JPS52116169A - Composite semiconductor device - Google Patents
Composite semiconductor deviceInfo
- Publication number
- JPS52116169A JPS52116169A JP3397076A JP3397076A JPS52116169A JP S52116169 A JPS52116169 A JP S52116169A JP 3397076 A JP3397076 A JP 3397076A JP 3397076 A JP3397076 A JP 3397076A JP S52116169 A JPS52116169 A JP S52116169A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- composite semiconductor
- semiconductor substrate
- substrate
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: The semiconductor substrate is soldered to both surfaces of support panel which has nearly same thermal expansion coefficient as the semiconductor substrate, and electrode is provided on the main surface of each substrate securing electrical connection between the electrodes. As a result, the temperature increase is prevented for the composite semiconductor device.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3397076A JPS52116169A (en) | 1976-03-26 | 1976-03-26 | Composite semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3397076A JPS52116169A (en) | 1976-03-26 | 1976-03-26 | Composite semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52116169A true JPS52116169A (en) | 1977-09-29 |
Family
ID=12401332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3397076A Pending JPS52116169A (en) | 1976-03-26 | 1976-03-26 | Composite semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52116169A (en) |
-
1976
- 1976-03-26 JP JP3397076A patent/JPS52116169A/en active Pending
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