JPS539477A - Production of semiconductor wafer laminated body - Google Patents
Production of semiconductor wafer laminated bodyInfo
- Publication number
- JPS539477A JPS539477A JP8383976A JP8383976A JPS539477A JP S539477 A JPS539477 A JP S539477A JP 8383976 A JP8383976 A JP 8383976A JP 8383976 A JP8383976 A JP 8383976A JP S539477 A JPS539477 A JP S539477A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor wafer
- laminated body
- wafer laminated
- brazing materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To obtain a laminate body free from voids by rapidly performing heating and melting of brazing materials in a high frequency heating furnace under the mixed atmosphere of reductive and inert gases, thereafter curing the brazing materials by slow cooling in the same atmosphere.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8383976A JPS539477A (en) | 1976-07-13 | 1976-07-13 | Production of semiconductor wafer laminated body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8383976A JPS539477A (en) | 1976-07-13 | 1976-07-13 | Production of semiconductor wafer laminated body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS539477A true JPS539477A (en) | 1978-01-27 |
Family
ID=13813862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8383976A Pending JPS539477A (en) | 1976-07-13 | 1976-07-13 | Production of semiconductor wafer laminated body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS539477A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03265116A (en) * | 1990-03-15 | 1991-11-26 | Fuji Electric Co Ltd | Manufacture of laminate wafer and wafer bonding device used therefor |
-
1976
- 1976-07-13 JP JP8383976A patent/JPS539477A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03265116A (en) * | 1990-03-15 | 1991-11-26 | Fuji Electric Co Ltd | Manufacture of laminate wafer and wafer bonding device used therefor |
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