JPS645799A - Method of cutting plastic substrate - Google Patents

Method of cutting plastic substrate

Info

Publication number
JPS645799A
JPS645799A JP15963187A JP15963187A JPS645799A JP S645799 A JPS645799 A JP S645799A JP 15963187 A JP15963187 A JP 15963187A JP 15963187 A JP15963187 A JP 15963187A JP S645799 A JPS645799 A JP S645799A
Authority
JP
Japan
Prior art keywords
board
cutting blades
cut
heat
plastic board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15963187A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Takasaki
Ryoichi Sudo
Haruhiko Matsuyama
Eiji Koyama
Hiroya Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Maxell Holdings Ltd
Original Assignee
Hitachi Ltd
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Maxell Ltd filed Critical Hitachi Ltd
Priority to JP15963187A priority Critical patent/JPS645799A/en
Publication of JPS645799A publication Critical patent/JPS645799A/en
Pending legal-status Critical Current

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

PURPOSE: To heat only the cut portion of a plastic board and to cut the plastic board with small machining force without deteriorating the characteristics of the board by heating cutting blades to the softening point of a work or above. CONSTITUTION: Heaters 13, 14 are excited to heat cutting blades 11, 12 to the prescribed temperature, and a die plate 7 is depressed to press the cutting blades 11, 12 to the upper face of a plastic board (raw board) 16. The tips of the cutting blades 11, 12 are thrust to the cut portion of the plastic board 16 to heat only this portion, and the board 16 is cut without deteriorating its characteristics.
JP15963187A 1987-06-29 1987-06-29 Method of cutting plastic substrate Pending JPS645799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15963187A JPS645799A (en) 1987-06-29 1987-06-29 Method of cutting plastic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15963187A JPS645799A (en) 1987-06-29 1987-06-29 Method of cutting plastic substrate

Publications (1)

Publication Number Publication Date
JPS645799A true JPS645799A (en) 1989-01-10

Family

ID=15697934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15963187A Pending JPS645799A (en) 1987-06-29 1987-06-29 Method of cutting plastic substrate

Country Status (1)

Country Link
JP (1) JPS645799A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04176600A (en) * 1990-11-13 1992-06-24 Denka Polymer Kk Cutting device of thermoplastic resin foam molding and molding manufacturing equipment using the same
JP2015120284A (en) * 2013-12-24 2015-07-02 セイコーエプソン株式会社 Printed matter processing method, printed matter processing device, and image formation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04176600A (en) * 1990-11-13 1992-06-24 Denka Polymer Kk Cutting device of thermoplastic resin foam molding and molding manufacturing equipment using the same
JP2015120284A (en) * 2013-12-24 2015-07-02 セイコーエプソン株式会社 Printed matter processing method, printed matter processing device, and image formation device

Similar Documents

Publication Publication Date Title
MY103667A (en) Discrete glass cutting and edge shaping
GB2180989B (en) Process for high temperature surface reactions in semiconductor material
ES545621A0 (en) PRODUCTION PROCEDURE FOR MULTIPLE-USE DECORATIVE PRODUCTS, FROM FRAGMENTS AND-OR PIECES OF WOOD
GB930708A (en) Improvements relating to facing tiles
AU545353B2 (en) Manufacturing corks for bottles
ES8701698A1 (en) Vacuum ring for producing laminated glass
JPS645799A (en) Method of cutting plastic substrate
ES8700652A1 (en) Method for producing glyoxylylspermidine and the use thereof for the production of 15-deoxy spergualin-related compounds
JPS57173126A (en) Working method for edge section of composite material
ES8504533A1 (en) Process for the manufacture of parquet flooring blocks.
JPS57156840A (en) Bending and cutting method for plate material
ES8304479A1 (en) Process for the manufacture of an outsole with a relief-type profile from a closed-cell foamed, crosslinked ethylene/vinyl acetate copolymer
SU844132A1 (en) Cutting tool
JPS5429172A (en) Method of reciprocatingly cutting materials
GB8801669D0 (en) Isomerisation process
PT80883B (en) METHOD FOR THE PREPARATION OF 1,3-DIHYDRO-4-PYRIDOYL-2H-IMIDAZOLE-2-ONES
JPS5389747A (en) Manufacture of heat printing element
Birzer Workpiece Design for Precision Cutting of Sheet Materials
TW266187B (en) Process of producing keyboard pad by integral formation
KR860000162A (en) Processing method of slice mosaic decorative plate using wood and slice mosaic decorative plate
JPS5739948A (en) Production of ornamental panel
Herbert Glass Ceramic Formulated for Diamond Machining
JPS53106781A (en) Production of solar heat collector
Simonok et al. The Technology and Equipment for Manufacture of Cutting Edges of Pointed Sweeps
Guillemet et al. Cutting of glass by a[laser] thermal process