅导电胶及其制造方法 |
| CN105462533A (zh) * | 2016-01-25 | 2016-04-06 | 南阳理工学院 | 一种大功率led封装用导电银胶及其制备方法 |
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| CN102646458A (zh) * | 2011-02-16 | 2012-08-22 | 中国钢铁股份有限公司 | 无铅导电胶及其制造方法 |
| CN105462533A (zh) * | 2016-01-25 | 2016-04-06 | 南阳理工学院 | 一种大功率led封装用导电银胶及其制备方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106700994A (zh) * | 2016-12-13 | 2017-05-24 | 安徽兆利光电科技有限公司 | 一种led灯用银胶 |
| CN106800803A (zh) * | 2016-12-13 | 2017-06-06 | 安徽兆利光电科技有限公司 | 一种用于led灯银胶中的改性纳米银粉的制备方法 |
| CN112143235A (zh) * | 2020-09-26 | 2020-12-29 | 追信数字科技有限公司 | 一种合氏合金制耐蚀耐热换热管及其制造方法 |
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