JP2012182279A - Insulation circuit board, manufacturing method of insulation circuit board, base for power module, and manufacturing method of base for the power module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulation circuit board which prevents cracks from occurring in an insulation layer of the insulation circuit board when a power module is used.SOLUTION: An insulation circuit board 4 is formed by brazing a conductive layer 6 on one surface of an insulation plate 5, and a surface of the conductive layer 6 which is the opposite side of a surface brazed on the insulation plate 5 serves as an electronic element mounting surface 8. A brazing material accumulation part 11, which accumulates the brazing material so as not to contact with the insulation plate 5, is formed on a profile surface 9 which forms a profile of the conductive layer 6 and has a width in the thick direction of the conductive layer 6. A contact restriction part 12, which has a predetermined width from an end part on the insulation plate 5 side toward the electronic element mounting surface 8 and restricts the contact between the brazing material in the brazing material accumulation part 11 and the insulation plate 5, is provided on the profile surface 9 of the conductive layer 6. The brazing material accumulation part 11 is formed at an area on the profile surface 9 which is closer to the electronic element mounting surface 8 side relative to the contact restriction part 12 and is composed of a recessed part 13 which is recessed from the contact restriction part 12.

Description

  The present invention relates to an insulating circuit board and a manufacturing method thereof, a power module base and a manufacturing method thereof, and more specifically, an insulating circuit board on which an electronic element such as a power device is mounted, a manufacturing method thereof, and an insulating circuit board. The present invention relates to a power module base used for cooling an electronic element such as a mounted power device, and a method for manufacturing the same.

  In this specification and claims, the term “aluminum” includes aluminum alloys in addition to pure aluminum, unless expressed as “pure aluminum”. In this specification and claims, the term “pure aluminum” means pure aluminum having a purity of 99.00 wt% or more. Similarly, in this specification and claims, the terms “nickel”, “copper”, “silver” and “gold” include alloys in addition to pure metals with a purity of 99.00 wt% or more, respectively. Shall be.

  For example, in a power module equipped with a power device composed of a semiconductor element (electronic element) such as an IGBT (Insulated Gate Bipolar Transistor), the heat generated from the semiconductor element is efficiently dissipated to keep the temperature of the semiconductor element below a predetermined temperature. Need to keep. Therefore, conventionally, a power module base for mounting a power device includes an aluminum heat sink and an insulating circuit board brazed to the heat sink. The insulating circuit board is a ceramic insulating board brazed to the heat sink, and an insulating board. The conductive plate made of aluminum is brazed to the surface opposite to the surface brazed to the heat sink in the substrate, and the surface of the conductive plate opposite to the surface brazed to the insulating plate is the electronic element mounting surface. What is made is known (see Patent Document 1).

  The power module base described in Patent Document 1 is used as a power module by being mounted by soldering a power device after nickel plating is applied to an electronic element mounting surface of a conductive plate of an insulated circuit board. . The heat generated from the power device is transmitted to the heat sink through the conductive plate and the insulating plate, and is radiated.

  By the way, the base for a power module described in Patent Document 1 includes a heat sink, an insulating plate, and a conductive plate laminated in a state where an Al—Si alloy-based brazing material is disposed between adjacent ones. The conductive plate is manufactured by pressurizing and heating the heat sink and the insulating plate and brazing the insulating plate and the conductive plate.

  However, in the power module base manufacturing method described in Patent Document 1, when the heat sink, the insulating plate, and the conductive plate are heated while being pressed in a laminated state, the brazing material first starts to melt from the outer peripheral edge, and then gradually enters the center. Since heat is conducted toward the part and melting progresses, when trying to heat until the central part of the brazing material is melted, the brazing material that has already existed at the outer peripheral edge of the brazing material and has already melted However, when it oozes out between the conductive plate and the insulating plate and further aggregates due to the surface tension, there is a possibility that it flows along the side surface of the conductive plate to the electronic device mounting surface and covers the electronic device mounting surface. Then, when the molten brazing material covers the electronic element mounting surface of the conductive plate and solidifies here, it becomes difficult to perform good nickel plating on the electronic element mounting surface and good soldering of the electronic element. Moreover, if the electronic element is soldered to the electronic element mounting surface of the conductive plate plated with nickel from the solidified brazing material, the thermal cycle life of the electronic element may be reduced.

  Therefore, as a base for a power module that solves such problems, an electronic element is mounted on a ceramic insulating plate, a surface that is brazed to one surface of the insulating plate and opposite to the surface brazed to the insulating plate. An insulating circuit board comprising an aluminum conductive plate formed as a mounting surface and an aluminum heat transfer plate brazed to the other surface of the insulating plate, and a surface brazed to the insulating plate in the heat transfer plate of the insulating circuit substrate; Consists of a heat sink brazed on the opposite side, forming the contour of the conductive plate and the end of the conductive plate on the end of the contour plate having a width in the thickness direction of the conductive plate. A concave portion formed of a notch formed so as to straddle the facing surface and the contour surface is continuously formed over the entire circumference of the contour surface, and the brazing material is in contact with the insulating plate by the concave portion. The brazing material reservoir Bass have been made power module has been proposed (see Patent Document 2).

  The base for a power module described in Patent Document 2 is manufactured by brazing an insulating plate, a conductive plate, and a heat transfer plate with a brazing material disposed between the insulating plate, the conductive plate, and the heat transfer plate. Thereafter, it is manufactured by brazing a heat transfer plate of an insulated circuit board to a heat sink. When the insulated circuit board is manufactured, the molten brazing material that has melted from the brazing material disposed between the insulating plate and the conductive plate flows into the notch of the conductive plate and solidifies there. Yes. Therefore, in the power module base described in Patent Literature 2, the molten brazing material flows along the side surface of the conductive plate to the electronic element mounting surface and is prevented from solidifying here.

  However, since the solidified brazing material present in the cutout of the conductive plate is accumulated in the cutout of the conductive plate, heating and cooling during soldering of the power device after nickel plating is applied to the electronic element mounting surface Also, due to the thermal cycle when using a power module in which a power device is soldered to the power module base, a relatively large thermal stress is generated at the contact portion between the ceramic insulating plate and the brazing material, and There is a problem that a crack occurs in the insulating plate starting from the contact portion, and the cooling reliability of the power module is lowered.

No. 8-10202 JP 2007-311527 A

  An object of the present invention is to provide an insulating circuit board and a manufacturing method thereof, a power module base and a manufacturing method thereof that can solve the above problems and prevent the insulating layer of the insulating circuit board from cracking when the power module is used. It is to provide.

  In order to achieve the above object, the present invention comprises the following aspects.

1) An insulating circuit board in which a metal conductive layer is brazed to one surface of a ceramic insulating layer, and the surface of the conductive layer opposite to the surface brazed to the insulating layer is an electronic element mounting surface. ,
An insulating circuit board in which a brazing material reservoir is formed on a contour surface that forms a contour of a conductive layer and has a width in the thickness direction of the conductive layer, and stores the brazing material in a non-contact state with respect to the insulating layer.

  2) A contact suppressing portion that has a predetermined width on the contour surface of the conductive layer from the end portion on the insulating layer side toward the electronic element mounting surface, and suppresses contact between the brazing material in the brazing material reservoir and the insulating layer. 1 is provided in the electronic element mounting surface side portion of the contour surface with respect to the contact suppressing portion, and the concave portion is formed as a brazing material reservoir. ) Insulated circuit board.

  3) The insulated circuit board according to 2) above, wherein an end portion on the electronic element mounting surface side of the concave portion serving as a brazing material reservoir in the contour surface of the conductive layer is open to the electronic element mounting surface.

  4) The insulated circuit board according to 3) above, wherein a concave portion serving as a brazing material reservoir in the contour surface of the conductive layer is continuously formed over the entire circumference of the contour surface.

  5) The contour surface of the conductive layer is a stepped surface that gradually decreases from the insulating layer side toward the electronic element mounting surface side through the stepped portion, and the most insulating layer side portion of the stepped surface is in contact The insulated circuit board according to 4) above, wherein the insulating circuit board is a suppressing portion, and a recess serving as a brazing material storage portion is provided in a portion closer to the electronic element mounting surface than the contact suppressing portion on the stepped surface.

  6) The conductive layer is composed of a plurality of metal plates laminated and joined together, the sizes of all the metal plates are different, and the sizes of all the metal plates are sequentially reduced from the insulating layer side. 5) Insulated circuit board.

  7) The insulated circuit board according to 5) or 6) above, wherein a recess opening on the electronic element mounting surface side is formed in at least one of the stepped portions having the stepped surface as the contour surface of the conductive layer.

  8) The insulated circuit board according to 7) above, wherein the concave portion of the step portion is formed by a groove extending over the entire circumference of the step portion.

  9) The insulated circuit board according to 2) above, wherein the concave portion serving as the brazing material reservoir in the contour surface of the conductive layer is a groove formed continuously over the entire circumference of the contour surface.

  10) The conductive layer is composed of a plurality of metal plates laminated and bonded together, and the size of the metal plate located in the middle part of the conductive layer in the thickness direction is smaller than other metal plates. 9. The insulated circuit board according to 9) above, wherein a continuous groove is formed on the contour surface over the entire circumference.

  11) The conductive layer is composed of a plurality of metal plates laminated and bonded to each other, and at least one metal plate is formed with a notch extending across the side and the side facing the metal plate adjacent to the metal plate Thus, the insulated circuit board according to 9) above, wherein a continuous groove is formed on the contour surface over the entire circumference.

12) The insulating layer is made of one material selected from the group consisting of AlN, Al ₂ O ₃ , SiC, Si ₃ N ₄ and BeO, and the most insulating layer side among the plurality of metal plates constituting the conductive layer The metal plate is made of aluminum and brazed to the insulating layer with an Al-Si alloy brazing material. Of the plurality of metal plates constituting the conductive layer, the metal plate closest to the electronic element mounting surface is nickel or copper. The insulated circuit board according to 6), 10) or 11) above, which is made of one material selected from the group consisting of silver and gold.

  13) The insulated circuit board according to any one of 1) to 12) above, wherein a brazing material reservoir recess is formed in a peripheral portion of the electronic element mounting surface of the conductive layer.

  14) The above description 2), wherein the contour surface of the conductive layer is provided with a mixture of a concave portion formed of a notch extending over the contour surface and the electronic element mounting surface and a concave portion formed of a groove extending in the circumferential direction of the contour surface. Insulated circuit board.

  15) The above described 14), wherein the conductive layer is square, the recesses made of notches are provided on the two opposite sides of the conductive layer, and the recesses made of grooves are provided on the remaining two sides. Insulated circuit board.

  16) The power module in which the surface opposite to the surface where the conductive layer is brazed in the insulating layer of the insulated circuit board described in any one of 1) to 15) is brazed to the cooler. For base.

  17) The power module base according to 16) above, wherein a stress relaxation member is interposed between the insulating layer of the insulating circuit board and the cooler, and the stress relaxation member is brazed to the insulating layer and the cooler.

  18) A power module in which a power device is soldered to an electronic element mounting surface of a conductive layer in the insulated circuit board of the power module base described in 16) or 17) above.

19) A method for producing the insulated circuit board according to 6) above,
Prepare an insulating layer made of a ceramic plate and a plurality of conductive layer forming metal plates of different sizes, and put all the metal plates on the insulating layer in order from the largest metal plate. The periphery of the upper metal plate is positioned inside the periphery of the lower metal plate, and a brazing material is disposed between the insulating layer and the lower end metal plate and between adjacent metal plates. Heating is performed to braze the insulating layer, the largest metal plate, and adjacent metal plates, and on the insulating layer, the contour surface gradually decreases from the insulating layer side to the smallest metal plate side through the step portion. Forming a conductive layer having a stepped surface; a portion of the stepped surface closest to the insulating layer as a contact suppressing unit having a predetermined width in the thickness direction of the conductive layer; and a contact suppressing unit on the stepped surface The top of the metal plate side is at the top A method for manufacturing an insulating circuit board, comprising: forming a brazing material reservoir portion that includes a concave portion continuously extending over the entire circumference of the contour surface of the conductive layer and that stores the brazing material in a non-contact state with respect to the insulating layer. .

20) A method for producing the insulated circuit board according to 10) above,
Preparing an insulating layer made of a ceramic plate and a plurality of metal plates for forming a conductive layer, each having a size smaller than the other, all the metal plates on the insulating layer, Place it in a stack so that the smallest metal plate is located in the middle, place brazing material between the insulating layer and the bottom metal plate and between adjacent metal plates, heat the insulating layer and all metal plates The insulating layer and the adjacent metal plate and the adjacent metal plates are brazed to form a conductive layer on the insulating layer in which a groove is continuously formed on the entire circumference, The portion closer to the insulating layer than the groove on the contour surface of the layer is a contact suppressing portion having a predetermined width in the thickness direction of the conductive layer, and the portion on the opposite side of the insulating layer from the contact suppressing portion on the contour surface, Consisting of the groove and the brazing material in a non-contact state with respect to the insulating layer Insulating circuit substrate manufacturing method characterized by forming a brazing material reservoir for storing at.

21) A method for producing the insulated circuit board according to 11) above,
Preparing an insulating layer made of a ceramic plate and a plurality of metal plates for forming a conductive layer, and forming at least one metal plate with a notch extending over one side and side surfaces over the entire circumference, the insulating layer On top of all the metal plates are placed so that the other metal plate exists on one side of the metal plate having the notches where the notches open, and between the insulating layer and the lower end metal plate and adjacent metal. Place the brazing material between the plates, heat the insulating layer and all metal plates, braze the insulating layer to the adjacent metal plate, and the adjacent metal plates, and over the insulating layer all over the contour surface Forming a conductive layer in which a groove extending continuously is formed; a portion closer to the insulating layer than the groove in the contour surface of the conductive layer is a contact suppressing portion having a predetermined width in the thickness direction of the conductive layer; From the contact suppression part on the contour surface On the opposite side of the portion to the insulating layer, the insulating circuit substrate manufacturing method characterized by forming a brazing material reservoir for storing the Katsuro material made from the groove in a non-contact state with respect to the insulating layer.

22) A base for a power module comprising: the insulating circuit board according to 6) above; and a cooler in which a surface opposite to the surface where the conductive layer of the insulating layer of the insulating circuit board is brazed is brazed. A method of manufacturing
Preparing a cooler, an insulating layer made of a ceramic plate, and a plurality of metal plates for forming conductive layers of different sizes, arranging an insulating layer on the cooler, and connecting the cooler and the insulating layer Place the brazing material in between, place all the metal plates on the insulating layer in order from the largest metal plate in a stacked manner, and position the periphery of the upper metal plate inside the periphery of the lower metal plate Placing a brazing material between the insulating layer and the lower metal plate and between adjacent metal plates, heating the cooler, the insulating layer and all the metal plates, the cooler and the insulating layer, the insulating layer and the largest metal plate, Then, adjacent metal plates are brazed to form a conductive layer having a stepped surface whose contour surface gradually decreases from the insulating layer side toward the smallest metal plate side through the step portion on the insulating layer. A portion of the stepped surface closest to the insulating layer is a conductive layer A contact suppressing portion having a predetermined width in the thickness direction, and a continuous concave portion extending over the entire circumference of the contour surface of the conductive layer, with the upper end opening upward at a portion closer to the metal plate than the contact suppressing portion on the stepped surface And forming a brazing material storage part for storing the brazing material in a non-contact state with respect to the insulating layer.

23) A base for a power module comprising: the insulating circuit board according to 10) above; and a cooler in which a surface opposite to the surface where the conductive layer of the insulating layer of the insulating circuit board is brazed is brazed. A method of manufacturing
Prepare a cooler, an insulating layer made of a ceramic plate, and a plurality of metal plates for forming a conductive layer, each having a size smaller than the other, and an insulating layer on the cooler In addition to placing the brazing material between the cooler and the insulating layer, place all the metal plates on the insulating layer in a stacked manner so that the smallest metal plate is located in the middle, and insulate Placing a brazing material between the layers and the metal plates and between adjacent metal plates, heating the cooler, insulating layer and all metal plates to cool the cooler and insulating layer, insulating layer and adjacent metal plate, Adjacent metal plates are brazed to form a conductive layer on the insulating layer in which a groove is continuously formed on the entire contour surface, closer to the insulating layer than the groove on the contour surface of the conductive layer. Is a contact suppressing portion having a predetermined width in the thickness direction of the conductive layer. A power characterized by forming a brazing material storage portion that is formed of the groove and stores the brazing material in a non-contact state with respect to the insulating layer in a portion of the contour surface opposite to the insulating layer from the contact suppressing portion. Manufacturing method of module base.

24) A base for a power module comprising: the insulating circuit board according to 11) above; and a cooler having a surface opposite to the surface where the conductive layer of the insulating layer of the insulating circuit board is brazed. A method of manufacturing
A cooler, an insulating layer made of a ceramic plate, and a plurality of metal plates for forming a conductive layer are prepared, and at least one metal plate is formed with a notch extending over one side and side surfaces thereof over the entire circumference. In addition to disposing an insulating layer on the cooler, disposing a brazing material between the cooler and the insulating layer, all the metal plates on the insulating layer are notched in the metal plate having notches. Place the metal plate so that there is another metal plate on one side of the opening, and place a brazing material between the insulating layer and the lower metal plate and between adjacent metal plates, cooler, insulating layer and all metal plates Is heated to cool the cooler and the insulating layer, the insulating layer and the adjacent metal plate, and the adjacent metal plates are brazed to each other. Forming a conductive layer on the contour surface of the conductive layer. The portion closer to the insulating layer than the groove is a contact suppressing portion having a predetermined width in the thickness direction of the conductive layer, and the groove is formed on the opposite side of the contour surface to the insulating layer from the contact suppressing portion. A method for manufacturing a base for a power module, characterized in that a brazing filler material storage portion is formed in which the brazing filler metal is stored in a non-contact state with respect to the insulating layer.

25) The insulating layer is made of one material selected from the group consisting of AlN, Al ₂ O ₃ , SiC, Si ₃ N ₄ and BeO, and is the closest to the insulating layer among a plurality of metal plates constituting the conductive layer. The metal plate is made of aluminum, and the metal plate farthest from the insulating layer among the plurality of metal plates constituting the conductive layer is made of one material selected from the group consisting of nickel, copper, silver and gold, The method for producing a base for a power module according to any one of the above 22) to 24), wherein the brazing material comprises an Al-Si alloy-based brazing material.

  26) A stress relieving member is disposed between the cooler and the insulating layer, and a brazing material is disposed between the cooler and the insulating layer and the stress relieving member, so that the cooler, the stress relieving member, the insulating layer, and the The above-mentioned 22) to 25) for brazing the cooler and the stress relaxation member, the stress relaxation member and the insulating layer, the insulating layer and the adjacent metal plate, and the adjacent metal plates by heating while pressing all metal plates The manufacturing method of the base for power modules in any one of these.

  According to the insulated circuit boards of 1) to 15) above, the brazing material is stored in a non-contact state with respect to the insulating layer on the contour surface that forms the contour of the conductive layer and has a width in the thickness direction of the conductive layer. Since the material storage portion is formed, the insulating layer and the conductive layer are used when the insulating layer and the conductive layer are brazed when the insulating circuit substrate is manufactured and when the power module base including the insulating circuit substrate is manufactured. Even if the brazing filler metal placed between the molten solder and the molten brazing filler metal flows through the contour surface to the electronic element mounting surface side of the conductive layer, the molten brazing filler metal is stored in the brazing filler reservoir. Thus, the molten brazing material covers the electronic element mounting surface of the conductive layer and is prevented from solidifying on the electronic element mounting surface. Accordingly, the presence of the hardened brazing material on the electronic element mounting surface of the conductive layer is suppressed, and the occurrence of defects in the nickel plating applied to the electronic element mounting surface of the conductive plate is suppressed. Even when the electronic element is soldered to the electronic element mounting surface of the layer, a decrease in the thermal cycle life of the electronic element is suppressed. Moreover, since the brazing material storage part stores the brazing material in a non-contact state with respect to the insulating layer, heating and cooling during power device soldering after nickel plating is applied to the electronic element mounting surface, and an insulating circuit board The insulation layer caused by the thermal stress generated at the contact between the ceramic insulation layer and the solidified brazing material is also affected by the thermal cycle during use of the power module in which the power device is soldered to the power module base with Cracking is prevented and the cooling reliability of the power module is improved.

  According to the insulated circuit boards of the above 2) to 4), during the brazing of the insulating layer and the conductive layer during the production of the insulated circuit board and during the production of the power module base including the insulated circuit board, the brazing While being reliably stored in the concave portion serving as the material storage portion and solidifying here, contact with the insulating layer is effectively prevented.

  According to the insulated circuit board of 5) above, the insulating layer and the conductive layer are electrically conductive during brazing between the insulating layer and the conductive layer during the production of the insulated circuit board and during the production of the power module base including the insulated circuit board. Even if the brazing filler metal disposed between the layers melts and the molten brazing filler metal flows through the contour surface to the electronic element mounting surface side of the conductive layer, the molten brazing filler metal is effectively used as the brazing filler reservoir. It is stored in the recess that becomes and solidifies here.

  According to the insulated circuit board of 6), the insulated circuit board of 5) can be obtained relatively easily.

  According to the insulated circuit boards of the above 7) and 8), when the insulated circuit board is manufactured, and when the insulating layer and the conductive layer are brazed during the production of the base for the power module equipped with the insulated circuit board, melting occurs. The brazing material is effectively prevented from flowing into the electronic element mounting surface.

  According to the insulated circuit board of 9) above, the insulating layer and the conductive layer are electrically conductive during brazing between the insulating layer and the conductive layer during the production of the insulated circuit board and during the production of the power module base including the insulated circuit board. Even if the brazing filler metal disposed between the layers melts and the molten brazing filler metal flows through the contour surface to the electronic element mounting surface side of the conductive layer, the molten brazing filler metal is effectively used as the brazing filler reservoir. It is stored in a groove that constitutes a recess to become solidified here.

  According to the insulating circuit boards of 10) and 11), the insulating circuit board of 9) can be obtained relatively easily.

  According to the insulating circuit board of 12) above, the metal plate closest to the electronic element mounting surface among the plurality of metal plates constituting the conductive layer is one material selected from the group consisting of nickel, copper, silver and gold Therefore, it is not necessary to apply nickel, copper, silver, or gold plating to the electronic element mounting surface before soldering the power module to the power module base equipped with the insulated circuit board, thereby reducing the number of manufacturing steps. At the same time, the manufacturing cost is reduced.

  According to the insulated circuit board of 13) above, the molten brazing material is used during brazing between the insulating layer and the conductive layer during the production of the insulated circuit board and during the production of the power module base including the insulated circuit board. It is effectively prevented from flowing into the portion where the electronic element is mounted on the electronic element mounting surface.

  According to the power module base of 16) and 17) above, the brazing material disposed between the insulating layer and the conductive layer when brazing the insulating layer and the conductive layer at the time of manufacturing the power module base is Even when the molten brazing material flows to the electronic element mounting surface side of the conductive layer through the contour surface, the molten brazing material is stored in the brazing material reservoir and solidifies there. It is suppressed that the material covers the electronic element mounting surface of the conductive layer and solidifies on the electronic element mounting surface. Accordingly, the presence of the hardened brazing material on the electronic element mounting surface of the conductive layer is suppressed, and the occurrence of defects in the nickel plating applied to the electronic element mounting surface of the conductive plate is suppressed. Even when the electronic element is soldered to the electronic element mounting surface of the layer, a decrease in the thermal cycle life of the electronic element is suppressed. Moreover, since the brazing material reservoir stores the brazing material in a non-contact state with respect to the insulating layer, it is used for heating and cooling during power device soldering after nickel plating is applied to the electronic element mounting surface, and for power modules. The cooling cycle when using a power module with a power device soldered to the base also prevents cracking of the insulating layer due to thermal stress generated at the contact between the ceramic insulating layer and the solidified brazing material. Improved module cooling reliability.

  According to the power module base of 17) above, the difference in linear thermal expansion coefficient between the insulating layer and the cooler during the cooling cycle when using the power module in which the power module is soldered to the electronic device mounting surface Since the thermal stress generated due to this is relieved by the stress relieving member, the occurrence of cracks in the insulating layer is suppressed.

  According to the method 19), the insulated circuit board 6) can be manufactured relatively easily.

  According to the method 20), the insulated circuit board 10) can be manufactured relatively easily.

  According to the method 21), the insulated circuit board 11) can be manufactured relatively easily.

  According to the method of 22), the power module base including the insulating circuit board of 6) can be manufactured relatively easily.

  According to the method of 23), a power module base including the insulating circuit board of 10) can be manufactured relatively easily.

  According to the method of 24), the power module base including the insulating circuit board of 11) can be manufactured relatively easily.

  According to the above method 25), it is not necessary to apply nickel, copper, silver or gold plating to the electronic element mounting surface before soldering the power module to the manufactured power module base, thereby reducing the number of manufacturing steps. In addition, the manufacturing cost is reduced.

  According to the method 26), the power module 17) can be manufactured relatively easily.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a vertical sectional view showing a power module configured by mounting a power device on a power module base having an insulated circuit board according to Embodiment 1 of the present invention. It is the elements on larger scale of FIG. FIG. 9 is a view corresponding to FIG. 2 and showing a first modification of the conductive layer. It is a figure equivalent to FIG. 2 which shows the 2nd modification of a conductive layer. It is a figure equivalent to FIG. 2 which shows the 3rd modification of an electroconductive layer. It is a figure equivalent to FIG. 2 which shows the 4th modification of a conductive layer. It is a figure equivalent to FIG. 2 which shows the 5th modification of a conductive layer. It is a figure equivalent to FIG. 2 which shows the 6th modification of a conductive layer. It is a figure equivalent to FIG. 2 which shows the 7th modification of an electroconductive layer. It is a figure equivalent to FIG. 2 which shows the 8th modification of a conductive layer. It is a figure equivalent to FIG. 2 which shows the 9th modification of an electroconductive layer. It is a figure equivalent to FIG. 2 which shows the 10th modification of a conductive layer. It is a figure equivalent to FIG. 2 which shows the 11th modification of a conductive layer. It is a figure equivalent to FIG. 2 which shows the 12th modification of a conductive layer. It is a perspective view which shows the 13th modification of a conductive layer. It is a perspective view which shows the 14th modification of a conductive layer. It is a vertical sectional view showing a power module configured by mounting a power device on a power module base having an insulated circuit board according to Embodiment 2 of the present invention. It is a vertical sectional view showing a power module configured by mounting a power device on a power module base having an insulated circuit board according to Embodiment 3 of the present invention. It is vertical sectional drawing which shows the comparative example performed with the Example.

  Embodiments of the present invention will be described below with reference to the drawings.

  In the following description, the top and bottom in FIG.

  Moreover, the same code | symbol is attached | subjected to the same part and the same thing through all drawings, and the overlapping description is abbreviate | omitted.

Embodiment 1
This embodiment is shown in FIG. 1 and FIG.

  FIG. 1 shows a power module in which a power device is mounted on an electronic element mounting surface of a conductive layer in a power module base including the insulating circuit board of Embodiment 1, and FIG. 2 shows a main part of FIG.

  In FIG. 1, the power module (1) includes a power module base (2) and a power device (3) (electronic element) mounted on the power module base (2).

  The power module base (2) includes an insulating circuit board (4) comprising a rectangular ceramic insulating plate (5) (insulating layer) and a conductive layer (6) brazed to the upper surface of the insulating plate (5). The insulating circuit board (4) is constituted by an aluminum cooler (7) (heat sink) to which the lower surface of the insulating plate (5) is brazed. Here, the conductive layer (6) is composed of a single rectangular aluminum plate (10). Although not shown in FIG. 1, a plurality of conductive layers (6) are brazed to one insulating plate (5), and one cooler (7) is formed of a plurality of insulated circuit boards (4). The insulating plate (5) is generally brazed.

The insulating plate (5) of the insulating circuit board (4) may be formed of any ceramic as long as it satisfies the required electrical insulation characteristics, thermal conductivity and mechanical strength. For example, AlN , Al ₂ O ₃ , SiC, Si ₃ N ₄ and BeO are preferably formed from one material selected from the group consisting of BeO. The outer peripheral edge of the insulating plate (5) is located outside the outer peripheral edge of the conductive layer (6), and the insulation performance between the conductive layer (6) and the cooler (7) is sufficiently ensured. ing.

  The aluminum plate (10) constituting the conductive layer (6) is made of pure aluminum having high electrical conductivity and thermal conductivity and high deformability, for example, pure aluminum having a purity of 99.99% by mass or more. preferable. The upper surface of the conductive layer (6), that is, the surface opposite to the surface brazed to the insulating plate (5) in the conductive layer (6) is the electronic element mounting surface (8).

  The brazing material is not contacted with the insulating plate (5) on the contour surface (9) that forms the contour of the conductive layer (6) and has a width in the thickness direction (vertical direction) of the conductive layer (6). A brazing material storage part (11) for storing is provided. That is, as shown in FIG. 2, the contour surface (9) of the conductive layer (6) has a predetermined width from the end on the insulating plate (5) side toward the electronic element mounting surface (8), and A contact suppression unit (12) that suppresses contact between the brazing material in the brazing material storage unit (11) and the insulating plate (5) is provided, and is more electronic than the contact suppression unit (12) in the contour surface (9). On the element mounting surface (8) side (upper side), a concave portion (13) that is recessed with respect to the contact restraining portion (12) and whose upper end opens to the electronic device mounting surface (8) has a contour surface (9). It is continuously formed over the entire circumference so as to trace. In other words, the stepped surface in which the contour surface (9) of the conductive layer (6) is gradually reduced from the insulating plate (5) side toward the electronic element mounting surface (8) side through the stepped portion (14a). The portion of the stepped surface (14) closest to the insulating plate (5) is the contact suppressing portion (12) and more than the contact suppressing portion (12) of the stepped surface (14). A concave portion (13) serving as a brazing material reservoir (11) is formed in the upper portion. Here, the stepped surface (14) is reduced by one step through one stepped portion (14a), and has two rectangular portions whose outer shape seen from the plane is doubled. It will be.

  The cooler (7) has a flat hollow shape in which a plurality of cooling fluid passages (15) are provided in parallel, and is preferably formed of aluminum which is excellent in thermal conductivity and lightweight. Either a liquid or a gas may be used as the cooling fluid. As the cooler (7), a cooler in which inner fins are arranged in a case may be used.

  The power device (3) is soldered onto the nickel plating on the electronic device mounting surface (8) after the electronic device mounting surface (8) of the conductive layer (6) of the insulated circuit board (4) is plated. Thus, it is mounted on the power module base (2). Heat generated from the power device (3) is transmitted to the cooler (7) through the conductive layer (6) and the insulating plate (5), and is dissipated to the cooling fluid flowing in the cooling fluid passage (15). It has become.

  The manufacturing method of the power module base (2) including the insulating circuit board (4) is as follows.

  The aluminum plate (10) having the concave portion (13) on the side surface serving as the contour surface (9) of the conductive layer (6) is prepared in advance by an appropriate method such as press punching, punching and engraving, or casting. A cooler (7) and an insulating plate (5) are prepared. First, the insulating plate (5) and the aluminum plate (10) are arranged in this order on the cooler (7). Aluminum brazing material layers are provided between the cooler (7) and the insulating plate (5) and between the insulating plate (5) and the aluminum plate (10), respectively. The brazing material layer is made of, for example, an Al—Si alloy brazing material containing 10% by mass of Si and comprising the balance Al and inevitable impurities. The brazing material layer disposed between the cooler (7) and the insulating plate (5) is made of a brazing material foil, an aluminum brazing sheet having brazing material layers formed on both sides of the core material, or the like. The brazing material layer disposed between the insulating plate (5) and the aluminum plate (10) is made of a brazing material foil or an aluminum brazing sheet in which a brazing material layer is formed on both sides of the core material. Further, the brazing material layer disposed between the insulating plate (5) and the aluminum plate (10) may be clad in advance on the lower surface of the aluminum plate (10).

  Thereafter, the aluminum plate (10), the insulating plate (5) and the cooler (7) are pressed with an appropriate jig and temporarily fixed, and then placed in a heating furnace in a vacuum atmosphere at an appropriate temperature. At the same time as manufacturing the insulated circuit board (4) composed of the insulating plate (5) and the conductive layer (6) by brazing the insulating plate (5) and the aluminum plate (10) by heating for an appropriate time. The insulating plate (5) of the insulating circuit board (4) and the cooler (7) are brazed. Thus, the power module base (2) is manufactured.

  When brazing the insulating plate (5) and the aluminum plate (10) to be the conductive layer (6) at the time of manufacturing the power module base (2) described above, the insulating plate (5) and the aluminum plate (10) As the brazing filler metal placed between the two parts melts, the molten brazing filler metal flows through the contour surface (9) of the conductive layer (6) to the electronic element mounting surface (8) side, as shown by the chain line in FIG. In addition, the molten brazing material (B) is stored in the recess (13) which becomes the brazing material reservoir (11) and solidifies here, and the molten brazing material is the electronic element mounting surface of the conductive layer (6). Solidification on the electronic element mounting surface (8) by covering (8) is suppressed. Therefore, the presence of the hardened brazing material on the electronic element mounting surface (8) of the conductive layer (6) is suppressed, and defects occur in the nickel plating applied to the electronic element mounting surface (8) of the conductive layer (6). When the power device (3) is soldered to the electronic element mounting surface (8) of the nickel-plated conductive layer (6), the thermal cycle life of the power device (3) is also reduced. It is suppressed. Moreover, since the brazing material reservoir (11) stores the brazing material (B) in a non-contact state with respect to the insulating plate (5), the power device after the nickel plating is applied to the electronic element mounting surface (8) ( The ceramic insulating plate (3) can also be heated and cooled during soldering and the cooling cycle when using the power module (1) with the power device (3) soldered to the power module base (2). The insulating plate (5) is prevented from cracking due to the thermal stress generated at the contact portion between 5) and the solidified brazing material, and the cooling cycle reliability of the power module (1) is improved.

  3 to 14 show modifications of the conductive layer.

  The conductive layer (20) shown in FIG. 3 is composed of a plurality of rectangular aluminum plates (21) and (22), which are laminated in the vertical direction and brazed to each other and having different sizes, here two aluminum plates. The sizes of (21) and (22) are different, and the sizes of all the aluminum plates (21) and (22) are gradually reduced from the insulating plate (5) side (lower side) to the upper side. The aluminum plates (21) and (22) are made of the same material as the aluminum plate (10) forming the conductive layer (6) shown in FIG. The upper surface of the upper aluminum plate (21) of the conductive layer (20) is the electronic element mounting surface (8).

  The size of the two aluminum plates (21) and (22) forming the conductive layer (20) is gradually reduced from the insulating plate (5) side (lower side) to the upper side, so that the conductive layer (20 ) In the contour surface (9) is provided with a contact suppression portion (12) consisting of the side surface of the lower aluminum plate (22) and having a predetermined width in the vertical direction, and a contact suppression portion in the contour surface (9) ( The concave portion (13), which is recessed with respect to the contact suppressing portion (12) and whose upper end portion is open to the electronic element mounting surface (8), is entirely above the contour surface (9). It is formed continuously over the circumference. Then, like the insulating layer (6) in FIG. 2, the contour surface (9) of the conductive layer (20) has one step (from the insulating plate (5) side to the electronic element mounting surface (8) side. 14a) is used to form a stepped surface (14) that is reduced by one step, and the portion of the stepped surface (14) that is closest to the insulating plate (5) is the contact suppressing portion (12). A concave portion (13) serving as a brazing filler material storage portion (11) is formed in a portion of the attachment surface (14) above the contact suppressing portion (12). Other configurations are the same as those of the conductive layer (6) shown in FIG.

  The manufacturing method of the base for power modules provided with the conductive layer (20) shown in FIG. 3 is as follows.

  That is, prepare a cooler (7), an insulating plate (5), and two aluminum plates (21) and (22) of different sizes, and place the insulating plate (5) on the cooler (7). At the same time, on the insulating plate (5), both aluminum plates (21) and (22) are stacked in order from the large aluminum plate (22), and the upper aluminum plate (21) is placed on the lower aluminum plate (22). ) On the inner side of the periphery. Between the cooler (7) and the insulating plate (5), between the insulating plate (5) and the lower aluminum plate (22), and between the aluminum plates (21) and (22), respectively, FIG. The same aluminum brazing filler metal layer as that for manufacturing the power module base (2) shown in FIG. 2 is provided. The brazing material layer disposed between the cooler (7) and the insulating plate (5) is made of a brazing material foil, an aluminum brazing sheet having brazing material layers formed on both sides of the core material, or the like. The brazing material layer placed between the insulating plate (5) and the lower aluminum plate (22) and between the two aluminum plates (21) and (22) forms a brazing material layer on both sides of the brazing material foil and core. Made of an aluminum brazing sheet. Further, the brazing material layer disposed between the insulating plate (5) and the conductive layer (6) may be clad in advance on the lower surface of the lower aluminum plate (22), both aluminum plates (21) ( 22) The brazing material layer disposed between the upper aluminum plate (21) and the upper surface of the lower aluminum plate (22) may be clad in advance.

  After that, the aluminum plate (21) (22), the insulating plate (5), and the cooler (7) were pressed with an appropriate jig and temporarily fixed in a vacuum furnace. After heating to an appropriate temperature for an appropriate time and brazing the insulating plate (5) with the lower aluminum plate (22) and both aluminum plates (21) and (22), a contour is formed on the insulating plate (5). A conductive layer (6) having a stepped surface (14) in which the surface (9) is gradually reduced from the insulating plate (5) side to the upper side through the stepped portion (14a) is formed, and the insulating plate The insulating circuit board (4) composed of (5) and the conductive layer (20) is manufactured, and at the same time, the insulating plate (5) of the insulating circuit board (4) and the cooler (7) are brazed. Thus, the power module base is manufactured.

  As the conductive layer (25) shown in FIG. 4, a nickel plate (26) having the same dimensions as the upper aluminum plate (21) was used instead of the upper aluminum plate (21) in the conductive layer (20) shown in FIG. The upper surface of the nickel plate (26) is the electronic element mounting surface (8). The other structure is the same as that of the conductive layer (20) shown in FIG. 3, and the base for the power module having the conductive layer (25) shown in FIG. 4 has a nickel plate (26) instead of the upper aluminum plate (21). And manufactured in the same manner as the power module base having the conductive layer (20) shown in FIG.

  In the case of the power module base having the conductive layer (25) shown in FIG. 4, before the power device (3) is soldered to the electronic element mounting surface (8) of the conductive layer (25), the electronic element mounting surface (8 ) Need not be nickel plated.

  The conductive layer (30) shown in FIG. 5 is made of an aluminum plate (10) similar to the conductive layer (6) shown in FIG. There are a plurality of contour surfaces (9) of the conductive layer (30) from the insulating plate (5) side to the electronic element mounting surface (8) side, here two steps through two step portions (14a) and (14b). The stepped surface (14) is gradually reduced, and the portion of the stepped surface (14) closest to the insulating plate (5) is the contact suppressing portion (12). Further, the stepped surface (14) has a concave portion with respect to the contact suppressing portion (12) and an upper end opened to the electronic element mounting surface (8) at a portion above the contact suppressing portion (12), and a brazing material. A recess (31) serving as a reservoir (11) is continuously formed over the entire circumference so as to trace the contour surface (9). The stepped surface (14) is reduced by two steps through the two step portions (14a) and (14b), and has three rectangular portions whose outer shape viewed from the plane is triple. become. The other structure is the same as that of the conductive layer (6) shown in FIG. 2, and the base for the power module having the conductive layer (30) shown in FIG. 5 has a side surface that becomes the contour surface (9) of the conductive layer (30). A power module having a conductive layer (6) shown in FIG. 2 using an aluminum plate (10) having a stepped surface (14) that is reduced by two steps through two step portions (14a) and (14b). Manufactured in the same way as the base.

  The conductive layer (35) shown in FIG. 6 is composed of a plurality of rectangular aluminum plates (36) (37) (38) which are laminated in the vertical direction and are brazed to each other and having different sizes, in this case, three sheets, The sizes of all the aluminum plates (36), (37), and (38) are different, and the sizes of all the aluminum plates (36), (37), and (38) are gradually reduced from the lower side toward the upper side. The aluminum plates (36), (37), and (38) are made of the same material as the aluminum plate forming the conductive layer (6) shown in FIG. The upper surface of the upper aluminum plate (36) of the conductive layer (6) is the electronic element mounting surface (8).

  The size of the three aluminum plates (36), (37) and (38) forming the conductive layer (35) is gradually reduced from the lower side to the upper side, so that the contour surface of the conductive layer (35) ( 9) A plurality of stepped surfaces from the insulating plate (5) side toward the electronic element mounting surface (8) side, here stepped surfaces that are successively reduced in two steps via two step portions (14a) (14b) ( 14), and the portion of the stepped surface (14) closest to the insulating plate (5) is the contact suppression portion (12), and is above the contact suppression portion (12) of the stepped surface (14). In this part, a recess (31) to be a brazing material reservoir (11) is formed. The other configuration is the same as that of the conductive layer (30) shown in FIG.

  The power module base having the conductive layer (35) shown in FIG. 6 uses three aluminum plates (36), (37) and (38) instead of the two aluminum plates (21) and (22). It is manufactured in the same manner as the power module base having the conductive layer (20) shown in FIG.

  In the conductive layer (40) shown in FIG. 7, a nickel plate (41) having the same dimensions as the upper aluminum plate (36) was used instead of the upper aluminum plate (36) in the conductive layer (35) shown in FIG. The upper surface of the nickel plate (41) is the electronic element mounting surface (8). The other configuration is the same as that of the conductive layer (35) shown in FIG. 6, and the power module base having the conductive layer (40) shown in FIG. 7 has a nickel plate (41) instead of the upper aluminum plate (36). And manufactured in the same manner as the power module base having the conductive layer (35) shown in FIG.

  In the case of the power module base having the conductive layer (40) shown in FIG. 7, before the power device (3) is soldered to the electronic element mounting surface (8) of the conductive layer (40), the electronic element mounting surface (8 ) Need not be nickel plated.

  The conductive layer (45) shown in FIG. 8 is made of an aluminum plate (10) similar to the conductive layer (6) shown in FIG. 2, and in addition to the recess (13), a power device (8) on the electronic element mounting surface (8) ( In the portion closer to the outer periphery than the portion to be soldered 3), a brazing material reservoir recess (46) opened upward is formed. The brazing material reservoir recess (46) may be formed continuously over the entire periphery of the periphery of the conductive layer (45) or may be formed intermittently. The other structure is the same as that of the conductive layer (6) shown in FIG. 2, and an aluminum plate (10) having a brazing material reservoir recess (46) in addition to the recess (13) is used to form the conductive layer ( It is manufactured in the same manner as the power module base having 6).

  In addition, in the conductive layers (20), (25), (30), (35), and (40) shown in FIGS. 3 to 7, the power device (3) on the electronic element mounting surface (8) is more than the portion to be soldered. A brazing material reservoir recess (46) opened upward may be formed in a portion near the outer periphery.

  The conductive layer (50) shown in FIG. 9 is made of the same aluminum plate (10) as the conductive layer (6) shown in FIG. 2, and in addition to the recess (13), the step (14a) of the stepped surface (14) is formed. ), A concave groove (51) that opens upward and extends over the entire circumference of the stepped portion (14a) is continuously formed. The other configuration is the same as that of the conductive layer (6) shown in FIG. 2, and an aluminum plate (10) having a concave groove (51) in addition to the concave portion (13) is used to form the conductive layer (6) shown in FIG. It is manufactured in the same manner as the power module base having

  In addition, also in the conductive layers (20), (25), (30), (35), and (40) shown in FIGS. 3 to 8, the step portions (14a) and (14b) are opened upward and the step portions (14a) ( The concave groove (51) may be formed continuously over the entire circumference of 14b).

  The conductive layer (55) shown in FIG. 10 is made of the same aluminum plate (10) as the conductive layer (6) shown in FIG. 2, and is formed in the middle in the vertical direction of the contour surface (9) of the conductive layer (55). A groove (56) is continuously formed over the entire circumference so as to trace the contour surface (9), and the groove (56) stores the brazing material in a non-contact state with respect to the insulating plate (5). Part (11). Further, in the part below the groove (56) in the contour surface (9) of the conductive layer (55), the brazing material and the insulating plate having a predetermined width in the vertical direction and in the brazing material reservoir (11) ( A contact suppressing part (12) for suppressing contact with 5) is provided. The base for a power module having the conductive layer (55) shown in FIG. 10 uses an aluminum plate (10) in which a groove (56) is formed on the side surface that becomes the contour surface (9) of the conductive layer (55). It is manufactured in the same manner as the power module base having the conductive layer (6) shown in FIG.

  The conductive layer (60) shown in FIG. 11 is composed of two rectangular aluminum plates (61) and (62) laminated in the vertical direction and brazed to each other. Each aluminum plate (61) (62) is made of the same material as the aluminum plate (10) forming the conductive layer (6) shown in FIG. 2, and the thickness of the upper aluminum plate (61) is lower aluminum. It is larger than the wall thickness of the plate (62).

  By forming a notch (63) across the lower surface of the upper aluminum plate (61) (the surface facing the lower aluminum plate (62) side) and the side surface over the entire circumference of the upper aluminum plate (61), A groove (56) is continuously formed in the middle of the contour surface (9) in the vertical direction so as to trace the contour surface (9), and the groove (56) serves as a brazing material and an insulating plate ( In contrast to 5), it is a brazing material reservoir (11) that can be accumulated in a non-contact state. Other configurations are the same as those of the conductive layer (55) shown in FIG.

  The power module base having the conductive layer (60) shown in FIG. 11 includes an upper aluminum plate (61) having a notch (63) instead of two aluminum plates (21) and (22) having different sizes. The lower aluminum plate (62) is used in the same manner as the power module base having the conductive layer (20) shown in FIG.

  The conductive layer (65) shown in FIG. 12 is composed of two rectangular aluminum plates (66) and (67) laminated in the vertical direction and brazed to each other. Each aluminum plate (66) (67) is made of the same material as the aluminum plate (10) forming the conductive layer (6) shown in FIG. 2, and the thickness of the lower aluminum plate (67) is the upper aluminum plate. It is larger than the wall thickness of the plate (66).

  By forming a notch (63) extending over the upper surface of the lower aluminum plate (67) (the surface facing the upper aluminum plate (66)) and the side surface over the entire circumference of the lower aluminum plate (67) The groove (56) is continuously formed in the middle of the contour surface (9) in the vertical direction so as to trace the contour surface (9), and the groove (56) serves as a brazing material and an insulating plate. In contrast to (5), it is a brazing material reservoir (11) that accumulates in a non-contact state. Other configurations are the same as those of the conductive layer (55) shown in FIG.

  The power module base having the conductive layer (65) shown in FIG. 12 has an upper aluminum plate (66) and a notch (68) instead of the two aluminum plates (21) and (22) having different sizes. The lower aluminum plate (67) is used in the same manner as the power module base having the conductive layer (20) shown in FIG.

  In the conductive layer (70) shown in FIG. 13, a nickel plate (71) having the same dimensions as the upper aluminum plate (66) was used instead of the upper aluminum plate (66) in the conductive layer (65) shown in FIG. The upper surface of the nickel plate (71) is the electronic element mounting surface (8). The other configuration is the same as that of the conductive layer (65) shown in FIG. 12, and the base for the power module having the conductive layer (40) shown in FIG. 13 has a nickel plate (71) instead of the upper aluminum plate (66). And manufactured in the same manner as the power module base having the conductive layer (65) shown in FIG.

  In the case of the power module base having the conductive layer (70) shown in FIG. 13, before the power device (3) is soldered to the electronic element mounting surface (8) of the conductive layer (70), the electronic element mounting surface (8 ) Need not be nickel plated.

  The conductive layer (75) shown in FIG. 14 has two rectangular aluminum plates laminated in the vertical direction and brazed to each other instead of the lower aluminum plate (67) in the conductive layer (70) shown in FIG. (76) (77) is used. The outer shape of the aluminum plate (76) at the intermediate portion in the vertical direction of the conductive layer (75) is smaller than the outer shapes of the aluminum plate (77) located at the lower end and the plate (71) at the upper end. That is, the conductive layer (75) is composed of a plurality of laminated and brazed, in this case, three plates (71), (76), (77), in the middle of the conductive layer (75) in the thickness direction. The size of the aluminum plate (76) positioned is made smaller than the other plates (71) (77), so that it becomes continuous to the contour surface (9) over its entire circumference and becomes a brazing material reservoir (11). A groove (56) is formed. The power module base having the conductive layer (75) shown in FIG. 14 has a nickel plate (71) and two aluminum plates instead of the three aluminum plates (36) (37) (38) having different sizes. (76) Using (77), it is manufactured in the same manner as the power module base having the conductive layer (35) shown in FIG.

  In the case of the base for a power module having the conductive layer (75) shown in FIG. 14, before the power device (3) is soldered to the electronic element mounting surface (8) of the conductive layer (70), the electronic element mounting surface (8 ) Need not be nickel plated.

  In the conductive layer (75) shown in FIG. 14, the upper aluminum plate (66) of the conductive layer (65) shown in FIG. 12 may be used instead of the plate (71).

  In the above, the conductive layers (20) (25) (35) (40) (60) (65) (70) (75) shown in FIGS. 3, 4, 6, 7, 11 to 14 are used. ), The plurality of plates forming them are brazed, but the present invention is not limited to this, and may be joined by other appropriate methods such as rolling. In this case, after a plurality of plates are joined to form the conductive layers (20) (25) (35) (40) (60) (65) (70) (75), the conductive layers (20) (25) ( 35) (40) (60) (65) (70) (75) are brazed to the insulating plate (5).

  Further, the conductive layers (20) (25) (35) (40) (60) (65) (70) (75) shown in FIGS. 3, 4, 6, 7, and 11 to 14 are formed. The number of plates can also be changed as appropriate.

  The conductive layer (80) shown in FIG. 15 is made of an aluminum plate (10) similar to the conductive layer (6) shown in FIG. 2, and has two opposing sides on the contour surface (9) of the conductive layer (80). A concave portion (81) made of a groove extending in the length direction of the side portion is formed in the middle portion in the vertical direction of the side portion, and has a predetermined width in the vertical direction at a portion below the concave portion (81). A contact suppressing portion (12) that suppresses contact between the brazing filler metal in the brazing material reservoir (11) and the insulating plate (5) is provided. Further, the remaining two sides of the contour surface (9) of the conductive layer (80) are formed with a recess (82) consisting of a notch straddling the contour surface (9) and the electronic device mounting surface (8). A contact suppressing portion (12) having a predetermined width in the vertical direction and suppressing contact between the brazing material in the brazing material reservoir (11) and the insulating plate (5) at a portion below the concave portion (82). Is provided. The recess (81) made of a groove and the recess (82) made of a notch serve as a brazing material reservoir (11) for accumulating the brazing material in a non-contact state with respect to the insulating plate (5).

  The base for a power module having the conductive layer (80) shown in FIG. 15 has an aluminum plate (10) in which concave portions (81) and (82) are formed on the side surface which becomes the contour surface (9) of the conductive layer (80). And manufactured in the same manner as the power module base having the conductive layer (6) shown in FIG.

  The conductive layer (85) shown in FIG. 16 is made of an aluminum plate (10) similar to the conductive layer (6) shown in FIG. 2, and is formed vertically below the contour surface (9) of the conductive layer (85). Is provided with a contact suppression part (12) having a width of, indented with respect to the contact suppression part (12) in the upper part of the contact suppression part (12), and the upper end portion of the electronic element mounting surface (8) A plurality of recesses (86) are formed at intervals in the length direction of each side portion. The recess (86) serves as a brazing material reservoir (11) that accumulates the brazing material in a non-contact state with respect to the insulating plate (5).

  The base for a power module having the conductive layer (85) shown in FIG. 16 uses an aluminum plate (10) in which a concave portion (86) is formed on the side surface that becomes the contour surface (9) of the conductive layer (85). It is manufactured in the same manner as the power module base having the conductive layer (6) shown in FIG.

Embodiment 2
This embodiment is shown in FIG.

  FIG. 17 shows a power module in which a power device is mounted on an electronic element mounting surface of a conductive layer in a power module base including the insulated circuit board according to the second embodiment.

  In FIG. 17, the power module (90) includes a power module base (91) and a power device (3) (electronic element) mounted on the power module base (91).

  The power module base (91) includes a stress relaxation member (92) between the insulating plate (5) of the insulated circuit board (4) and the cooler (7) in the power module base (2) of the first embodiment. The stress relaxation member (92) is brazed to the insulating plate (5) and the cooler (7).

  The stress relaxation member (92) is preferably composed of a plate made of pure aluminum having high thermal conductivity and high deformability, for example, pure aluminum having a purity of 99.99% by mass or more. Although not shown, the stress relaxation member (92) preferably has a plurality of through holes extending in the vertical direction.

  Other configurations are the same as those of the power module base (2) of the first embodiment.

  The power module base (91) shown in FIG. 17 is manufactured by preparing a stress relaxation member (92) and placing the stress relaxation member (92), the insulating plate (5), and the aluminum plate (on the cooler (7)). 10) are arranged in this order, except that a brazing material layer is provided between the cooler (7) and the stress relaxation member (92) and between the stress relaxation member (92) and the insulating plate (5). These are the same as the manufacturing method of the base (2) for power modules of Embodiment 1. FIG. The brazing filler metal layer disposed between the cooler (7) and the stress relaxation member (92) and between the stress relaxation member (92) and the insulating plate (5) is provided on both surfaces of the brazing filler metal foil and the core material. It consists of an aluminum brazing sheet on which a brazing filler metal layer is formed. The brazing filler metal layer disposed between the cooler (7) and the stress relaxation member (92) and between the stress relaxation member (92) and the insulating plate (5) It may be clad in advance on both sides.

Embodiment 3
This embodiment is shown in FIG.

  FIG. 18 shows a power module in which a power device is mounted on an electronic element mounting surface of a conductive layer in a power module base including the insulated circuit board according to the third embodiment.

  In FIG. 18, the power module (95) includes a power module base (96) and a power device (3) (electronic element) mounted on the power module base (96).

  The power module base (96) is formed by placing a nickel plate (97) on the upper surface of the aluminum plate (10) in the power module base (91) of Embodiment 2 and brazing the aluminum plate (10). The insulating layer (6) of the insulating circuit board (4) is configured. The upper surface of the nickel plate (97) is an electronic element mounting surface (8), and the power device (3) is soldered and mounted thereon. Other configurations are the same as those of the power module base (91) of the second embodiment.

  The power module base (96) shown in FIG. 18 is manufactured by preparing a nickel plate (97), disposing the nickel plate (97) on the aluminum plate (10), and forming the aluminum plate (10) and the nickel plate ( 97) except that a brazing material layer is provided between the power module base 91 and the power module base 91 according to the second embodiment. The brazing material layer disposed between the aluminum plate (10) and the nickel plate (97) is composed of a brazing material foil, an aluminum brazing sheet having brazing material layers formed on both sides of the core material, and the like. Further, the brazing material layer disposed between the aluminum plate (10) and the nickel plate (97) may be clad in advance on the upper surface of the aluminum plate (10).

  In the conductive layers (25) (40) (70) (75) using the nickel plates (26) (41) (71) (97) described above, the nickel plates (26) (41) (71) (97) Instead, a copper plate, a silver plate, or a gold plate may be used.

  Hereinafter, specific examples of the power module base according to the present invention will be described together with comparative examples.

Example 1
This example is the power module base (91) of the second embodiment.

  As the insulating plate (5), an insulating plate made of AlN containing a sintering aid, having a length of 35 mm, a width of 30 mm, and a thickness of 0.63 mm was prepared. As the aluminum plate (10) for forming the conductive layer (6), a plate made of pure aluminum having a purity of 99.99 wt% and having a length of 33 mm, a width of 28 mm, and a thickness of 1.0 mm was prepared. By forming a notch with a width of 0.7 mm and a depth of 0.5 mm from the upper surface to the side surface of the aluminum plate (10), the brazing material reservoir is continuous on the side surface of the aluminum plate (10) over its entire circumference. A recess (13) to be (11) was formed. As the stress relaxation member (92), a member made of pure aluminum having a purity of 99.99 wt% and made of an aluminum plate having a length of 34 mm, a width of 29 mm, and a thickness of 1.6 mm was prepared. Further, instead of the cooler (7), an aluminum plate made of JIS A3003 and having a length of 60 m, a width of 50 mm, and a thickness of 5.0 mm was prepared. Furthermore, a brazing material foil made of an Al-10 wt% Si alloy and having a thickness of 25 μm was prepared.

  Then, the stress relaxation member (92), the insulating plate (5), and the aluminum plate (10) are placed on the aluminum plate serving as a substitute for the cooler (7), and the concave portion (13) of the aluminum plate (10) is on the upper side. I put them in this order to come. At this time, between the aluminum plate serving as a substitute for the cooler (7) and the stress relaxation member (92), between the stress relaxation member (92) and the insulating plate (5), and between the insulating plate (5) and the aluminum plate Between (10), brazing material foils each made of an Al-10 wt% Si alloy and having a thickness of 25 μm were arranged.

Next, an aluminum plate, a stress relaxation member (92), an insulating plate (5), and an aluminum plate (10) serving as a substitute for the cooler (7) are pressed with a surface pressure of 8 g / mm ^{2 in} the stacking direction The aluminum plate and the stress relaxation member (92), the stress relaxation member (92), the insulating plate (5), and the insulating plate (5), which are placed in a vacuum atmosphere at 600 ° C. for 15 minutes, to replace the cooler (7) And an aluminum plate (10) were brazed to produce a power module base (91).

  When the manufactured power module base (91) was observed, the solidified brazing material was collected in the recess (13) of the aluminum plate (10), and the solidified brazing material was found on the upper surface of the aluminum plate (10). There wasn't.

  In addition, in order to evaluate the reliability of the thermal cycle, when the thermal cycle test of 3000 cycles was performed with heating at 125 ° C. → cooling at −40 ° C. as one cycle, cracks occurred in the insulating plate (5). There wasn't.

Example 2
This example is the power module base (96) of the third embodiment.

  In addition to the same insulating plate (5), aluminum plate (10), stress relieving member (92) and cooler (7) as in Example 1, it is made of pure nickel with a purity of 99 wt%, A nickel plate (97) having a thickness of 33 mm, a width of 28 mm, and a thickness of 0.2 mm was prepared. Further, two types of brazing foils made of an Al-10 wt% Si alloy and having a thickness of 25 μm and 10 μm were prepared.

  Then, on the aluminum plate instead of the cooler (7), the stress relaxation member (92), the insulating plate (5), the aluminum plate (10) and the nickel plate (97) It was placed in this order so that 13) was on the upper side. At this time, between the aluminum plate serving as a substitute for the cooler (7) and the stress relaxation member (92), between the stress relaxation member (92) and the insulating plate (5), and between the insulating plate (5) and the aluminum plate A brazing material foil having a thickness of 25 μm is arranged between the aluminum plate forming (10) and a brazing material foil having a thickness of 10 μm between the aluminum plate forming the aluminum plate (10) and the nickel plate. Had been placed.

Next, an aluminum plate, stress relieving member (92), insulating plate (5), aluminum plate (10), and nickel plate (97) as a substitute for the cooler (7) are applied with a surface pressure of 8 g / mm ^{2 in} the laminating direction. An aluminum plate and a stress relaxation member (92), a stress relaxation member (92) and an insulating plate (5) serving as a substitute for the cooler (7) are placed in a vacuum atmosphere at 600 ° C. for 15 minutes while being loaded and pressurized. A base for a power module (96) was manufactured by brazing the insulating plate (5) and the aluminum plate (10), and the aluminum plate (10) and the nickel plate, respectively.

  When the manufactured power module base (96) was observed, the solidified brazing material was collected in the recess (13) of the aluminum plate (10), and the solidified brazing material was found on the upper surface of the nickel plate (97). There wasn't.

  In addition, in order to evaluate the reliability of the thermal cycle, when the thermal cycle test of 3000 cycles was performed with heating at 125 ° C. → cooling at −40 ° C. as one cycle, cracks occurred in the insulating plate (5). There wasn't.

Comparative Example 1
As shown in FIG. 19, by forming a notch (100) having a width of 0.7 mm and a depth of 0.5 mm from the lower surface to the side surface of the aluminum plate (10), the side surface of the aluminum plate (10) An aluminum plate, a stress relaxation member (92), and a stress relaxation member (92) serving as a substitute for the cooler (7) under the same conditions as in Example 1 except that the concave portion (101) continuous over the entire circumference was formed. 92) and the insulating plate (5), and the insulating plate (5) and the aluminum plate (10) were brazed to produce a power module base (91).

  When the manufactured power module base (91) was observed, the solidified brazing material was collected in the recess (101) of the aluminum plate (10), and the solidified brazing material was found on the upper surface of the aluminum plate (10). There wasn't. However, the brazing material solidified in the recess (101) and the insulating plate (5) were in direct contact.

  In addition, in order to evaluate the reliability of the heat cycle, a heat cycle test of 1000 cycles was performed with heating to 125 ° C. → cooling to −40 ° C. as one cycle. Cracks were generated starting from the contact portion.

(1) (90) (95): Power module
(2) (91) (96): Base for power module
(3): Power devices (electronic elements that serve as heating elements)
(4): Insulated circuit board
(5): Insulating plate (insulating layer)
(6) (20) (25) (30) (35) (40) (45) (50) (55) (60) (65) (70) (75) (80) (85): Conductive layer
(7): Cooler
(8): Electronic device mounting surface
(9): Contour surface
(10) (21) (22) (36) (37) (38) (61) (62) (66) (67) (76) (77): Aluminum plate
(11): Brazing material reservoir
(12): Contact suppression part
(13) (31): Recess
(14): Stepped surface
(14a) (14b): Step
(26) (41) (71) (97): Nickel plate
(46): Brazing material reservoir recess
(51): Groove
(56): Groove
(63) (68): Notch
(92): Stress relaxation member

Claims (26)

An insulating circuit board in which a metal conductive layer is brazed to one surface of a ceramic insulating layer, and a surface opposite to the surface brazed to the insulating layer in the conductive layer is an electronic element mounting surface,
An insulating circuit board in which a brazing material reservoir is formed on a contour surface that forms a contour of a conductive layer and has a width in the thickness direction of the conductive layer, and stores the brazing material in a non-contact state with respect to the insulating layer. Provided on the contour surface of the conductive layer is a contact suppressing portion having a predetermined width from the end portion on the insulating layer side toward the electronic element mounting surface and suppressing contact between the brazing material in the brazing material reservoir and the insulating layer. The recessed part dented with respect to the contact suppression part is formed in the part by the side of an electronic element rather than the contact suppression part in the said contour surface, The said recessed part is a brazing material storage part. Insulated circuit board. The insulated circuit board according to claim 2, wherein an end portion on the electronic element mounting surface side of a concave portion serving as a brazing material reservoir in the contour surface of the conductive layer is open to the electronic element mounting surface. The insulated circuit board according to claim 3, wherein a concave portion serving as a brazing material reservoir in the contour surface of the conductive layer is formed continuously over the entire circumference of the contour surface. The contour surface of the conductive layer is a stepped surface that gradually decreases from the insulating layer side toward the electronic element mounting surface side through the stepped portion, and the portion of the stepped surface closest to the insulating layer is the contact suppressing portion. The insulated circuit board according to claim 4, wherein a recessed portion serving as a brazing material storage portion is provided in a portion closer to the electronic element mounting surface than the contact suppressing portion in the stepped surface. 6. The conductive layer is composed of a plurality of metal plates stacked and bonded to each other, the sizes of all the metal plates are different, and the sizes of all the metal plates are sequentially reduced from the insulating layer side. The insulated circuit board as described. The insulated circuit board according to claim 5 or 6, wherein a concave portion opened to the electronic element mounting surface side is formed in at least one of the step portions having the stepped surface as the contour surface of the conductive layer. The insulated circuit board according to claim 7, wherein the concave portion of the step portion is formed by a groove extending over the entire circumference of the step portion. The insulated circuit board according to claim 2, wherein the concave portion serving as a brazing filler material storage portion on the contour surface of the conductive layer is a groove formed continuously over the entire circumference of the contour surface. The conductive layer is composed of a plurality of metal plates laminated and bonded to each other, and the size of the metal plate located in the middle portion in the thickness direction of the conductive layer is smaller than the other metal plates, The insulated circuit board according to claim 9, wherein a continuous groove is formed on the contour surface over the entire circumference. The conductive layer is composed of a plurality of metal plates laminated and bonded to each other, and at least one metal plate is formed with a notch extending over the side and the side facing the metal plate adjacent to the metal plate. The insulated circuit board according to claim 9, wherein a continuous groove is formed on the contour surface over the entire circumference. The insulating layer is made of one material selected from the group consisting of AlN, Al ₂ O ₃ , SiC, Si ₃ N ₄ and BeO, and the metal on the most insulating layer side among a plurality of metal plates constituting the conductive layer The plate is made of aluminum and brazed to the insulating layer with an Al-Si alloy brazing material, and the metal plate on the most electronic element mounting surface side among the plurality of metal plates constituting the conductive layer is nickel, copper, silver 12. The insulated circuit board according to claim 6, 10 or 11, which is made of one material selected from the group consisting of gold and gold. The insulated circuit board according to any one of claims 1 to 12, wherein a brazing material reservoir recess is formed at a peripheral portion of the electronic element mounting surface of the conductive layer. The insulation according to claim 2, wherein the contour surface of the conductive layer is provided with a mixture of a recess formed by a notch extending over the contour surface and the electronic element mounting surface and a recess formed by a groove extending in the circumferential direction of the contour surface. Circuit board. The insulating circuit according to claim 14, wherein the conductive layer is a square, a recess made of a notch is provided in two opposite sides of the conductive layer, and a recess made of a groove is provided in the remaining two sides. substrate. The base for power modules in which the surface on the opposite side to the surface where the electrically conductive layer was brazed in the insulating layer of the insulated circuit board described in any one of Claims 1-15 is brazed to the cooler. The base for a power module according to claim 16, wherein a stress relaxation member is interposed between the insulating layer of the insulated circuit board and the cooler, and the stress relaxation member is brazed to the insulating layer and the cooler. 18. A power module in which a power device is soldered to an electronic element mounting surface of a conductive layer in an insulated circuit board of a power module base according to claim 16 or 17. A method for producing an insulated circuit board according to claim 6, comprising:
Prepare an insulating layer made of a ceramic plate and a plurality of conductive layer forming metal plates of different sizes, and put all the metal plates on the insulating layer in order from the largest metal plate. The periphery of the upper metal plate is positioned inside the periphery of the lower metal plate, and a brazing material is disposed between the insulating layer and the lower end metal plate and between adjacent metal plates. Heating is performed to braze the insulating layer, the largest metal plate, and adjacent metal plates, and on the insulating layer, the contour surface gradually decreases from the insulating layer side to the smallest metal plate side through the step portion. Forming a conductive layer having a stepped surface; a portion of the stepped surface closest to the insulating layer as a contact suppressing unit having a predetermined width in the thickness direction of the conductive layer; and a contact suppressing unit on the stepped surface The top of the metal plate side is at the top A method for manufacturing an insulating circuit board, comprising: forming a brazing material reservoir portion that includes a concave portion continuously extending over the entire circumference of the contour surface of the conductive layer and that stores the brazing material in a non-contact state with respect to the insulating layer. . A method for producing an insulated circuit board according to claim 10, comprising:
Preparing an insulating layer made of a ceramic plate and a plurality of metal plates for forming a conductive layer, each having a size smaller than the other, all the metal plates on the insulating layer, Place it in a stack so that the smallest metal plate is located in the middle, place brazing material between the insulating layer and the bottom metal plate and between adjacent metal plates, heat the insulating layer and all metal plates The insulating layer and the adjacent metal plate and the adjacent metal plates are brazed to form a conductive layer on the insulating layer in which a groove is continuously formed on the entire circumference, The portion closer to the insulating layer than the groove on the contour surface of the layer is a contact suppressing portion having a predetermined width in the thickness direction of the conductive layer, and the portion on the opposite side of the insulating layer from the contact suppressing portion on the contour surface, Consisting of the groove and the brazing material in a non-contact state with respect to the insulating layer Insulating circuit substrate manufacturing method characterized by forming a brazing material reservoir for storing at. A method for producing an insulated circuit board according to claim 11, comprising:
Preparing an insulating layer made of a ceramic plate and a plurality of metal plates for forming a conductive layer, and forming at least one metal plate with a notch extending over one side and side surfaces over the entire circumference, the insulating layer On top of all the metal plates are placed so that the other metal plate exists on one side of the metal plate having the notches where the notches open, and between the insulating layer and the lower end metal plate and adjacent metal. Place the brazing material between the plates, heat the insulating layer and all metal plates, braze the insulating layer to the adjacent metal plate, and the adjacent metal plates, and over the insulating layer all over the contour surface Forming a conductive layer in which a groove extending continuously is formed; a portion closer to the insulating layer than the groove in the contour surface of the conductive layer is a contact suppressing portion having a predetermined width in the thickness direction of the conductive layer; From the contact suppression part on the contour surface On the opposite side of the portion to the insulating layer, the insulating circuit substrate manufacturing method characterized by forming a brazing material reservoir for storing the Katsuro material made from the groove in a non-contact state with respect to the insulating layer. A power module base comprising: the insulated circuit board according to claim 6; and a cooler in which a surface opposite to a surface to which the conductive layer of the insulating circuit board is brazed is brazed. A way to
Preparing a cooler, an insulating layer made of a ceramic plate, and a plurality of metal plates for forming conductive layers of different sizes, arranging an insulating layer on the cooler, and connecting the cooler and the insulating layer Place the brazing material in between, place all the metal plates on the insulating layer in order from the largest metal plate in a stacked manner, and position the periphery of the upper metal plate inside the periphery of the lower metal plate Placing a brazing material between the insulating layer and the lower metal plate and between adjacent metal plates, heating the cooler, the insulating layer and all the metal plates, the cooler and the insulating layer, the insulating layer and the largest metal plate, Then, adjacent metal plates are brazed to form a conductive layer having a stepped surface whose contour surface gradually decreases from the insulating layer side toward the smallest metal plate side through the step portion on the insulating layer. A portion of the stepped surface closest to the insulating layer is a conductive layer A contact suppressing portion having a predetermined width in the thickness direction, and a continuous concave portion extending over the entire circumference of the contour surface of the conductive layer, with the upper end opening upward at a portion closer to the metal plate than the contact suppressing portion on the stepped surface And forming a brazing material storage part for storing the brazing material in a non-contact state with respect to the insulating layer. A power module base comprising: the insulated circuit board according to claim 10; and a cooler in which a surface opposite to a surface of the insulating layer of the insulated circuit substrate to which the conductive layer is brazed is brazed. A way to
Prepare a cooler, an insulating layer made of a ceramic plate, and a plurality of metal plates for forming a conductive layer, each having a size smaller than the other, and an insulating layer on the cooler In addition to placing the brazing material between the cooler and the insulating layer, place all the metal plates on the insulating layer in a stacked manner so that the smallest metal plate is located in the middle, and insulate Placing a brazing material between the layers and the metal plates and between adjacent metal plates, heating the cooler, insulating layer and all metal plates to cool the cooler and insulating layer, insulating layer and adjacent metal plate, Adjacent metal plates are brazed to form a conductive layer on the insulating layer in which a groove is continuously formed on the entire contour surface, closer to the insulating layer than the groove on the contour surface of the conductive layer. Is a contact suppressing portion having a predetermined width in the thickness direction of the conductive layer. A power characterized by forming a brazing material storage portion that is formed of the groove and stores the brazing material in a non-contact state with respect to the insulating layer in a portion of the contour surface opposite to the insulating layer from the contact suppressing portion. Manufacturing method of module base. A power module base comprising: the insulated circuit board according to claim 11; and a cooler having a brazed surface opposite to the surface of the insulating layer of the insulated circuit board to which the conductive layer is brazed. A way to
A cooler, an insulating layer made of a ceramic plate, and a plurality of metal plates for forming a conductive layer are prepared, and at least one metal plate is formed with a notch extending over one side and side surfaces thereof over the entire circumference. In addition to disposing an insulating layer on the cooler, disposing a brazing material between the cooler and the insulating layer, all the metal plates on the insulating layer are notched in the metal plate having notches. Place the metal plate so that there is another metal plate on one side of the opening, and place a brazing material between the insulating layer and the lower metal plate and between adjacent metal plates, cooler, insulating layer and all metal plates Is heated to cool the cooler and the insulating layer, the insulating layer and the adjacent metal plate, and the adjacent metal plates are brazed to each other. Forming a conductive layer on the contour surface of the conductive layer. The portion closer to the insulating layer than the groove is a contact suppressing portion having a predetermined width in the thickness direction of the conductive layer, and the groove is formed on the opposite side of the contour surface to the insulating layer from the contact suppressing portion. A method for manufacturing a base for a power module, characterized in that a brazing filler material storage portion is formed in which the brazing filler metal is stored in a non-contact state with respect to the insulating layer. The insulating layer is made of one material selected from the group consisting of AlN, Al ₂ O ₃ , SiC, Si ₃ N ₄ and BeO, and the metal plate closest to the insulating layer among the plurality of metal plates constituting the conductive layer Made of aluminum, and the metal plate farthest from the insulating layer among the plurality of metal plates constituting the conductive layer is made of one material selected from the group consisting of nickel, copper, silver and gold, and brazing material The manufacturing method of the base for power modules in any one of Claims 22-24 which consists of an Al-Si alloy type brazing material. A stress relieving member is disposed between the cooler and the insulating layer, and a brazing material is disposed between the cooler and the insulating layer and the stress relieving member. The cooler, the stress relieving member, the insulating layer, and all the metal The plate is heated while being pressed to braze the cooler and the stress relaxation member, the stress relaxation member and the insulating layer, the insulating layer and the adjacent metal plate, and the adjacent metal plates. The manufacturing method of the base for power modules in any one.

Images