CN107263745B - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
CN107263745B
CN107263745B CN201710195993.6A CN201710195993A CN107263745B CN 107263745 B CN107263745 B CN 107263745B CN 201710195993 A CN201710195993 A CN 201710195993A CN 107263745 B CN107263745 B CN 107263745B
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CN
China
Prior art keywords
cutting
unit
amount
light receiving
reference position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710195993.6A
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English (en)
Chinese (zh)
Other versions
CN107263745A (zh
Inventor
笠井刚史
山田清
上原健
小泽明生
佐藤雅史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
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Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN107263745A publication Critical patent/CN107263745A/zh
Application granted granted Critical
Publication of CN107263745B publication Critical patent/CN107263745B/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201710195993.6A 2016-04-01 2017-03-29 切削装置 Active CN107263745B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016073879A JP6746198B2 (ja) 2016-04-01 2016-04-01 切削装置
JP2016-073879 2016-04-01

Publications (2)

Publication Number Publication Date
CN107263745A CN107263745A (zh) 2017-10-20
CN107263745B true CN107263745B (zh) 2020-12-22

Family

ID=60045265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710195993.6A Active CN107263745B (zh) 2016-04-01 2017-03-29 切削装置

Country Status (4)

Country Link
JP (1) JP6746198B2 (ja)
KR (1) KR102241356B1 (ja)
CN (1) CN107263745B (ja)
TW (1) TWI719146B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6990588B2 (ja) * 2018-01-05 2022-01-12 株式会社ディスコ 切削装置
JP7126849B2 (ja) * 2018-04-13 2022-08-29 株式会社ディスコ 加工装置
JP7325203B2 (ja) * 2019-03-25 2023-08-14 株式会社ディスコ 加工装置
JP7354069B2 (ja) * 2020-08-26 2023-10-02 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08164515A (ja) * 1994-12-13 1996-06-25 Tokyo Seimitsu Co Ltd ブレード変位検出装置
JPH0919858A (ja) * 1995-07-10 1997-01-21 Mitsubishi Heavy Ind Ltd ビードの自動研削制御方法及びその装置
JPH09123160A (ja) * 1995-10-30 1997-05-13 Hitachi Cable Ltd ダイシング方法及びその装置
JP2002313756A (ja) * 2001-04-19 2002-10-25 Tokyo Seimitsu Co Ltd ブレード先端位置検出装置及び検出方法
JP2003234309A (ja) * 2002-02-12 2003-08-22 Tokyo Seimitsu Co Ltd 光学式カッターセット装置及びカッターセット方法
CN101497179A (zh) * 2009-03-13 2009-08-05 袁文斌 基于机器视觉的钢坯修磨机砂轮直径检测装置
JP4590058B2 (ja) * 2000-04-12 2010-12-01 株式会社ディスコ 切削装置の切削ブレード検出機構
JP2011082402A (ja) * 2009-10-09 2011-04-21 Disco Abrasive Syst Ltd 切削装置
JP2013258204A (ja) * 2012-06-11 2013-12-26 Disco Abrasive Syst Ltd 切削装置
JP2015020240A (ja) * 2013-07-19 2015-02-02 株式会社ディスコ 切削装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775966A (ja) * 1993-09-08 1995-03-20 Nippei Toyama Corp 研削方法及びその装置
JPH08112754A (ja) * 1994-10-13 1996-05-07 Shin Meiwa Ind Co Ltd 自動研削装置における研削基準面検出装置
JP2002370163A (ja) * 2001-06-12 2002-12-24 Okamoto Machine Tool Works Ltd ワ−クに対する砥石の切り込み開始点位置決め方法および研削装置
JP2004017194A (ja) * 2002-06-14 2004-01-22 Okamoto Machine Tool Works Ltd 研削装置およびそれを用いて砥石車をワ−クへ自動的に接近させる方法
JP2009214217A (ja) * 2008-03-10 2009-09-24 Jtekt Corp 砥石先端位置補正方法及び装置
US9263352B2 (en) * 2014-01-03 2016-02-16 Asm Technology Singapore Pte Ltd Singulation apparatus comprising an imaging device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08164515A (ja) * 1994-12-13 1996-06-25 Tokyo Seimitsu Co Ltd ブレード変位検出装置
JPH0919858A (ja) * 1995-07-10 1997-01-21 Mitsubishi Heavy Ind Ltd ビードの自動研削制御方法及びその装置
JPH09123160A (ja) * 1995-10-30 1997-05-13 Hitachi Cable Ltd ダイシング方法及びその装置
JP4590058B2 (ja) * 2000-04-12 2010-12-01 株式会社ディスコ 切削装置の切削ブレード検出機構
JP2002313756A (ja) * 2001-04-19 2002-10-25 Tokyo Seimitsu Co Ltd ブレード先端位置検出装置及び検出方法
JP2003234309A (ja) * 2002-02-12 2003-08-22 Tokyo Seimitsu Co Ltd 光学式カッターセット装置及びカッターセット方法
CN101497179A (zh) * 2009-03-13 2009-08-05 袁文斌 基于机器视觉的钢坯修磨机砂轮直径检测装置
JP2011082402A (ja) * 2009-10-09 2011-04-21 Disco Abrasive Syst Ltd 切削装置
JP2013258204A (ja) * 2012-06-11 2013-12-26 Disco Abrasive Syst Ltd 切削装置
CN103481384A (zh) * 2012-06-11 2014-01-01 株式会社迪思科 切削装置
JP2015020240A (ja) * 2013-07-19 2015-02-02 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
KR102241356B1 (ko) 2021-04-15
JP6746198B2 (ja) 2020-08-26
TWI719146B (zh) 2021-02-21
CN107263745A (zh) 2017-10-20
TW201739590A (zh) 2017-11-16
KR20170113404A (ko) 2017-10-12
JP2017185552A (ja) 2017-10-12

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