KR102564099B1 - 접합 기판, 금속 회로 기판 및 회로 기판 - Google Patents

접합 기판, 금속 회로 기판 및 회로 기판 Download PDF

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Publication number
KR102564099B1
KR102564099B1 KR1020217008508A KR20217008508A KR102564099B1 KR 102564099 B1 KR102564099 B1 KR 102564099B1 KR 1020217008508 A KR1020217008508 A KR 1020217008508A KR 20217008508 A KR20217008508 A KR 20217008508A KR 102564099 B1 KR102564099 B1 KR 102564099B1
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South Korea
Prior art keywords
metal plate
substrate
edge
stacking direction
circuit board
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KR1020217008508A
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Korean (ko)
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KR20210046057A (ko
Inventor
유타 츠가와
고지 니시무라
료타 아오노
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덴카 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H01L23/3735—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020217008508A 2018-09-27 2019-09-27 접합 기판, 금속 회로 기판 및 회로 기판 Active KR102564099B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018181383 2018-09-27
JPJP-P-2018-181383 2018-09-27
PCT/JP2019/038172 WO2020067427A1 (ja) 2018-09-27 2019-09-27 接合基板、金属回路基板及び回路基板

Publications (2)

Publication Number Publication Date
KR20210046057A KR20210046057A (ko) 2021-04-27
KR102564099B1 true KR102564099B1 (ko) 2023-08-04

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ID=69949378

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217008508A Active KR102564099B1 (ko) 2018-09-27 2019-09-27 접합 기판, 금속 회로 기판 및 회로 기판

Country Status (6)

Country Link
US (1) US11497125B2 (https=)
EP (1) EP3860317B1 (https=)
JP (1) JP7455751B2 (https=)
KR (1) KR102564099B1 (https=)
CN (1) CN112772001A (https=)
WO (1) WO2020067427A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7739105B2 (ja) * 2021-09-21 2025-09-16 Ｄｏｗａメタルテック株式会社 金属－セラミックス接合基板およびその製造方法

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JP2009170930A (ja) 2009-03-12 2009-07-30 Hitachi Metals Ltd セラミックス回路基板及びこれを用いたパワー半導体モジュール
US20140291699A1 (en) 2011-12-20 2014-10-02 Kabushiki Kaisha Toshiba Ceramic/copper circuit board and semiconductor device

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US20040103808A1 (en) * 2002-08-19 2004-06-03 Darren Lochun Electrical circuits and methods of manufacture and use
JP2004172182A (ja) 2002-11-18 2004-06-17 Denki Kagaku Kogyo Kk 回路基板及びその製造方法
JP4191506B2 (ja) * 2003-02-21 2008-12-03 Ｔｄｋ株式会社 高密度インダクタおよびその製造方法
US7062840B2 (en) * 2003-02-24 2006-06-20 Delphi Technologies, Inc. Method for forming permanent magnet targets for position sensors
JP2004342635A (ja) * 2003-05-13 2004-12-02 Hitachi Metals Ltd セラミックス基板接合用金属板およびセラミックス回路基板
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JP6567259B2 (ja) * 2013-10-01 2019-08-28 日東電工株式会社 軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置
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JP2016174165A (ja) 2011-12-20 2016-09-29 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
JP7455751B2 (ja) 2024-03-26
US11497125B2 (en) 2022-11-08
JPWO2020067427A1 (ja) 2021-09-02
EP3860317A4 (en) 2021-11-17
CN112772001A (zh) 2021-05-07
KR20210046057A (ko) 2021-04-27
US20220039264A1 (en) 2022-02-03
EP3860317B1 (en) 2024-07-24
WO2020067427A1 (ja) 2020-04-02
EP3860317A1 (en) 2021-08-04

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