JP6746198B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP6746198B2 JP6746198B2 JP2016073879A JP2016073879A JP6746198B2 JP 6746198 B2 JP6746198 B2 JP 6746198B2 JP 2016073879 A JP2016073879 A JP 2016073879A JP 2016073879 A JP2016073879 A JP 2016073879A JP 6746198 B2 JP6746198 B2 JP 6746198B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- unit
- light receiving
- reference position
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
50 切削ブレード
56 ブレード検出手段
58 ブレード検出機構
62 ブレード侵入部
64 発光部
66 受光部
84 光電変換部
86 基準電圧設定部
88 電圧比較部
90 停止信号発信部
91 端部位置検出部
94 変化量登録部
96 基準位置算出部
98 基準位置登録部
Claims (2)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削する切削ブレードが装着された切削手段と、該切削手段を該チャックテーブルに対して切り込み送り方向に移動させる切り込み送り手段と、該切り込み送り手段によって移動した該切削手段の位置を認識する位置認識部と、発光部と受光部とを有し該切削ブレードの該切り込み送り方向での先端位置を検出するブレード検出機構と、前記各構成要素を制御する制御手段と、を備えた切削装置であって、
該制御手段は、
該発光部と該受光部との間に侵入し、該切り込み送り方向に移動する該切削ブレードの移動量と、該移動量に対応して変化する該受光部の受光量の変化との関係が登録される変化量登録部と、
該受光部の受光量が閾値になった際に、該発光部と該受光部との間に侵入した該切削ブレードの該切り込み送り手段を停止させる停止信号を発信する停止信号発信部と、
該停止信号の発信時より該切削手段がオーバーランして停止した際の該受光量と該閾値の差、及び該変化量登録部に登録された変化量情報から、該切削手段がオーバーランした距離を割り出し、停止した該切削手段の位置を該距離で補正して、該位置認識部で認識される該切削手段の基準位置を算出する基準位置算出部と、
該基準位置算出部で算出された該基準位置を登録する基準位置登録部と、を備え、
該基準位置登録部に登録された該切削手段の基準位置で、該発光部と該受光部との間に侵入した該切削ブレードによって該受光部の該受光量が該閾値になったと擬制することを特徴とする切削装置。 - 該制御手段は、該受光量を電圧に変換して該変化量登録部に登録することを特徴とする請求項1記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016073879A JP6746198B2 (ja) | 2016-04-01 | 2016-04-01 | 切削装置 |
TW106106088A TWI719146B (zh) | 2016-04-01 | 2017-02-23 | 切割裝置 |
CN201710195993.6A CN107263745B (zh) | 2016-04-01 | 2017-03-29 | 切削装置 |
KR1020170040740A KR102241356B1 (ko) | 2016-04-01 | 2017-03-30 | 절삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016073879A JP6746198B2 (ja) | 2016-04-01 | 2016-04-01 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017185552A JP2017185552A (ja) | 2017-10-12 |
JP6746198B2 true JP6746198B2 (ja) | 2020-08-26 |
Family
ID=60045265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016073879A Active JP6746198B2 (ja) | 2016-04-01 | 2016-04-01 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6746198B2 (ja) |
KR (1) | KR102241356B1 (ja) |
CN (1) | CN107263745B (ja) |
TW (1) | TWI719146B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6990588B2 (ja) * | 2018-01-05 | 2022-01-12 | 株式会社ディスコ | 切削装置 |
JP7126849B2 (ja) * | 2018-04-13 | 2022-08-29 | 株式会社ディスコ | 加工装置 |
JP7325203B2 (ja) * | 2019-03-25 | 2023-08-14 | 株式会社ディスコ | 加工装置 |
JP7354069B2 (ja) * | 2020-08-26 | 2023-10-02 | Towa株式会社 | 切断装置、及び、切断品の製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0775966A (ja) * | 1993-09-08 | 1995-03-20 | Nippei Toyama Corp | 研削方法及びその装置 |
JPH08112754A (ja) * | 1994-10-13 | 1996-05-07 | Shin Meiwa Ind Co Ltd | 自動研削装置における研削基準面検出装置 |
JP3074668B2 (ja) * | 1994-12-13 | 2000-08-07 | 株式会社東京精密 | ブレード変位検出装置 |
JP3396341B2 (ja) * | 1995-07-10 | 2003-04-14 | 三菱重工業株式会社 | ビードの自動研削制御方法及びその装置 |
JPH09123160A (ja) * | 1995-10-30 | 1997-05-13 | Hitachi Cable Ltd | ダイシング方法及びその装置 |
JP4590058B2 (ja) * | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP4599629B2 (ja) * | 2001-04-19 | 2010-12-15 | 株式会社東京精密 | ブレード先端位置検出装置及び検出方法 |
JP2002370163A (ja) | 2001-06-12 | 2002-12-24 | Okamoto Machine Tool Works Ltd | ワ−クに対する砥石の切り込み開始点位置決め方法および研削装置 |
JP2003234309A (ja) * | 2002-02-12 | 2003-08-22 | Tokyo Seimitsu Co Ltd | 光学式カッターセット装置及びカッターセット方法 |
JP2004017194A (ja) * | 2002-06-14 | 2004-01-22 | Okamoto Machine Tool Works Ltd | 研削装置およびそれを用いて砥石車をワ−クへ自動的に接近させる方法 |
JP2009214217A (ja) | 2008-03-10 | 2009-09-24 | Jtekt Corp | 砥石先端位置補正方法及び装置 |
CN101497179A (zh) * | 2009-03-13 | 2009-08-05 | 袁文斌 | 基于机器视觉的钢坯修磨机砂轮直径检测装置 |
JP5415219B2 (ja) * | 2009-10-09 | 2014-02-12 | 株式会社ディスコ | 切削装置 |
JP2013258204A (ja) * | 2012-06-11 | 2013-12-26 | Disco Abrasive Syst Ltd | 切削装置 |
JP6120710B2 (ja) * | 2013-07-19 | 2017-04-26 | 株式会社ディスコ | 切削装置 |
US9263352B2 (en) * | 2014-01-03 | 2016-02-16 | Asm Technology Singapore Pte Ltd | Singulation apparatus comprising an imaging device |
-
2016
- 2016-04-01 JP JP2016073879A patent/JP6746198B2/ja active Active
-
2017
- 2017-02-23 TW TW106106088A patent/TWI719146B/zh active
- 2017-03-29 CN CN201710195993.6A patent/CN107263745B/zh active Active
- 2017-03-30 KR KR1020170040740A patent/KR102241356B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2017185552A (ja) | 2017-10-12 |
CN107263745B (zh) | 2020-12-22 |
KR20170113404A (ko) | 2017-10-12 |
TW201739590A (zh) | 2017-11-16 |
KR102241356B1 (ko) | 2021-04-15 |
TWI719146B (zh) | 2021-02-21 |
CN107263745A (zh) | 2017-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6746198B2 (ja) | 切削装置 | |
US8040520B2 (en) | Device for detecting the edges of a workpiece, and a laser beam processing machine | |
KR102251265B1 (ko) | 절삭 장치 | |
TWI680821B (zh) | 雷射加工裝置 | |
KR102232101B1 (ko) | 절삭 장치의 셋업 방법 | |
TWI606500B (zh) | Cutting device | |
JP2016197702A (ja) | 加工装置 | |
KR20160065766A (ko) | 레이저 가공 장치 | |
JP6120710B2 (ja) | 切削装置 | |
KR102008532B1 (ko) | 가공 장치 | |
JP6215730B2 (ja) | 加工装置におけるウエーハの中心検出方法 | |
JP2019188508A (ja) | 作業ロボットシステムおよび作業ロボット | |
JP5415219B2 (ja) | 切削装置 | |
KR102302579B1 (ko) | 절삭 장치 | |
KR102281152B1 (ko) | 절삭 장치 | |
JP5389604B2 (ja) | 切削装置における切削ブレードの消耗量管理方法 | |
JP5389613B2 (ja) | 切削装置における切削ブレードの消耗量管理方法 | |
JP2011104731A (ja) | 切削装置 | |
JP2013251457A (ja) | 切削ブレードの刃先位置検出方法 | |
JP5072743B2 (ja) | マイクロマシンおよびマイクロフライスマシン | |
JP5389603B2 (ja) | 切削装置における切削ブレードの消耗量管理方法 | |
KR20170029381A (ko) | 레이저 가공 장치 | |
JPH10177973A (ja) | ブレード変位検出装置 | |
JP2013258205A (ja) | 切削装置 | |
JP2019202356A (ja) | 被加工物の加工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190220 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20191129 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191217 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200130 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200804 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200804 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6746198 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |