JPS6433989A - Ceramic circuit board - Google Patents

Ceramic circuit board

Info

Publication number
JPS6433989A
JPS6433989A JP18995387A JP18995387A JPS6433989A JP S6433989 A JPS6433989 A JP S6433989A JP 18995387 A JP18995387 A JP 18995387A JP 18995387 A JP18995387 A JP 18995387A JP S6433989 A JPS6433989 A JP S6433989A
Authority
JP
Japan
Prior art keywords
substrate
copper plate
circuit board
corner part
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18995387A
Other languages
Japanese (ja)
Other versions
JPH0634431B2 (en
Inventor
Nobuyuki Mizunoya
Yutaka Komorida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62189953A priority Critical patent/JPH0634431B2/en
Publication of JPS6433989A publication Critical patent/JPS6433989A/en
Publication of JPH0634431B2 publication Critical patent/JPH0634431B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Abstract

PURPOSE:To enable the smooth carriage in each process, and reduce the failure generation percentage, by beveling each corner part of a ceramic substrate. CONSTITUTION:On a ceramic substrate 1, a copper plate 2 with a specified shape is arranged so as to be in contact with each other, and joined under heating to form a ceramic circuit board. Each corner part 1a of the ceramic substrate 1 is previously beveled. As for the dimension of beveling, the range of 0.1-1.0mm is preferable. For example, each corner part 1a, 1a,... of the ceramics substrate 1 whose main component is alumina is subjected to C surface working of 0.5C, and thereon a copper plate 2 with a specified shape is arranged so as to be in contact with the substrate. Each of the corner parts 2a, 2a,... of the copper plate 2 corresponding with each of the corner parts 1a, 1a,... of the ceramics substrate 1 is likewise subjected to C surface working of 0.3C. These are joined by heating in an nitrogen atmosphere at a temperature of 1070 deg.C for ten minutes.
JP62189953A 1987-07-29 1987-07-29 Ceramics circuit board Expired - Lifetime JPH0634431B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62189953A JPH0634431B2 (en) 1987-07-29 1987-07-29 Ceramics circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62189953A JPH0634431B2 (en) 1987-07-29 1987-07-29 Ceramics circuit board

Publications (2)

Publication Number Publication Date
JPS6433989A true JPS6433989A (en) 1989-02-03
JPH0634431B2 JPH0634431B2 (en) 1994-05-02

Family

ID=16249959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62189953A Expired - Lifetime JPH0634431B2 (en) 1987-07-29 1987-07-29 Ceramics circuit board

Country Status (1)

Country Link
JP (1) JPH0634431B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018110236A (en) * 2012-01-27 2018-07-12 ローム株式会社 Chip component
US10210971B2 (en) 2012-01-27 2019-02-19 Rohm Co., Ltd. Chip component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57181060U (en) * 1981-05-14 1982-11-17
JPS6066061U (en) * 1983-10-12 1985-05-10 日本電気株式会社 ceramic substrate
JPS62147526A (en) * 1985-12-23 1987-07-01 Nec Corp Multiplier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57181060U (en) * 1981-05-14 1982-11-17
JPS6066061U (en) * 1983-10-12 1985-05-10 日本電気株式会社 ceramic substrate
JPS62147526A (en) * 1985-12-23 1987-07-01 Nec Corp Multiplier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018110236A (en) * 2012-01-27 2018-07-12 ローム株式会社 Chip component
US10210971B2 (en) 2012-01-27 2019-02-19 Rohm Co., Ltd. Chip component
US10763016B2 (en) 2012-01-27 2020-09-01 Rohm Co., Ltd. Method of manufacturing a chip component

Also Published As

Publication number Publication date
JPH0634431B2 (en) 1994-05-02

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