SE9002663L - MULTILAYER CONVERSOR WITH CONNECTED CONTACTS AND SET FOR AUTHORIZING THE CONTACTS - Google Patents
MULTILAYER CONVERSOR WITH CONNECTED CONTACTS AND SET FOR AUTHORIZING THE CONTACTSInfo
- Publication number
- SE9002663L SE9002663L SE9002663A SE9002663A SE9002663L SE 9002663 L SE9002663 L SE 9002663L SE 9002663 A SE9002663 A SE 9002663A SE 9002663 A SE9002663 A SE 9002663A SE 9002663 L SE9002663 L SE 9002663L
- Authority
- SE
- Sweden
- Prior art keywords
- contacts
- transducer
- multilayer
- conversor
- authorizing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Pressure Sensors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Measuring Fluid Pressure (AREA)
- Electrodes Of Semiconductors (AREA)
- Light Receiving Elements (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Electroplating Methods And Accessories (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
In a novel multilayer transducer (1') with bonded contacts and a method for fabricating the bonded contact areas (5') of the transducer, the contact areas (5') are formed on the side surface (7) of the transducer by metal deposition using laser-based deposition, sputter deposition or another suitable metallization method. By virtue of the fabrication method of the contact areas, the size of the transducer (1')can be reduced and the transducer (1') can be bonded to a circuit board using surface-mount technology.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI893874A FI893874A (en) | 1989-08-17 | 1989-08-17 | KONTAKTFOERSEDD GIVARE MED SKIKTSTRUKTUR SAMT FOERFARANDE FOER UTFOERANDE AV KONTAKTERINGEN. |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9002663D0 SE9002663D0 (en) | 1990-08-15 |
SE9002663L true SE9002663L (en) | 1991-02-18 |
SE508914C2 SE508914C2 (en) | 1998-11-16 |
Family
ID=8528855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9002663A SE508914C2 (en) | 1989-08-17 | 1990-08-15 | Microdrive |
Country Status (11)
Country | Link |
---|---|
US (1) | US5083234A (en) |
JP (1) | JP2866167B2 (en) |
CH (1) | CH681581A5 (en) |
DE (1) | DE4023776C2 (en) |
ES (1) | ES2023345A6 (en) |
FI (1) | FI893874A (en) |
FR (1) | FR2651069B1 (en) |
GB (1) | GB2235090B (en) |
IT (1) | IT1241544B (en) |
NO (1) | NO307488B1 (en) |
SE (1) | SE508914C2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR930011143A (en) * | 1991-11-14 | 1993-06-23 | 김광호 | Semiconductor device and manufacturing method |
CA2115947A1 (en) * | 1993-03-03 | 1994-09-04 | Gregory C. Smith | Wafer-like processing after sawing dmds |
DE4321804A1 (en) * | 1993-06-30 | 1995-01-12 | Ranco Inc | Process for the production of small components |
US5912796A (en) * | 1996-11-15 | 1999-06-15 | Illinois Tool Works, Inc. | Metallized film capacitor and manufacturing process |
DE10309869A1 (en) * | 2003-03-06 | 2004-09-23 | Infineon Technologies Ag | Semiconductor chip production process, fills contact holes with conductive material to connect circuits to conductor rail and then divides into chips |
DE10321214A1 (en) * | 2003-05-12 | 2004-12-30 | Infineon Technologies Ag | Process for forming electrical contacts on a chip of a chip wafer for low cost radiofrequency identification chips brings contacts to the side faces of the chip |
DE10326804A1 (en) * | 2003-06-13 | 2004-11-18 | Infineon Technologies Ag | Method for forming semiconductor chip(s) provides one or more independent semiconductor circuits on semiconductor wafer, with at least one conductive track, extending up to rim of semiconductor circuit |
DE10334633A1 (en) * | 2003-07-29 | 2004-10-07 | Infineon Technologies Ag | Manufacturing arrangement with two semiconducting chips, involves joining extended contact area on first chip to contact area on second chip by conducting thermal flow process |
DE10334634B3 (en) * | 2003-07-29 | 2005-01-13 | Infineon Technologies Ag | Lateral contacting method for semiconductor chip, by applying adhesive layer, pressing on particle of thermally fusible material, applying semiconductor chip and heating |
TWI559349B (en) * | 2014-10-28 | 2016-11-21 | 鈺邦科技股份有限公司 | Method for manufacturing solid electrolytic capacitor package structure with improved conductive terminals |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL128146C (en) * | 1963-03-05 | |||
GB1115259A (en) * | 1966-05-20 | 1968-05-29 | Gen Dynamics Corp | Load measuring system |
GB1342468A (en) * | 1969-10-16 | 1974-01-03 | Chubb Alarms Mfg Ltd | Security detection systems |
GB1533191A (en) * | 1977-03-30 | 1978-11-22 | G Ni I P I Redkometallich Prom | Pressure-sensitive semiconductor bodies and pressure-sensitive devices including such bodies |
US4267634A (en) * | 1978-04-05 | 1981-05-19 | American Components Inc. | Method for making a chip circuit component |
US4386453A (en) * | 1979-09-04 | 1983-06-07 | Ford Motor Company | Method for manufacturing variable capacitance pressure transducers |
JPS58159360A (en) * | 1982-03-17 | 1983-09-21 | Fujitsu Ltd | Semiconductor device |
EP0094078B1 (en) * | 1982-05-11 | 1988-11-02 | Nec Corporation | Multilayer electrostrictive element which withstands repeated application of pulses |
FI842307A (en) * | 1984-06-07 | 1985-12-08 | Vaisala Oy | FOERFARANDE FOER AOSTADKOMMANDE AV GENOMFOERING I EN MIKROMEKANISK KONSTRUKTION. |
JPS6127688A (en) * | 1984-07-02 | 1986-02-07 | Nec Corp | Electrostrictive effect element and production thereof |
IL82960A0 (en) * | 1986-06-30 | 1987-12-20 | Rosemount Inc | Differential pressure sensor |
JPS63149531A (en) * | 1986-12-12 | 1988-06-22 | Fuji Electric Co Ltd | Electrostatic capacity type pressure sensor |
JPH061228B2 (en) * | 1987-08-13 | 1994-01-05 | 富士電機株式会社 | Capacitive pressure detector |
DE3727142C2 (en) * | 1987-08-14 | 1994-02-24 | Kernforschungsz Karlsruhe | Process for the production of microsensors with integrated signal processing |
FI78784C (en) * | 1988-01-18 | 1989-09-11 | Vaisala Oy | TRYCKGIVARKONSTRUKTION OCH FOERFARANDE FOER FRAMSTAELLNING DAERAV. |
-
1989
- 1989-08-17 FI FI893874A patent/FI893874A/en not_active Application Discontinuation
-
1990
- 1990-07-18 US US07/553,597 patent/US5083234A/en not_active Expired - Lifetime
- 1990-07-26 DE DE4023776A patent/DE4023776C2/en not_active Expired - Lifetime
- 1990-08-02 ES ES9002096A patent/ES2023345A6/en not_active Expired - Fee Related
- 1990-08-03 GB GB9017035A patent/GB2235090B/en not_active Expired - Fee Related
- 1990-08-09 CH CH2599/90A patent/CH681581A5/de not_active IP Right Cessation
- 1990-08-14 IT IT48226A patent/IT1241544B/en active IP Right Grant
- 1990-08-14 FR FR9010329A patent/FR2651069B1/en not_active Expired - Fee Related
- 1990-08-15 SE SE9002663A patent/SE508914C2/en unknown
- 1990-08-16 NO NO903622A patent/NO307488B1/en not_active IP Right Cessation
- 1990-08-17 JP JP2217992A patent/JP2866167B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
SE9002663D0 (en) | 1990-08-15 |
IT1241544B (en) | 1994-01-17 |
NO903622D0 (en) | 1990-08-16 |
JP2866167B2 (en) | 1999-03-08 |
IT9048226A0 (en) | 1990-08-14 |
FI893874A0 (en) | 1989-08-17 |
SE508914C2 (en) | 1998-11-16 |
ES2023345A6 (en) | 1992-01-01 |
DE4023776A1 (en) | 1991-02-21 |
FR2651069A1 (en) | 1991-02-22 |
NO307488B1 (en) | 2000-04-10 |
DE4023776C2 (en) | 2003-07-03 |
FI893874A (en) | 1991-02-18 |
GB2235090B (en) | 1993-11-17 |
JPH03104167A (en) | 1991-05-01 |
IT9048226A1 (en) | 1992-02-14 |
NO903622L (en) | 1991-02-18 |
CH681581A5 (en) | 1993-04-15 |
GB2235090A (en) | 1991-02-20 |
FR2651069B1 (en) | 1998-04-03 |
GB9017035D0 (en) | 1990-09-19 |
US5083234A (en) | 1992-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0480038A4 (en) | Ceramic circuit board | |
EP0459773A3 (en) | Semiconductor device and method for producing the same | |
FR2567684B1 (en) | MODULE HAVING A MULTILAYER CERAMIC SUBSTRATE AND A MULTILAYER CIRCUIT ON THE SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF | |
DE69413843D1 (en) | SURFACE WAVE RESONATORS WITH TWO FASHIONS | |
SE9002663D0 (en) | MULTILAYER CONVERSOR WITH CONNECTED CONTACTS AND SET FOR AUTHORIZING THE CONTACTS | |
EP0362161A3 (en) | Method of manufacturing a substrate for microwave integrated circuits | |
EP0272046A3 (en) | Circuit arrangement including a composite ceramic substrate | |
FR2604298B1 (en) | PROCESS FOR MAKING AN ELECTRICAL CONTACT TAKING ON A SUBSTRATE IN P-CONDUCTIVITY HGCDTE AND APPLICATION TO THE MANUFACTURE OF A N / P DIODE | |
DE59505908D1 (en) | Stripline filter | |
SE8502709D0 (en) | CAPACITIVE PRESSURE DETECTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | |
EP0204004A4 (en) | Wiring structure of a terminal circuit. | |
EP0153191A3 (en) | Zirconia-metal composite bodies | |
EP0303521A3 (en) | Superconducting device and methods of manufacturing the same | |
EP0350876A3 (en) | Process for the production of dielectric layers in planar circuits on ceramic substrates | |
EP0450466A3 (en) | Multilayered alarm glass plate | |
EP0203203A4 (en) | Multi-layer substrate for printed circuit. | |
KR890016890A (en) | How to join components using low melting glass | |
JPS5796561A (en) | Lead for connection of semiconductor device | |
JPS5391684A (en) | Semiconductor laser | |
JPS6468915A (en) | Chip component | |
JPS6454740A (en) | Integrated circuit and manufacture thereof | |
KR940010174A (en) | Manufacturing method of laminate | |
SU815979A1 (en) | Printed circuit board manufacturing method | |
JPS5545501A (en) | Soldering tool | |
JPS6433989A (en) | Ceramic circuit board |