JPS6459986A - Ceramic circuit board - Google Patents

Ceramic circuit board

Info

Publication number
JPS6459986A
JPS6459986A JP62217007A JP21700787A JPS6459986A JP S6459986 A JPS6459986 A JP S6459986A JP 62217007 A JP62217007 A JP 62217007A JP 21700787 A JP21700787 A JP 21700787A JP S6459986 A JPS6459986 A JP S6459986A
Authority
JP
Japan
Prior art keywords
thickness
copper
copper plate
board
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62217007A
Other languages
Japanese (ja)
Other versions
JPH0525397B2 (en
Inventor
Tadashi Tanaka
Kazuo Matsumura
Shoji Tsuruya
Shunichiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62217007A priority Critical patent/JPS6459986A/en
Publication of JPS6459986A publication Critical patent/JPS6459986A/en
Publication of JPH0525397B2 publication Critical patent/JPH0525397B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates

Landscapes

  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To obtain a ceramic circuit board which has an improved reliability for thermal hysteresis and is produced by a DBC method by a method wherein copper plates with required shapes are provided and bonded to the ceramic board and thin parts are formed along the ends of the copper plates. CONSTITUTION:A thin part along the end of a copper plate has a tapered shape, a stepped shape or the like. The thickness of the thin part is less than a half of the thickness of the mounting part at its tip. For instance, a copper plate 1 with a required circuit pattern with a thickness of 0.3mm is made of tough-pitch copper containing 300ppm of oxygen and a thin part 1a with a thickness of 0.15mm is formed along the outer circumference of the copper plate 1 and within the width range of 1mm from the circumference to form a stepped shape mounting part. Also, a copper plate 2 for a rear surface with a thickness of 0.25mm is made of tough-pitch copper containing 300ppm of oxygen and a thin part 2a with a thickness of 0.12mm is formed along the outer circumference of the copper plate 2 and within the width range of 1mm from the circumference to form a stepped shape. The copper plates 1 and 2 are provided on both the surfaces of a ceramics board 3 and subjected to a heat treatment in a nitrogen atmosphere at a temperature of 1075 deg.C for 10 minutes for thermocompression bonding to produce a circuit board. In this board, a residual stress is relieved by the plastic deformation of the thin parts.
JP62217007A 1987-08-31 1987-08-31 Ceramic circuit board Granted JPS6459986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62217007A JPS6459986A (en) 1987-08-31 1987-08-31 Ceramic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62217007A JPS6459986A (en) 1987-08-31 1987-08-31 Ceramic circuit board

Publications (2)

Publication Number Publication Date
JPS6459986A true JPS6459986A (en) 1989-03-07
JPH0525397B2 JPH0525397B2 (en) 1993-04-12

Family

ID=16697361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62217007A Granted JPS6459986A (en) 1987-08-31 1987-08-31 Ceramic circuit board

Country Status (1)

Country Link
JP (1) JPS6459986A (en)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103150A (en) * 1990-08-23 1992-04-06 Mitsubishi Materials Corp Ic mounting board
US5986218A (en) * 1995-11-08 1999-11-16 Mitsubishi Denki Kabushiki Kaisha Circuit board with conductor layer for increased breakdown voltage
JP2000020261A (en) * 1998-07-01 2000-01-21 Ricoh Co Ltd Image forming device
US6054762A (en) * 1996-08-27 2000-04-25 Dowa Mining Co., Ltd. Semiconductor substrates of high reliability ceramic metal composites
JP2001168482A (en) * 1999-09-28 2001-06-22 Toshiba Corp Ceramic circuit board
JP2001267447A (en) * 2000-03-14 2001-09-28 Toshiba Corp Ceramic circuit board and semiconductor device
JP2004014589A (en) * 2002-06-04 2004-01-15 Dowa Mining Co Ltd Metal-ceramic bonded body and method of manufacturing the same
EP1416533A2 (en) 2002-10-29 2004-05-06 Ixys Corporation Power device and direct aluminium bonded substrate thereof
JP2006286754A (en) * 2005-03-31 2006-10-19 Dowa Mining Co Ltd Metal-ceramic bonding substrate
JP2008294284A (en) * 2007-05-25 2008-12-04 Toyota Industries Corp Semiconductor device
JP2008294047A (en) * 2007-05-22 2008-12-04 T Rad Co Ltd Ceramic circuit board structure
JP2009043763A (en) * 2007-08-06 2009-02-26 Toyota Motor Corp Joining layer-containing member and manufacturing method thereof
JP2009105456A (en) * 2009-02-12 2009-05-14 Toshiba Corp Semiconductor device
JP2010103311A (en) * 2008-10-23 2010-05-06 Toyota Central R&D Labs Inc Multilayer substrate
EP2306501A2 (en) 2009-10-02 2011-04-06 Ibiden Co., Ltd. Ceramic wiring board and method of manufacturing thereof
JP2011176065A (en) * 2010-02-24 2011-09-08 Toyota Central R&D Labs Inc Semiconductor module
JP2012182279A (en) * 2011-03-01 2012-09-20 Showa Denko Kk Insulation circuit board, manufacturing method of insulation circuit board, base for power module, and manufacturing method of base for the power module
EP1061783B1 (en) 1999-06-14 2013-11-20 Curamik Electronics GmbH Ceramic-metal substrate, particularly multiple substrate
JP2014229898A (en) * 2013-05-22 2014-12-08 トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド Power electronics device having thermal stress reduction element
JP2015070061A (en) * 2013-09-27 2015-04-13 三菱マテリアル株式会社 Power module substrate manufacturing method
WO2015097748A1 (en) * 2013-12-24 2015-07-02 三菱電機株式会社 Power conversion apparatus and power module
CN107004644A (en) * 2014-12-18 2017-08-01 三菱电机株式会社 Insulation circuit board, power model and power cell
WO2020067427A1 (en) * 2018-09-27 2020-04-02 デンカ株式会社 Bonded substrate, metal circuit board, and circuit board
JPWO2021100126A1 (en) * 2019-11-19 2021-05-27
EP3745452A4 (en) * 2018-01-24 2021-10-27 Mitsubishi Materials Corporation PROCESS FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, AND CERAMIC-COPPER JOINT BODY
CN113767455A (en) * 2019-05-02 2021-12-07 阿莫善斯有限公司 Ceramic substrate and ceramic substrate manufacturing method
WO2023052589A1 (en) * 2021-10-01 2023-04-06 Rogers Germany Gmbh Metal-ceramic substrate and method for producing a metal-ceramic substrate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0935286A4 (en) * 1997-05-26 2008-04-09 Sumitomo Electric Industries COPPER CIRCUIT JUNCTION SUBSTRATE AND PROCESS FOR PRODUCING THE SAME
JP5294579B2 (en) * 2007-06-28 2013-09-18 株式会社豊田中央研究所 Ceramic sensor
JP2009272647A (en) * 2009-08-12 2009-11-19 Dowa Holdings Co Ltd Method for manufacturing of circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121978A (en) * 1979-03-16 1980-09-19 Tokyo Shibaura Electric Co Bonding structure of ceramic and metal
JPS59121890A (en) * 1982-12-28 1984-07-14 株式会社東芝 Ceramic and metal bond
JPS61156791A (en) * 1984-12-28 1986-07-16 株式会社東芝 Ceramic circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121978A (en) * 1979-03-16 1980-09-19 Tokyo Shibaura Electric Co Bonding structure of ceramic and metal
JPS59121890A (en) * 1982-12-28 1984-07-14 株式会社東芝 Ceramic and metal bond
JPS61156791A (en) * 1984-12-28 1986-07-16 株式会社東芝 Ceramic circuit board

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103150A (en) * 1990-08-23 1992-04-06 Mitsubishi Materials Corp Ic mounting board
US5986218A (en) * 1995-11-08 1999-11-16 Mitsubishi Denki Kabushiki Kaisha Circuit board with conductor layer for increased breakdown voltage
US6054762A (en) * 1996-08-27 2000-04-25 Dowa Mining Co., Ltd. Semiconductor substrates of high reliability ceramic metal composites
JP2000020261A (en) * 1998-07-01 2000-01-21 Ricoh Co Ltd Image forming device
EP1061783B1 (en) 1999-06-14 2013-11-20 Curamik Electronics GmbH Ceramic-metal substrate, particularly multiple substrate
JP2001168482A (en) * 1999-09-28 2001-06-22 Toshiba Corp Ceramic circuit board
JP2001267447A (en) * 2000-03-14 2001-09-28 Toshiba Corp Ceramic circuit board and semiconductor device
US7048866B2 (en) 2002-06-04 2006-05-23 Dowa Mining Co., Ltd. Metal/ceramic bonding article and method for producing same
JP2004014589A (en) * 2002-06-04 2004-01-15 Dowa Mining Co Ltd Metal-ceramic bonded body and method of manufacturing the same
EP1416533A2 (en) 2002-10-29 2004-05-06 Ixys Corporation Power device and direct aluminium bonded substrate thereof
EP2317549A3 (en) * 2002-10-29 2011-09-14 Ixys Corporation Direct bonded substrate for a power semiconductor device.
JP2006286754A (en) * 2005-03-31 2006-10-19 Dowa Mining Co Ltd Metal-ceramic bonding substrate
JP2008294047A (en) * 2007-05-22 2008-12-04 T Rad Co Ltd Ceramic circuit board structure
JP2008294284A (en) * 2007-05-25 2008-12-04 Toyota Industries Corp Semiconductor device
JP2009043763A (en) * 2007-08-06 2009-02-26 Toyota Motor Corp Joining layer-containing member and manufacturing method thereof
JP2010103311A (en) * 2008-10-23 2010-05-06 Toyota Central R&D Labs Inc Multilayer substrate
JP2009105456A (en) * 2009-02-12 2009-05-14 Toshiba Corp Semiconductor device
EP2306501A2 (en) 2009-10-02 2011-04-06 Ibiden Co., Ltd. Ceramic wiring board and method of manufacturing thereof
JP2011176065A (en) * 2010-02-24 2011-09-08 Toyota Central R&D Labs Inc Semiconductor module
JP2012182279A (en) * 2011-03-01 2012-09-20 Showa Denko Kk Insulation circuit board, manufacturing method of insulation circuit board, base for power module, and manufacturing method of base for the power module
JP2014229898A (en) * 2013-05-22 2014-12-08 トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド Power electronics device having thermal stress reduction element
JP2015070061A (en) * 2013-09-27 2015-04-13 三菱マテリアル株式会社 Power module substrate manufacturing method
WO2015097748A1 (en) * 2013-12-24 2015-07-02 三菱電機株式会社 Power conversion apparatus and power module
JPWO2015097748A1 (en) * 2013-12-24 2017-03-23 三菱電機株式会社 Power converter
CN107004644A (en) * 2014-12-18 2017-08-01 三菱电机株式会社 Insulation circuit board, power model and power cell
US10170433B2 (en) 2014-12-18 2019-01-01 Mitsubishi Electric Corporation Insulated circuit board, power module and power unit
CN107004644B (en) * 2014-12-18 2019-05-07 三菱电机株式会社 Insulated circuit board, power module, and power unit
US11676882B2 (en) 2018-01-24 2023-06-13 Mitsubishi Materials Corporation Method of manufacturing power module substrate board and ceramic-copper bonded body
EP3745452A4 (en) * 2018-01-24 2021-10-27 Mitsubishi Materials Corporation PROCESS FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, AND CERAMIC-COPPER JOINT BODY
WO2020067427A1 (en) * 2018-09-27 2020-04-02 デンカ株式会社 Bonded substrate, metal circuit board, and circuit board
US11497125B2 (en) 2018-09-27 2022-11-08 Denka Company Limited Bonded substrate, metal circuit board, and circuit board
JPWO2020067427A1 (en) * 2018-09-27 2021-09-02 デンカ株式会社 Bonded board, metal circuit board and circuit board
CN113767455A (en) * 2019-05-02 2021-12-07 阿莫善斯有限公司 Ceramic substrate and ceramic substrate manufacturing method
WO2021100126A1 (en) * 2019-11-19 2021-05-27 トヨタ自動車株式会社 Semiconductor device
JPWO2021100126A1 (en) * 2019-11-19 2021-05-27
US12159810B2 (en) 2019-11-19 2024-12-03 Denso Corporation Semiconductor device
WO2023052589A1 (en) * 2021-10-01 2023-04-06 Rogers Germany Gmbh Metal-ceramic substrate and method for producing a metal-ceramic substrate
JP2024534254A (en) * 2021-10-01 2024-09-18 ロジャーズ ジャーマニー ゲーエムベーハー Metal ceramic substrate and method for manufacturing the same

Also Published As

Publication number Publication date
JPH0525397B2 (en) 1993-04-12

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