JPS539477A - Production of semiconductor wafer laminated body - Google Patents

Production of semiconductor wafer laminated body

Info

Publication number
JPS539477A
JPS539477A JP8383976A JP8383976A JPS539477A JP S539477 A JPS539477 A JP S539477A JP 8383976 A JP8383976 A JP 8383976A JP 8383976 A JP8383976 A JP 8383976A JP S539477 A JPS539477 A JP S539477A
Authority
JP
Japan
Prior art keywords
production
semiconductor wafer
laminated body
wafer laminated
brazing materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8383976A
Other languages
Japanese (ja)
Inventor
Masatake Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8383976A priority Critical patent/JPS539477A/en
Publication of JPS539477A publication Critical patent/JPS539477A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To obtain a laminate body free from voids by rapidly performing heating and melting of brazing materials in a high frequency heating furnace under the mixed atmosphere of reductive and inert gases, thereafter curing the brazing materials by slow cooling in the same atmosphere.
COPYRIGHT: (C)1978,JPO&Japio
JP8383976A 1976-07-13 1976-07-13 Production of semiconductor wafer laminated body Pending JPS539477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8383976A JPS539477A (en) 1976-07-13 1976-07-13 Production of semiconductor wafer laminated body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8383976A JPS539477A (en) 1976-07-13 1976-07-13 Production of semiconductor wafer laminated body

Publications (1)

Publication Number Publication Date
JPS539477A true JPS539477A (en) 1978-01-27

Family

ID=13813862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8383976A Pending JPS539477A (en) 1976-07-13 1976-07-13 Production of semiconductor wafer laminated body

Country Status (1)

Country Link
JP (1) JPS539477A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03265116A (en) * 1990-03-15 1991-11-26 Fuji Electric Co Ltd Manufacture of laminate wafer and wafer bonding device used therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03265116A (en) * 1990-03-15 1991-11-26 Fuji Electric Co Ltd Manufacture of laminate wafer and wafer bonding device used therefor

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