JPS5211768A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5211768A
JPS5211768A JP8729375A JP8729375A JPS5211768A JP S5211768 A JPS5211768 A JP S5211768A JP 8729375 A JP8729375 A JP 8729375A JP 8729375 A JP8729375 A JP 8729375A JP S5211768 A JPS5211768 A JP S5211768A
Authority
JP
Japan
Prior art keywords
semiconductor device
copper
heat radiating
plate
iron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8729375A
Other languages
Japanese (ja)
Inventor
Kazutoyo Narita
Tadashi Sakagami
Yuji Shinno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8729375A priority Critical patent/JPS5211768A/en
Priority to US05/701,809 priority patent/US4057825A/en
Priority to DE2632154A priority patent/DE2632154C2/en
Publication of JPS5211768A publication Critical patent/JPS5211768A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To form a semiconductor device equipped a heat radiating plate with high mechanical strength and excellent heat radiating characteristic with the use of a composite plate of copper-iron-copper.
COPYRIGHT: (C)1977,JPO&Japio
JP8729375A 1975-07-18 1975-07-18 Semiconductor device Pending JPS5211768A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8729375A JPS5211768A (en) 1975-07-18 1975-07-18 Semiconductor device
US05/701,809 US4057825A (en) 1975-07-18 1976-07-01 Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered
DE2632154A DE2632154C2 (en) 1975-07-18 1976-07-16 Combined support and heat radiation plate for a soldered-on semiconductor component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8729375A JPS5211768A (en) 1975-07-18 1975-07-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5211768A true JPS5211768A (en) 1977-01-28

Family

ID=13910751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8729375A Pending JPS5211768A (en) 1975-07-18 1975-07-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5211768A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117247A (en) * 1979-03-05 1980-09-09 Hitachi Ltd Semiconductor device
JPS56106282U (en) * 1980-01-17 1981-08-18
JPS599387A (en) * 1982-07-05 1984-01-18 川崎重工業株式会社 Structure of pipe joint
JPS59161855A (en) * 1983-03-07 1984-09-12 Hitachi Ltd Semiconductor device
JPS61500924A (en) * 1984-01-09 1986-05-08 ヴアルレツク Protective device for joint support surfaces of metal tube threads and butts
US9206930B2 (en) 2007-02-21 2015-12-08 Vallourec Oil And Gas France Device for protecting a female end of a threaded tubular connection component, having an anti-unscrewing brake

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117247A (en) * 1979-03-05 1980-09-09 Hitachi Ltd Semiconductor device
JPS56106282U (en) * 1980-01-17 1981-08-18
JPS599387A (en) * 1982-07-05 1984-01-18 川崎重工業株式会社 Structure of pipe joint
JPS59161855A (en) * 1983-03-07 1984-09-12 Hitachi Ltd Semiconductor device
JPS61500924A (en) * 1984-01-09 1986-05-08 ヴアルレツク Protective device for joint support surfaces of metal tube threads and butts
JPH0233835B2 (en) * 1984-01-09 1990-07-31 Vallourec
US9206930B2 (en) 2007-02-21 2015-12-08 Vallourec Oil And Gas France Device for protecting a female end of a threaded tubular connection component, having an anti-unscrewing brake

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