KR102644561B1 - 절단 장치 및 절단품의 제조 방법 - Google Patents
절단 장치 및 절단품의 제조 방법 Download PDFInfo
- Publication number
- KR102644561B1 KR102644561B1 KR1020210111568A KR20210111568A KR102644561B1 KR 102644561 B1 KR102644561 B1 KR 102644561B1 KR 1020210111568 A KR1020210111568 A KR 1020210111568A KR 20210111568 A KR20210111568 A KR 20210111568A KR 102644561 B1 KR102644561 B1 KR 102644561B1
- Authority
- KR
- South Korea
- Prior art keywords
- unit
- blade
- spindle
- cutting device
- detector
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 102
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000001514 detection method Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 26
- 238000010586 diagram Methods 0.000 description 20
- 239000000835 fiber Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/007—Control means comprising cameras, vision or image processing systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
- B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Forests & Forestry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020142270A JP7354069B2 (ja) | 2020-08-26 | 2020-08-26 | 切断装置、及び、切断品の製造方法 |
JPJP-P-2020-142270 | 2020-08-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20220027028A KR20220027028A (ko) | 2022-03-07 |
KR102644561B1 true KR102644561B1 (ko) | 2024-03-08 |
Family
ID=80441013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020210111568A KR102644561B1 (ko) | 2020-08-26 | 2021-08-24 | 절단 장치 및 절단품의 제조 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7354069B2 (zh) |
KR (1) | KR102644561B1 (zh) |
CN (1) | CN114102718B (zh) |
TW (1) | TWI827967B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006116690A (ja) | 2004-09-22 | 2006-05-11 | Disco Abrasive Syst Ltd | 切削装置 |
JP2009012127A (ja) * | 2007-07-05 | 2009-01-22 | Disco Abrasive Syst Ltd | 切削装置 |
JP2012040651A (ja) | 2010-08-20 | 2012-03-01 | Disco Corp | 切削ブレード検出機構 |
JP2012052813A (ja) | 2010-08-31 | 2012-03-15 | Sophia School Corp | 回転体の回転軸心の運動の軌跡を計測する方法及び計測システム |
KR101440642B1 (ko) * | 2009-08-03 | 2014-09-25 | 두산인프라코어 주식회사 | 공작기계의 공구 파손 검출장치 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08288244A (ja) * | 1995-04-11 | 1996-11-01 | Disco Abrasive Syst Ltd | 光学検出手段 |
JP4312304B2 (ja) * | 1999-07-13 | 2009-08-12 | 株式会社ディスコ | Csp基板分割装置 |
JP4590060B2 (ja) * | 2000-04-14 | 2010-12-01 | 株式会社ディスコ | 切削装置 |
JP2006278869A (ja) * | 2005-03-30 | 2006-10-12 | Disco Abrasive Syst Ltd | ウェーハの切削方法及び切削装置 |
JP4679209B2 (ja) * | 2005-04-04 | 2011-04-27 | 株式会社ディスコ | 切削装置およびブレード状態検出方法 |
JP4512557B2 (ja) * | 2006-01-26 | 2010-07-28 | ユニオンツール株式会社 | 位置検出装置 |
JP5068621B2 (ja) * | 2007-10-03 | 2012-11-07 | 株式会社ディスコ | 切削装置 |
JP2012080029A (ja) * | 2010-10-06 | 2012-04-19 | Disco Abrasive Syst Ltd | 切削装置 |
JP2013258205A (ja) * | 2012-06-11 | 2013-12-26 | Disco Abrasive Syst Ltd | 切削装置 |
JP6125867B2 (ja) | 2013-03-26 | 2017-05-10 | 株式会社ディスコ | 切削方法 |
US9263352B2 (en) * | 2014-01-03 | 2016-02-16 | Asm Technology Singapore Pte Ltd | Singulation apparatus comprising an imaging device |
JP5897686B1 (ja) * | 2014-10-24 | 2016-03-30 | Towa株式会社 | ワーク吸着板、ワーク切断装置、ワーク切断方法、およびワーク吸着板の製造方法 |
JP6509589B2 (ja) * | 2015-03-04 | 2019-05-08 | 株式会社ディスコ | 切削装置 |
JP6491044B2 (ja) * | 2015-05-29 | 2019-03-27 | Towa株式会社 | 製造装置及び製造方法 |
JP6541546B2 (ja) * | 2015-10-21 | 2019-07-10 | 株式会社ディスコ | 切削装置 |
JP6746198B2 (ja) * | 2016-04-01 | 2020-08-26 | 株式会社ディスコ | 切削装置 |
JP6791581B2 (ja) * | 2016-11-11 | 2020-11-25 | 株式会社ディスコ | パッケージ基板切断用治具テーブル |
JP6932436B2 (ja) * | 2017-05-24 | 2021-09-08 | 株式会社ディスコ | 切削装置 |
JP7102157B2 (ja) * | 2018-02-08 | 2022-07-19 | Towa株式会社 | 切断装置及び切断品の製造方法 |
-
2020
- 2020-08-26 JP JP2020142270A patent/JP7354069B2/ja active Active
-
2021
- 2021-08-19 TW TW110130635A patent/TWI827967B/zh active
- 2021-08-24 KR KR1020210111568A patent/KR102644561B1/ko active IP Right Grant
- 2021-08-24 CN CN202110972665.9A patent/CN114102718B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006116690A (ja) | 2004-09-22 | 2006-05-11 | Disco Abrasive Syst Ltd | 切削装置 |
JP2009012127A (ja) * | 2007-07-05 | 2009-01-22 | Disco Abrasive Syst Ltd | 切削装置 |
KR101440642B1 (ko) * | 2009-08-03 | 2014-09-25 | 두산인프라코어 주식회사 | 공작기계의 공구 파손 검출장치 |
JP2012040651A (ja) | 2010-08-20 | 2012-03-01 | Disco Corp | 切削ブレード検出機構 |
JP2012052813A (ja) | 2010-08-31 | 2012-03-15 | Sophia School Corp | 回転体の回転軸心の運動の軌跡を計測する方法及び計測システム |
Also Published As
Publication number | Publication date |
---|---|
CN114102718A (zh) | 2022-03-01 |
CN114102718B (zh) | 2024-01-30 |
TW202209462A (zh) | 2022-03-01 |
TWI827967B (zh) | 2024-01-01 |
JP2022038006A (ja) | 2022-03-10 |
KR20220027028A (ko) | 2022-03-07 |
JP7354069B2 (ja) | 2023-10-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1003212A2 (en) | Method of and apparatus for bonding light-emitting element | |
CN110249199B (zh) | 接合装置以及接合对象物的高度检测方法 | |
JP2009233785A (ja) | 工作機械の位置測定方法とその装置 | |
US20230135060A1 (en) | Method and apparatus for wafer bonding | |
US6392247B1 (en) | Sensor and detection system having wide diverging beam optics | |
US20230131499A1 (en) | Wafer bonding apparatus and method | |
KR102644561B1 (ko) | 절단 장치 및 절단품의 제조 방법 | |
US10746535B2 (en) | Inspecting device and method for component with two wires | |
US6839958B2 (en) | Apparatus for mounting semiconductor chips | |
KR102673712B1 (ko) | 절단 장치 및 절단품의 제조 방법 | |
GB2541636A (en) | System and method for the determination of a position of a pipettor needle | |
US6857554B2 (en) | Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder | |
US8093540B2 (en) | Method of focus and automatic focusing apparatus and detecting module thereof | |
CN114055647B (zh) | 切割装置以及切割品的制造方法 | |
JPH05253685A (ja) | レーザ加工装置 | |
JP6256316B2 (ja) | 変位センサ及び変位測定装置 | |
JP7394712B2 (ja) | 切断装置及び切断品の製造方法 | |
CN115655662B (zh) | 边发射半导体激光器精准测试方法以及系统 | |
JPH0625011Y2 (ja) | 半導体チップの基準線検出装置 | |
JPH0489513A (ja) | 位置検出装置及びその検出動作制御方式 | |
JPH01147509A (ja) | 光通信用ファイバモジュールの光軸合わせ装置 | |
JP2010249697A (ja) | 光学式測距装置、およびそれを用いた電子機器 | |
JPH04177715A (ja) | 半導体装置 | |
JPS5821106A (ja) | 位置検出方法 | |
JPH03285104A (ja) | 非接触式デジタイザ用スキヤニングヘツド |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |