KR102644561B1 - 절단 장치 및 절단품의 제조 방법 - Google Patents

절단 장치 및 절단품의 제조 방법 Download PDF

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Publication number
KR102644561B1
KR102644561B1 KR1020210111568A KR20210111568A KR102644561B1 KR 102644561 B1 KR102644561 B1 KR 102644561B1 KR 1020210111568 A KR1020210111568 A KR 1020210111568A KR 20210111568 A KR20210111568 A KR 20210111568A KR 102644561 B1 KR102644561 B1 KR 102644561B1
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KR
South Korea
Prior art keywords
unit
blade
spindle
cutting device
detector
Prior art date
Application number
KR1020210111568A
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English (en)
Korean (ko)
Other versions
KR20220027028A (ko
Inventor
쇼이치 가타오카
이치로 이마이
하루키 이구치
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20220027028A publication Critical patent/KR20220027028A/ko
Application granted granted Critical
Publication of KR102644561B1 publication Critical patent/KR102644561B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
    • B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020210111568A 2020-08-26 2021-08-24 절단 장치 및 절단품의 제조 방법 KR102644561B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020142270A JP7354069B2 (ja) 2020-08-26 2020-08-26 切断装置、及び、切断品の製造方法
JPJP-P-2020-142270 2020-08-26

Publications (2)

Publication Number Publication Date
KR20220027028A KR20220027028A (ko) 2022-03-07
KR102644561B1 true KR102644561B1 (ko) 2024-03-08

Family

ID=80441013

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210111568A KR102644561B1 (ko) 2020-08-26 2021-08-24 절단 장치 및 절단품의 제조 방법

Country Status (4)

Country Link
JP (1) JP7354069B2 (zh)
KR (1) KR102644561B1 (zh)
CN (1) CN114102718B (zh)
TW (1) TWI827967B (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006116690A (ja) 2004-09-22 2006-05-11 Disco Abrasive Syst Ltd 切削装置
JP2009012127A (ja) * 2007-07-05 2009-01-22 Disco Abrasive Syst Ltd 切削装置
JP2012040651A (ja) 2010-08-20 2012-03-01 Disco Corp 切削ブレード検出機構
JP2012052813A (ja) 2010-08-31 2012-03-15 Sophia School Corp 回転体の回転軸心の運動の軌跡を計測する方法及び計測システム
KR101440642B1 (ko) * 2009-08-03 2014-09-25 두산인프라코어 주식회사 공작기계의 공구 파손 검출장치

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288244A (ja) * 1995-04-11 1996-11-01 Disco Abrasive Syst Ltd 光学検出手段
JP4312304B2 (ja) * 1999-07-13 2009-08-12 株式会社ディスコ Ｃｓｐ基板分割装置
JP4590060B2 (ja) * 2000-04-14 2010-12-01 株式会社ディスコ 切削装置
JP2006278869A (ja) * 2005-03-30 2006-10-12 Disco Abrasive Syst Ltd ウェーハの切削方法及び切削装置
JP4679209B2 (ja) * 2005-04-04 2011-04-27 株式会社ディスコ 切削装置およびブレード状態検出方法
JP4512557B2 (ja) * 2006-01-26 2010-07-28 ユニオンツール株式会社 位置検出装置
JP5068621B2 (ja) * 2007-10-03 2012-11-07 株式会社ディスコ 切削装置
JP2012080029A (ja) * 2010-10-06 2012-04-19 Disco Abrasive Syst Ltd 切削装置
JP2013258205A (ja) * 2012-06-11 2013-12-26 Disco Abrasive Syst Ltd 切削装置
JP6125867B2 (ja) 2013-03-26 2017-05-10 株式会社ディスコ 切削方法
US9263352B2 (en) * 2014-01-03 2016-02-16 Asm Technology Singapore Pte Ltd Singulation apparatus comprising an imaging device
JP5897686B1 (ja) * 2014-10-24 2016-03-30 Ｔｏｗａ株式会社 ワーク吸着板、ワーク切断装置、ワーク切断方法、およびワーク吸着板の製造方法
JP6509589B2 (ja) * 2015-03-04 2019-05-08 株式会社ディスコ 切削装置
JP6491044B2 (ja) * 2015-05-29 2019-03-27 Ｔｏｗａ株式会社 製造装置及び製造方法
JP6541546B2 (ja) * 2015-10-21 2019-07-10 株式会社ディスコ 切削装置
JP6746198B2 (ja) * 2016-04-01 2020-08-26 株式会社ディスコ 切削装置
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル
JP6932436B2 (ja) * 2017-05-24 2021-09-08 株式会社ディスコ 切削装置
JP7102157B2 (ja) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006116690A (ja) 2004-09-22 2006-05-11 Disco Abrasive Syst Ltd 切削装置
JP2009012127A (ja) * 2007-07-05 2009-01-22 Disco Abrasive Syst Ltd 切削装置
KR101440642B1 (ko) * 2009-08-03 2014-09-25 두산인프라코어 주식회사 공작기계의 공구 파손 검출장치
JP2012040651A (ja) 2010-08-20 2012-03-01 Disco Corp 切削ブレード検出機構
JP2012052813A (ja) 2010-08-31 2012-03-15 Sophia School Corp 回転体の回転軸心の運動の軌跡を計測する方法及び計測システム

Also Published As

Publication number Publication date
TWI827967B (zh) 2024-01-01
CN114102718B (zh) 2024-01-30
TW202209462A (zh) 2022-03-01
CN114102718A (zh) 2022-03-01
JP7354069B2 (ja) 2023-10-02
KR20220027028A (ko) 2022-03-07
JP2022038006A (ja) 2022-03-10

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