JPS51121262A - Method of manufacturing semiconductor devices - Google Patents

Method of manufacturing semiconductor devices

Info

Publication number
JPS51121262A
JPS51121262A JP4581075A JP4581075A JPS51121262A JP S51121262 A JPS51121262 A JP S51121262A JP 4581075 A JP4581075 A JP 4581075A JP 4581075 A JP4581075 A JP 4581075A JP S51121262 A JPS51121262 A JP S51121262A
Authority
JP
Japan
Prior art keywords
semiconductor devices
manufacturing semiconductor
divided
wafer surface
electrode plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4581075A
Other languages
Japanese (ja)
Inventor
Shuzo Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP4581075A priority Critical patent/JPS51121262A/en
Publication of JPS51121262A publication Critical patent/JPS51121262A/en
Pending legal-status Critical Current

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  • Die Bonding (AREA)

Abstract

PURPOSE: To provide a method of manufacturing semiconductor devices in which the flat electrode plates to be pressure welded to warped wafers are divided into multiple pieces to easily enable uniform weld of the wafer surface.
COPYRIGHT: (C)1976,JPO&Japio
JP4581075A 1975-04-17 1975-04-17 Method of manufacturing semiconductor devices Pending JPS51121262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4581075A JPS51121262A (en) 1975-04-17 1975-04-17 Method of manufacturing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4581075A JPS51121262A (en) 1975-04-17 1975-04-17 Method of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
JPS51121262A true JPS51121262A (en) 1976-10-23

Family

ID=12729599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4581075A Pending JPS51121262A (en) 1975-04-17 1975-04-17 Method of manufacturing semiconductor devices

Country Status (1)

Country Link
JP (1) JPS51121262A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939235A (en) * 1985-09-26 1990-07-03 Foster-Miller, Inc. Biaxially oriented ordered polybenzothiazole film
US4963428A (en) * 1985-09-26 1990-10-16 Foster Miller, Inc. Biaxially oriented ordered polymer films
US6132668A (en) * 1985-09-26 2000-10-17 Foster-Miller, Inc. Biaxially oriented ordered polymer films

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939235A (en) * 1985-09-26 1990-07-03 Foster-Miller, Inc. Biaxially oriented ordered polybenzothiazole film
US4963428A (en) * 1985-09-26 1990-10-16 Foster Miller, Inc. Biaxially oriented ordered polymer films
US6132668A (en) * 1985-09-26 2000-10-17 Foster-Miller, Inc. Biaxially oriented ordered polymer films

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