JP7455751B2 - 接合基板、金属回路基板及び回路基板 - Google Patents

接合基板、金属回路基板及び回路基板 Download PDF

Info

Publication number
JP7455751B2
JP7455751B2 JP2020549435A JP2020549435A JP7455751B2 JP 7455751 B2 JP7455751 B2 JP 7455751B2 JP 2020549435 A JP2020549435 A JP 2020549435A JP 2020549435 A JP2020549435 A JP 2020549435A JP 7455751 B2 JP7455751 B2 JP 7455751B2
Authority
JP
Japan
Prior art keywords
metal plate
bonded substrate
length
formula
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020549435A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020067427A5 (https=
JPWO2020067427A1 (ja
Inventor
優太 津川
浩二 西村
良太 青野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=69949378&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP7455751(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2020067427A1 publication Critical patent/JPWO2020067427A1/ja
Publication of JPWO2020067427A5 publication Critical patent/JPWO2020067427A5/ja
Application granted granted Critical
Publication of JP7455751B2 publication Critical patent/JP7455751B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2020549435A 2018-09-27 2019-09-27 接合基板、金属回路基板及び回路基板 Active JP7455751B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018181383 2018-09-27
JP2018181383 2018-09-27
PCT/JP2019/038172 WO2020067427A1 (ja) 2018-09-27 2019-09-27 接合基板、金属回路基板及び回路基板

Publications (3)

Publication Number Publication Date
JPWO2020067427A1 JPWO2020067427A1 (ja) 2021-09-02
JPWO2020067427A5 JPWO2020067427A5 (https=) 2022-07-07
JP7455751B2 true JP7455751B2 (ja) 2024-03-26

Family

ID=69949378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020549435A Active JP7455751B2 (ja) 2018-09-27 2019-09-27 接合基板、金属回路基板及び回路基板

Country Status (6)

Country Link
US (1) US11497125B2 (https=)
EP (1) EP3860317B1 (https=)
JP (1) JP7455751B2 (https=)
KR (1) KR102564099B1 (https=)
CN (1) CN112772001A (https=)
WO (1) WO2020067427A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7739105B2 (ja) * 2021-09-21 2025-09-16 Ｄｏｗａメタルテック株式会社 金属－セラミックス接合基板およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094213A1 (ja) 2011-12-20 2013-06-27 株式会社 東芝 セラミックス銅回路基板とそれを用いた半導体装置

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6459986A (en) * 1987-08-31 1989-03-07 Toshiba Corp Ceramic circuit board
JPH104156A (ja) * 1996-06-14 1998-01-06 Mitsubishi Electric Corp 半導体装置用絶縁基板及び半導体装置
JP3449458B2 (ja) 1997-05-26 2003-09-22 電気化学工業株式会社 回路基板
US20040103808A1 (en) * 2002-08-19 2004-06-03 Darren Lochun Electrical circuits and methods of manufacture and use
JP2004172182A (ja) 2002-11-18 2004-06-17 Denki Kagaku Kogyo Kk 回路基板及びその製造方法
JP4191506B2 (ja) * 2003-02-21 2008-12-03 Ｔｄｋ株式会社 高密度インダクタおよびその製造方法
US7062840B2 (en) * 2003-02-24 2006-06-20 Delphi Technologies, Inc. Method for forming permanent magnet targets for position sensors
JP2004342635A (ja) * 2003-05-13 2004-12-02 Hitachi Metals Ltd セラミックス基板接合用金属板およびセラミックス回路基板
JP2005150329A (ja) * 2003-11-14 2005-06-09 Canon Inc 配線構造及びその作製方法
JP4556422B2 (ja) * 2003-12-02 2010-10-06 パナソニック株式会社 電子部品およびその製造方法
CN101530011A (zh) * 2006-11-30 2009-09-09 株式会社德山 金属化陶瓷基板芯片的制造方法
JP5054445B2 (ja) * 2007-06-26 2012-10-24 スミダコーポレーション株式会社 コイル部品
JP2009170930A (ja) 2009-03-12 2009-07-30 Hitachi Metals Ltd セラミックス回路基板及びこれを用いたパワー半導体モジュール
JP6125328B2 (ja) * 2013-05-27 2017-05-10 日東電工株式会社 軟磁性フィルム積層回路基板の製造方法
JP6297281B2 (ja) * 2013-05-27 2018-03-20 日東電工株式会社 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP6567259B2 (ja) * 2013-10-01 2019-08-28 日東電工株式会社 軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置
US20150201499A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Device, system, and method of three-dimensional printing
US20150201500A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR System, device, and method of three-dimensional printing
GB2538459B (en) * 2014-03-04 2020-09-23 Murata Manufacturing Co Coil component, coil module, and method for manufacturing coil component
CN206075983U (zh) * 2014-04-09 2017-04-05 株式会社村田制作所 层叠线圈部件
KR102004791B1 (ko) * 2014-05-21 2019-07-29 삼성전기주식회사 칩 전자부품 및 그 실장기판
JP6311200B2 (ja) * 2014-06-26 2018-04-18 住友電工プリントサーキット株式会社 プリント配線板、電子部品及びプリント配線板の製造方法
JP6341822B2 (ja) * 2014-09-26 2018-06-13 三菱電機株式会社 半導体装置
US9570385B2 (en) * 2015-01-22 2017-02-14 Invensas Corporation Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
US11083092B2 (en) * 2015-03-13 2021-08-03 Sumitomo Electric Printed Circuits, Inc. Planar coil element and method for producing planar coil element
KR20160136127A (ko) * 2015-05-19 2016-11-29 삼성전기주식회사 코일 전자부품 및 그 제조방법
EP3358614B1 (en) 2015-09-28 2022-12-14 Kabushiki Kaisha Toshiba Circuit substrate and semiconductor device
KR101900880B1 (ko) * 2015-11-24 2018-09-21 주식회사 모다이노칩 파워 인덕터
JP7102097B2 (ja) * 2016-03-01 2022-07-19 日東電工株式会社 磁性フィルムおよびコイルモジュール
KR20170112522A (ko) * 2016-03-31 2017-10-12 주식회사 모다이노칩 코일 패턴 및 그 형성 방법, 이를 구비하는 칩 소자
US10321235B2 (en) * 2016-09-23 2019-06-11 Apple Inc. Transducer having a conductive suspension member
JP6380716B1 (ja) * 2016-11-28 2018-08-29 株式会社村田製作所 多層基板、多層基板の回路基板への実装構造、および多層基板の製造方法
JP6390825B1 (ja) * 2017-03-01 2018-09-19 株式会社村田製作所 実装用基板
KR102442382B1 (ko) * 2017-07-25 2022-09-14 삼성전기주식회사 인덕터
JP6740298B2 (ja) 2018-08-23 2020-08-12 東芝テック株式会社 チェックアウトシステム、会計機、及び制御プログラム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094213A1 (ja) 2011-12-20 2013-06-27 株式会社 東芝 セラミックス銅回路基板とそれを用いた半導体装置

Also Published As

Publication number Publication date
US11497125B2 (en) 2022-11-08
JPWO2020067427A1 (ja) 2021-09-02
EP3860317A4 (en) 2021-11-17
CN112772001A (zh) 2021-05-07
KR20210046057A (ko) 2021-04-27
US20220039264A1 (en) 2022-02-03
EP3860317B1 (en) 2024-07-24
WO2020067427A1 (ja) 2020-04-02
EP3860317A1 (en) 2021-08-04
KR102564099B1 (ko) 2023-08-04

Similar Documents

Publication Publication Date Title
CN103477429B (zh) 半导体器件及其制造方法
JP5729468B2 (ja) 半導体装置
TWI826965B (zh) 貫通電極基板及其製造方法、以及安裝基板
US8014154B2 (en) Circuit substrate for preventing warpage and package using the same
JP7332588B2 (ja) セラミックス銅回路基板およびその製造方法
JP5230157B2 (ja) 反り防止のための回路基板及びその製造方法
JP6244499B2 (ja) プリント配線板、及びカメラモジュール
CN113646149B (zh) 氮化物陶瓷基板的制造方法及氮化物陶瓷基材
JP6832426B2 (ja) パワーモジュール用基板およびパワーモジュール
CN104350586A (zh) 半导体装置
JP7455751B2 (ja) 接合基板、金属回路基板及び回路基板
EP4184559A1 (en) Integrated circuit package with serpentine conductor and method of making
TW201735277A (zh) 微間距封裝結構
TWI310296B (en) Printed circuit board with dual type inner structure and method for forming same
WO2016031440A1 (ja) チップ抵抗器およびその実装構造
CN107946280A (zh) 半导体封装
CN107924847B (zh) 安装结构以及模块
TW201032311A (en) Substrate structure and package structure using the same
JP2021130571A (ja) 窒化アルミニウム基板、電子装置及び電子モジュール
JP2004319692A (ja) 電子回路基板
KR102191249B1 (ko) 칩 저항 소자 어셈블리
JP7124634B2 (ja) 半導体ウェハおよび半導体装置の製造方法
JPWO2016152905A1 (ja) 配線基板、電子装置および電子モジュール
JP2006073843A (ja) 半導体装置およびその製造方法
TW202610012A (zh) 貫通電極基板、附有元件之貫通電極基板、半導體裝置及貫通電極用基板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220629

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220629

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220629

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220927

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221125

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230427

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20230427

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20230510

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20230721

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240313

R150 Certificate of patent or registration of utility model

Ref document number: 7455751

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150