KR102241356B1 - 절삭 장치 - Google Patents
절삭 장치 Download PDFInfo
- Publication number
- KR102241356B1 KR102241356B1 KR1020170040740A KR20170040740A KR102241356B1 KR 102241356 B1 KR102241356 B1 KR 102241356B1 KR 1020170040740 A KR1020170040740 A KR 1020170040740A KR 20170040740 A KR20170040740 A KR 20170040740A KR 102241356 B1 KR102241356 B1 KR 102241356B1
- Authority
- KR
- South Korea
- Prior art keywords
- unit
- cutting
- light
- reference position
- amount
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016073879A JP6746198B2 (ja) | 2016-04-01 | 2016-04-01 | 切削装置 |
JPJP-P-2016-073879 | 2016-04-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170113404A KR20170113404A (ko) | 2017-10-12 |
KR102241356B1 true KR102241356B1 (ko) | 2021-04-15 |
Family
ID=60045265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170040740A KR102241356B1 (ko) | 2016-04-01 | 2017-03-30 | 절삭 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6746198B2 (ja) |
KR (1) | KR102241356B1 (ja) |
CN (1) | CN107263745B (ja) |
TW (1) | TWI719146B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6990588B2 (ja) * | 2018-01-05 | 2022-01-12 | 株式会社ディスコ | 切削装置 |
JP7126849B2 (ja) * | 2018-04-13 | 2022-08-29 | 株式会社ディスコ | 加工装置 |
JP7325203B2 (ja) * | 2019-03-25 | 2023-08-14 | 株式会社ディスコ | 加工装置 |
JP7354069B2 (ja) * | 2020-08-26 | 2023-10-02 | Towa株式会社 | 切断装置、及び、切断品の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002370163A (ja) | 2001-06-12 | 2002-12-24 | Okamoto Machine Tool Works Ltd | ワ−クに対する砥石の切り込み開始点位置決め方法および研削装置 |
JP2004017194A (ja) * | 2002-06-14 | 2004-01-22 | Okamoto Machine Tool Works Ltd | 研削装置およびそれを用いて砥石車をワ−クへ自動的に接近させる方法 |
JP2009214217A (ja) | 2008-03-10 | 2009-09-24 | Jtekt Corp | 砥石先端位置補正方法及び装置 |
JP2011082402A (ja) * | 2009-10-09 | 2011-04-21 | Disco Abrasive Syst Ltd | 切削装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0775966A (ja) * | 1993-09-08 | 1995-03-20 | Nippei Toyama Corp | 研削方法及びその装置 |
JPH08112754A (ja) * | 1994-10-13 | 1996-05-07 | Shin Meiwa Ind Co Ltd | 自動研削装置における研削基準面検出装置 |
JP3074668B2 (ja) * | 1994-12-13 | 2000-08-07 | 株式会社東京精密 | ブレード変位検出装置 |
JP3396341B2 (ja) * | 1995-07-10 | 2003-04-14 | 三菱重工業株式会社 | ビードの自動研削制御方法及びその装置 |
JPH09123160A (ja) * | 1995-10-30 | 1997-05-13 | Hitachi Cable Ltd | ダイシング方法及びその装置 |
JP4590058B2 (ja) * | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP4599629B2 (ja) * | 2001-04-19 | 2010-12-15 | 株式会社東京精密 | ブレード先端位置検出装置及び検出方法 |
JP2003234309A (ja) * | 2002-02-12 | 2003-08-22 | Tokyo Seimitsu Co Ltd | 光学式カッターセット装置及びカッターセット方法 |
CN101497179A (zh) * | 2009-03-13 | 2009-08-05 | 袁文斌 | 基于机器视觉的钢坯修磨机砂轮直径检测装置 |
JP2013258204A (ja) * | 2012-06-11 | 2013-12-26 | Disco Abrasive Syst Ltd | 切削装置 |
JP6120710B2 (ja) * | 2013-07-19 | 2017-04-26 | 株式会社ディスコ | 切削装置 |
US9263352B2 (en) * | 2014-01-03 | 2016-02-16 | Asm Technology Singapore Pte Ltd | Singulation apparatus comprising an imaging device |
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2016
- 2016-04-01 JP JP2016073879A patent/JP6746198B2/ja active Active
-
2017
- 2017-02-23 TW TW106106088A patent/TWI719146B/zh active
- 2017-03-29 CN CN201710195993.6A patent/CN107263745B/zh active Active
- 2017-03-30 KR KR1020170040740A patent/KR102241356B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002370163A (ja) | 2001-06-12 | 2002-12-24 | Okamoto Machine Tool Works Ltd | ワ−クに対する砥石の切り込み開始点位置決め方法および研削装置 |
JP2004017194A (ja) * | 2002-06-14 | 2004-01-22 | Okamoto Machine Tool Works Ltd | 研削装置およびそれを用いて砥石車をワ−クへ自動的に接近させる方法 |
JP2009214217A (ja) | 2008-03-10 | 2009-09-24 | Jtekt Corp | 砥石先端位置補正方法及び装置 |
JP2011082402A (ja) * | 2009-10-09 | 2011-04-21 | Disco Abrasive Syst Ltd | 切削装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2017185552A (ja) | 2017-10-12 |
CN107263745B (zh) | 2020-12-22 |
JP6746198B2 (ja) | 2020-08-26 |
KR20170113404A (ko) | 2017-10-12 |
TW201739590A (zh) | 2017-11-16 |
TWI719146B (zh) | 2021-02-21 |
CN107263745A (zh) | 2017-10-20 |
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E701 | Decision to grant or registration of patent right |