CN112772001A - 接合基板、金属电路基板及电路基板 - Google Patents

接合基板、金属电路基板及电路基板 Download PDF

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Publication number
CN112772001A
CN112772001A CN201980062400.6A CN201980062400A CN112772001A CN 112772001 A CN112772001 A CN 112772001A CN 201980062400 A CN201980062400 A CN 201980062400A CN 112772001 A CN112772001 A CN 112772001A
Authority
CN
China
Prior art keywords
metal plate
bonding substrate
circuit board
cut
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980062400.6A
Other languages
English (en)
Chinese (zh)
Inventor
津川优太
西村浩二
青野良太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=69949378&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN112772001(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN112772001A publication Critical patent/CN112772001A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201980062400.6A 2018-09-27 2019-09-27 接合基板、金属电路基板及电路基板 Pending CN112772001A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018181383 2018-09-27
JP2018-181383 2018-09-27
PCT/JP2019/038172 WO2020067427A1 (ja) 2018-09-27 2019-09-27 接合基板、金属回路基板及び回路基板

Publications (1)

Publication Number Publication Date
CN112772001A true CN112772001A (zh) 2021-05-07

Family

ID=69949378

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980062400.6A Pending CN112772001A (zh) 2018-09-27 2019-09-27 接合基板、金属电路基板及电路基板

Country Status (6)

Country Link
US (1) US11497125B2 (https=)
EP (1) EP3860317B1 (https=)
JP (1) JP7455751B2 (https=)
KR (1) KR102564099B1 (https=)
CN (1) CN112772001A (https=)
WO (1) WO2020067427A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7739105B2 (ja) * 2021-09-21 2025-09-16 Ｄｏｗａメタルテック株式会社 金属－セラミックス接合基板およびその製造方法

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JP2009170930A (ja) * 2009-03-12 2009-07-30 Hitachi Metals Ltd セラミックス回路基板及びこれを用いたパワー半導体モジュール
CN101530011A (zh) * 2006-11-30 2009-09-09 株式会社德山 金属化陶瓷基板芯片的制造方法
US20140291699A1 (en) * 2011-12-20 2014-10-02 Kabushiki Kaisha Toshiba Ceramic/copper circuit board and semiconductor device
CN105470236A (zh) * 2014-09-26 2016-04-06 三菱电机株式会社 半导体装置

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JP3449458B2 (ja) 1997-05-26 2003-09-22 電気化学工業株式会社 回路基板
US20040103808A1 (en) * 2002-08-19 2004-06-03 Darren Lochun Electrical circuits and methods of manufacture and use
JP2004172182A (ja) 2002-11-18 2004-06-17 Denki Kagaku Kogyo Kk 回路基板及びその製造方法
JP4191506B2 (ja) * 2003-02-21 2008-12-03 Ｔｄｋ株式会社 高密度インダクタおよびその製造方法
US7062840B2 (en) * 2003-02-24 2006-06-20 Delphi Technologies, Inc. Method for forming permanent magnet targets for position sensors
JP2004342635A (ja) * 2003-05-13 2004-12-02 Hitachi Metals Ltd セラミックス基板接合用金属板およびセラミックス回路基板
JP2005150329A (ja) * 2003-11-14 2005-06-09 Canon Inc 配線構造及びその作製方法
JP4556422B2 (ja) * 2003-12-02 2010-10-06 パナソニック株式会社 電子部品およびその製造方法
JP5054445B2 (ja) * 2007-06-26 2012-10-24 スミダコーポレーション株式会社 コイル部品
JP6125328B2 (ja) * 2013-05-27 2017-05-10 日東電工株式会社 軟磁性フィルム積層回路基板の製造方法
JP6297281B2 (ja) * 2013-05-27 2018-03-20 日東電工株式会社 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP6567259B2 (ja) * 2013-10-01 2019-08-28 日東電工株式会社 軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置
US20150201499A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Device, system, and method of three-dimensional printing
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CN206075983U (zh) * 2014-04-09 2017-04-05 株式会社村田制作所 层叠线圈部件
KR102004791B1 (ko) * 2014-05-21 2019-07-29 삼성전기주식회사 칩 전자부품 및 그 실장기판
JP6311200B2 (ja) * 2014-06-26 2018-04-18 住友電工プリントサーキット株式会社 プリント配線板、電子部品及びプリント配線板の製造方法
US9570385B2 (en) * 2015-01-22 2017-02-14 Invensas Corporation Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
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JP6390825B1 (ja) * 2017-03-01 2018-09-19 株式会社村田製作所 実装用基板
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CN101530011A (zh) * 2006-11-30 2009-09-09 株式会社德山 金属化陶瓷基板芯片的制造方法
JP2009170930A (ja) * 2009-03-12 2009-07-30 Hitachi Metals Ltd セラミックス回路基板及びこれを用いたパワー半導体モジュール
US20140291699A1 (en) * 2011-12-20 2014-10-02 Kabushiki Kaisha Toshiba Ceramic/copper circuit board and semiconductor device
CN105470236A (zh) * 2014-09-26 2016-04-06 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
JP7455751B2 (ja) 2024-03-26
US11497125B2 (en) 2022-11-08
JPWO2020067427A1 (ja) 2021-09-02
EP3860317A4 (en) 2021-11-17
KR20210046057A (ko) 2021-04-27
US20220039264A1 (en) 2022-02-03
EP3860317B1 (en) 2024-07-24
WO2020067427A1 (ja) 2020-04-02
EP3860317A1 (en) 2021-08-04
KR102564099B1 (ko) 2023-08-04

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Application publication date: 20210507