CN106189974A - 一种led用粘结性好导电胶的制备工艺 - Google Patents
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- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 15
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000003756 stirring Methods 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 230000000694 effects Effects 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- KVBYPTUGEKVEIJ-UHFFFAOYSA-N benzene-1,3-diol;formaldehyde Chemical compound O=C.OC1=CC=CC(O)=C1 KVBYPTUGEKVEIJ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000010439 graphite Substances 0.000 claims abstract description 5
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 5
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims abstract description 5
- 238000000889 atomisation Methods 0.000 claims abstract description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 claims description 3
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 claims description 3
- BRLPEEKPYKAERE-UHFFFAOYSA-N 3-dodecylfuran-2,5-dione Chemical compound CCCCCCCCCCCCC1=CC(=O)OC1=O BRLPEEKPYKAERE-UHFFFAOYSA-N 0.000 claims description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- FUGIIBWTNARRSF-UHFFFAOYSA-N decane-5,6-diol Chemical compound CCCCC(O)C(O)CCCC FUGIIBWTNARRSF-UHFFFAOYSA-N 0.000 claims description 3
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 claims description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 3
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- -1 silicane alkane Chemical class 0.000 claims description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 abstract description 6
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 abstract description 4
- 238000002454 metastable transfer emission spectrometry Methods 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 2
- 230000006641 stabilisation Effects 0.000 abstract description 2
- 238000011105 stabilization Methods 0.000 abstract description 2
- 239000005543 nano-size silicon particle Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000500881 Lepisma Species 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明涉及一种LED用粘结性好导电胶的制备工艺，制备步骤如下：1)合金粉的制备，称取纳米银粉、三氧化二硼、纳米二氧化硅、钯粉、甲基三乙氧基硅烷、石墨；将各原料按配比在1500℃～1650℃、低于10‑3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；2)导电胶的制备，按质量百分含量计，将海因环氧树脂、间苯二酚甲醛树脂、亚磷酸三苯脂、醚类溶剂、固化剂，搅拌均匀，缓慢加入合金粉，搅拌均匀，真空除泡，制得所述LED用粘结性好导电胶。本发明导电胶配方中的合金粉具有较好的分散稳定性，制得的导电胶电阻率低、热导率高、粘结性能佳、使用寿命长。
Description
技术领域
本发明属于电子材料技术领域，具体涉及一种LED用粘结性好导电胶的制备工艺。
背景技术
LED用导电胶，是用于LED芯片和基材的连接，能够同时实现导热和导电的功能。导电胶粘剂也称导电胶，是由基体树脂、固化剂及导电填料构成的在一定温度下固化或者干燥后即能有效地粘接基板材料，又能具有导电性能的特殊胶粘剂。导电胶按基体组成可分为结构型和填充型两大类。结构型是指作为导电胶基体的高分子材料本身即具有导电性的导电胶；填充型是指通常胶粘剂作为基体，而依靠添加导电性填料使胶液具有导电作用的导电胶。目前导电高分子材料的制备离实际应用还有较大的距离，因此广泛使用的均为填充型导电胶。如环氧树脂胶黏剂可以在室温至150℃固化，远低于锡铅焊接的200℃以上的焊接温度，这就避免了焊接高温可能导致的材料变形、电子器件的热损伤和内应力的形成。同时，由于电子元件的小型化、微型化及印刷电路板的高密度化和高度集成化的迅速发展，铅锡焊接的0.65mm的最小节距远远满足不了导电连接的实际需求，而导电胶可以制成浆料，实现很高的线分辨率。
LED产业的发展方向是朝高亮度、超高亮度的大功率方向发展，从而对导电胶提出了更高的要求，大功率LED对导电胶的散热性，传统的导热胶热导率低于10W/m·K，而高亮度大功率LED芯片的散热要求高于20W/m·K；开发合适的固化体系，使导电胶能在室温下长时间储存，避免高昂的运输成本和储存成本；接触电阻的稳定性和电气性能的可靠性。因此，如何开发电阻率低、热导率高、粘结性能佳的LED用导电胶日益迫切。
发明内容
本发明的目的在于提供一种LED用粘结性好导电胶的制备工艺，有效解决大功率LED芯片长期工作后的散热性问题。
实现本发明的目的的技术方案为：一种LED用粘结性好导电胶的制备工艺，制备步骤如下：
1)合金粉的制备
称取纳米银粉80～100份、三氧化二硼8～15份、二氧化硅20～30份、钯粉40～50份、甲基三乙氧基硅烷10～15份、石墨6～10份；将各原料按配比在1500℃～1650℃、低于10-3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；
2)导电胶的制备
按质量百分含量计，将海因环氧树脂10％～15％、间苯二酚甲醛树脂2％～5％、亚磷酸三苯脂4％～6％、醚类溶剂0.3％～0.7％、固化剂3％～8％，搅拌均匀，缓慢加入步骤1)所得到的合金粉65％～75％，搅拌均匀，真空除泡，制得所述LED用粘结性好导电胶。
优选的，本发明所述的固化剂为四氢苯酐、甲基四氢苯酐、六氢苯酐、甲基六氢苯酐、甲基纳迪克酸酐、十二烷基顺丁烯二酸酐中的一种或多种混合物。
优选的，本发明所述的醚类溶剂为三乙二醇单甲醚、三乙二醇单乙醚、四乙二醇单甲醚、四乙二醇二甲醚、二乙二醇二丁醚中的一种或多种混合物。
优选的，本发明所述的步骤1)使用的活性低的气体是选自氩气或氮气。
本发明的技术优点在于：本发明导电胶配方中的合金粉具有较好的分散稳定性，制得的导电胶电阻率低、热导率高、粘结性能佳、使用寿命长。
具体实施方式
下面结合实施例对本发明做进一步的描述。
一种LED用粘结性好导电胶的制备工艺，制备步骤如下：
实施例1：
1)合金粉的制备
称取纳米银粉80份、三氧化二硼8份、二氧化硅20份、钯粉40份、甲基三乙氧基硅烷10份、石墨6份；将各原料按配比在1500℃～1650℃、低于10-3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；
2)导电胶的制备
按质量百分含量计，将海因环氧树脂10％、间苯二酚甲醛树脂2％、亚磷酸三苯脂4％、醚类溶剂0.3％、固化剂3％，搅拌均匀，缓慢加入步骤1)所得到的合金粉65％，搅拌均匀，真空除泡，制得所述LED用粘结性好导电胶。
实施例2
1)合金粉的制备
称取纳米银粉100份、三氧化二硼15份、二氧化硅30份、钯粉50份、甲基三乙氧基硅烷15份、石墨10份；将各原料按配比在1500℃～1650℃、低于10-3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；
2)导电胶的制备
按质量百分含量计，将海因环氧树脂15％、间苯二酚甲醛树脂5％、亚磷酸三苯脂6％、醚类溶剂0.7％、固化剂8％，搅拌均匀，缓慢加入步骤1)所得到的合金粉75％，搅拌均匀，真空除泡，制得所述LED用粘结性好导电胶。
上述实施例1～2中，所选的固化剂为四氢苯酐、甲基四氢苯酐、六氢苯酐、甲基六氢苯酐、甲基纳迪克酸酐、十二烷基顺丁烯二酸酐中的一种或多种混合物。所选的醚类溶剂为三乙二醇单甲醚、三乙二醇单乙醚、四乙二醇单甲醚、四乙二醇二甲醚、二乙二醇二丁醚中的一种或多种混合物。所选的活性低的气体是选自氩气或氮气。
对实施例1～2所制得的导电胶进行性能的测试，体积电阻率约10-5～10-4Ω·cm，导热系数约24.0W/m·K，粘度约48000mPa.s。
同时，将实施例1～2所制得的导电胶室温放置2个月后进行粘度的测试，粘度约48100mPa.s，可以看出制得的导电胶具有很好的粘度稳定性。
上述各实施方案是对本发明的上述内容作出的进一步说明，但不应理解为本发明上述主题的范围仅限于上述实施例。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
Claims (4)
1.一种LED用粘结性好导电胶的制备工艺，其特征在于制备步骤如下：
1)合金粉的制备
称取纳米银粉80～100份、三氧化二硼8～15份、二氧化硅20～30份、钯粉40～50份、甲基三乙氧基硅烷10～15份、石墨6～10份；将各原料按配比在1500℃～1650℃、低于10-3torr的真空度熔炼成均质合金溶液，用活性低的气体以20～30atm的压力喷击以瞬间雾化而制得合金粉；
2)导电胶的制备
按质量百分含量计，将海因环氧树脂10％～15％、间苯二酚甲醛树脂2％～5％、亚磷酸三苯脂4％～6％、醚类溶剂0.3％～0.7％、固化剂3％～8％，搅拌均匀，缓慢加入步骤1)所得到的合金粉65％～75％，搅拌均匀，真空除泡，制得所述LED用粘结性好导电胶。
2.根据权利要求1所述的一种或多种混合物LED用粘结性好导电胶的制备工艺，其特征在于：步骤2)中所述的固化剂为四氢苯酐、甲基四氢苯酐、六氢苯酐、甲基六氢苯酐、甲基纳迪克酸酐、十二烷基顺丁烯二酸酐中的一种或多种混合物。
3.根据权利要求1所述的一种或多种混合物LED用粘结性好导电胶的制备工艺，其特征在于：步骤2)中所述的醚类溶剂为三乙二醇单甲醚、三乙二醇单乙醚、四乙二醇单甲醚、四乙二醇二甲醚、二乙二醇二丁醚中的一种或多种混合物。
4.根据权利要求1所述的一种或多种混合物LED用粘结性好导电胶的制备工艺，其特征在于：所述的步骤1)使用的活性低的气体是选自氩气或氮气。
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| CN113178436A (zh) * | 2021-04-23 | 2021-07-27 | 广州市鸿利显示电子有限公司 | 一种显示组件及其制备方法 |
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| CN103320072A (zh) * | 2013-05-23 | 2013-09-25 | 苏州富通高新材料科技股份有限公司 | 一种石墨基环氧树脂导电胶及其制备方法 |
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