JP6297281B2 - 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置 - Google Patents
軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置 Download PDFInfo
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- JP6297281B2 JP6297281B2 JP2013172565A JP2013172565A JP6297281B2 JP 6297281 B2 JP6297281 B2 JP 6297281B2 JP 2013172565 A JP2013172565 A JP 2013172565A JP 2013172565 A JP2013172565 A JP 2013172565A JP 6297281 B2 JP6297281 B2 JP 6297281B2
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Images
Classifications
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- H05K1/00—Printed circuits
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- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C—CHEMISTRY; METALLURGY
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
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- H—ELECTRICITY
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- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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Description
(軟磁性樹脂組成物の調製)
軟磁性樹脂組成物に対し軟磁性粒子が60体積%となるように、軟磁性粒子(Fe−Si−Al合金、扁平状、メイト社製)500質量部、ポリエーテルリン酸エステル(楠本化成社製、「ED152」、酸価17)2.5質量部(軟磁性粒子100質量部に対して、0.5質量部)、アクリル酸エチル−メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー(根上工業社製、商品名「パラクロンW−197CM」)25質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコート1004)13質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコートYL980)7質量部、フェノールアラルキル樹脂(三井化学社製、ミレックスXLC−4L)9質量部、および、2,4−ジアミノ−6−(2’−メチルイミダゾリル(1)’)エチル−s−トリアジン・イソシアヌール酸付加物(熱硬化触媒、四国化成社製、「2MAOK−PW」)0.54質量部(樹脂成分100質量部に対して1.0質量部)を混合することにより、軟磁性樹脂組成物(軟磁性熱硬化性樹脂組成物)を得た。
この軟磁性樹脂組成物をメチルエチルケトンに溶解させることにより、固形分濃度43質量%の軟磁性樹脂組成物溶液を調製した。
(軟磁性樹脂組成物の調製)
軟磁性粒子が65体積%となるように、軟磁性粒子(上記と同様)500質量部、ポリエーテルリン酸エステル(楠本化成社製、「ED153」、酸価55、含有量50質量%、溶剤:プロピレングリコールモノメチルエーテル)5質量部(軟磁性粒子100質量部に対して、1.0質量部)、アクリル酸エチル−メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー(上記と同様)20質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコート1004)10質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコートYL980)6質量部、フェノールアラルキル樹脂(上記と同様)7質量部、および、2,4−ジアミノ−6−(2’−メチルイミダゾリル(1)’)エチル−s−トリアジン・イソシアヌール酸付加物(熱硬化触媒、四国化成社製、「2MAOK−PW」)0.43質量部(樹脂成分100質量部に対して1.0質量部)を混合することにより、軟磁性樹脂組成物を得た。
この軟磁性樹脂組成物をメチルエチルケトンに溶解させることにより、固形分濃度43質量%の軟磁性樹脂組成物溶液を調製した。
(軟磁性樹脂組成物の調製)
軟磁性粒子が70体積%となるように、軟磁性粒子(上記と同様)500質量部、ポリエーテルリン酸エステル(楠本化成社製、「ED154」、酸価114)25質量部(軟磁性粒子100質量部に対して、5.0質量部)、アクリル酸エチル−メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー(上記と同様)16質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコート1004)6質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコートYL980)8質量部、フェノールアラルキル樹脂(上記と同様)5質量部、および、2,4−ジアミノ−6−[2´−メチルイミダゾリル−(1´)]−エチル−s−トリアジンイソシアヌル酸付加物(熱硬化触媒、四国化成社製、「2MAOK−PW」)0.35質量部(樹脂成分100質量部に対して1.0質量部)を混合することにより、軟磁性樹脂組成物を得た。
この軟磁性樹脂組成物をメチルエチルケトンに溶解させることにより、固形分濃度43質量%の軟磁性樹脂組成物溶液を調製した。
ポリエーテルリン酸エステルを含有しなかった以外は、実施例1と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルを含有しなかった以外は、実施例2と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルを含有しなかった以外は、実施例3と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルの代わりに、3−メタクリロキシプロピルトリメトキシシラン(信越化学社製、シランカップリング剤、「KBM503」)を含有した以外は、実施例2と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルの代わりに、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン(信越化学社製、シランカップリング剤、「KBM303」)を含有した以外は、実施例3と同様にして、軟磁性樹脂組成物を得た。
軟磁性粒子が50体積%となるように、軟磁性粒子(上記と同様)500質量部、および、ポリエーテルリン酸エステル(楠本化成社製、「ED152」、酸価17)2.5質量部(軟磁性粒子100質量部に対して、0.5質量部)を配合し、表1に記載の配合割合にした以外は、実施例1と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルを含有しなかった以外は、比較例6と同様にして、軟磁性樹脂組成物を得た。
・成形性(成膜性)
各実施例および比較例の軟磁性接着フィルムを製造する際に、軟磁性樹脂組成物溶液をセパレータに安定して塗布することができ、製造した軟磁性接着フィルムの表面に荒れが発生していなかった場合を○と評価し、軟磁性樹脂組成物溶液をセパレータに塗布することができたが、製造した軟磁性接着フィルムの表面に荒れが確認できた場合を△と評価し、軟磁性樹脂組成物溶液を安定して塗布することができず、フィルム状に形成することができなった場合を×と評価した。
(軟磁性フィルム積層回路基板の製造)
ループコイル状の厚み15μmの配線パターンが、可撓性基板(ポリイミドフィルム、厚み18μm)の両面に形成された両面配線パターン形成回路基板(合計厚み48μm、配線の幅100μm、配線間の間隔(ピッチ間)500μm)を用意した。
・Fe−Si−Al合金:商品名「SP−7」、軟磁性粒子、平均粒子径65μm、扁平状、メイト社製
・パラクロンW−197CM:商品名、アクリル酸エチル−メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー、根上工業社製
・エピコート1004:商品名、ビスフェノールA型エポキシ樹脂、エポキシ当量875〜975g/eq、JER社製、
・エピコートYL980:商品名、ビスフェノールA型エポキシ樹脂、エポキシ当量180〜190g/eq、JER社製
・ミレックスXLC−4L:商品名、フェノールアラルキル樹脂、水酸基当量170g/eq、三井化学社製
・ED152:商品名「HIPLAAD ED152」、ポリエーテルリン酸エステル、楠本化成社製、酸価17
・ED153:商品名「HIPLAAD ED153」、ポリエーテルリン酸エステル、楠本化成社製、酸価55、含有量50質量%、溶剤:プロピレングリコールモノメチルエーテル
・ED154:商品名「HIPLAAD ED154」、ポリエーテルリン酸エステル、楠本化成社製、酸価114
・KBM503:商品名、3−メタクリロキシプロピルトリメトキシシラン、信越化学社製、シランカップリング剤
・KBM303:商品名、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、信越化学社製、シランカップリング剤
・2MAOK−PW:商品名、2,4−ジアミノ−6−[2’−メチルイミダゾリル−(1’)]−エチル−s−トリアジンイソシアヌル酸付加物、四国化成社製
(考察)
表1から明らかなように、本実施例のポリエーテルリン酸エステルを含有する軟磁性樹脂組成物を用いれば、ポリエーテルリン酸エステルを含有しない軟磁性樹脂組成物(比較例1)よりも、優れた成形性(成膜性)を発揮し、また、より優れた磁性特性を備える軟磁性接着フィルムや軟磁性フィルムを得ることができた。
5 回路基板
6 軟磁性粒子
7 樹脂成分
10 軟磁性フィルム
11 軟磁性フィルム積層回路基板
Claims (7)
- 扁平状の軟磁性粒子、樹脂成分およびポリエーテルリン酸エステルを含有し、
前記軟磁性粒子の含有割合が、60体積%以上であり、
前記軟磁性粒子100質量部に対する前記ポリエーテルリン酸エステルの含有割合が、0.1〜5質量部であることを特徴とする、軟磁性樹脂組成物。 - 前記ポリエーテルリン酸エステルの酸価が、10以上であることを特徴とする、請求項1に記載の軟磁性樹脂組成物。
- 前記樹脂成分が、アクリル樹脂、エポキシ樹脂およびフェノール樹脂を含有することを特徴とする、請求項1または2に記載の軟磁性樹脂組成物。
- 前記軟磁性粒子が、センダストであることを特徴とする、請求項1〜3のいずれか一項に記載の軟磁性樹脂組成物。
- 請求項1〜4のいずれか1項に記載の軟磁性樹脂組成物から形成されることを特徴とする、軟磁性接着フィルム。
- 請求項5に記載の軟磁性接着フィルムを、回路基板に積層することにより得られることを特徴とする、軟磁性フィルム積層回路基板。
- 請求項6に記載の軟磁性フィルム積層回路基板を備えることを特徴とする、位置検出装置。
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KR1020157033030A KR102281408B1 (ko) | 2013-05-27 | 2014-04-08 | 연자성 수지 조성물, 연자성 접착 필름, 연자성 필름 적층 회로 기판, 및 위치 검출 장치 |
US14/893,179 US20160172086A1 (en) | 2013-05-27 | 2014-04-08 | Soft magnetic resin composition, soft magnetic adhesive film, soft magnetic film laminate circuit board, and position detection device |
PCT/JP2014/060220 WO2014192427A1 (ja) | 2013-05-27 | 2014-04-08 | 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置 |
EP14803615.5A EP3007187B1 (en) | 2013-05-27 | 2014-04-08 | Soft-magnetic resin composition, soft-magnetic adhesive film, circuit board with soft-magnetic film laminated thereto, and position detection device |
CN201480030879.2A CN105247632B (zh) | 2013-05-27 | 2014-04-08 | 软磁性树脂组合物、软磁性粘接薄膜、软磁性薄膜层叠电路基板及位置检测装置 |
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JP5626078B2 (ja) * | 2011-03-31 | 2014-11-19 | Tdk株式会社 | 磁性シート |
JP5941640B2 (ja) * | 2011-09-12 | 2016-06-29 | 株式会社巴川製紙所 | 複合磁性体 |
EP2963658A4 (en) * | 2013-02-26 | 2016-11-09 | Nitto Denko Corp | SOFT MAGNETIC THERMOSETABLE FILM AND SOFT MAGNETIC FILM |
EP2963657B1 (en) * | 2013-02-26 | 2021-04-14 | Nitto Denko Corporation | Soft magnetic film |
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2013
- 2013-08-22 JP JP2013172565A patent/JP6297281B2/ja active Active
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2014
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- 2014-04-08 WO PCT/JP2014/060220 patent/WO2014192427A1/ja active Application Filing
- 2014-04-08 KR KR1020157033030A patent/KR102281408B1/ko active IP Right Grant
- 2014-04-08 US US14/893,179 patent/US20160172086A1/en not_active Abandoned
- 2014-04-08 EP EP14803615.5A patent/EP3007187B1/en active Active
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JP2015008263A (ja) | 2015-01-15 |
KR102281408B1 (ko) | 2021-07-23 |
CN105247632A (zh) | 2016-01-13 |
KR20160013024A (ko) | 2016-02-03 |
EP3007187A4 (en) | 2017-03-22 |
US20160172086A1 (en) | 2016-06-16 |
EP3007187B1 (en) | 2021-01-06 |
TWI608501B (zh) | 2017-12-11 |
TW201513142A (zh) | 2015-04-01 |
CN105247632B (zh) | 2018-06-15 |
EP3007187A1 (en) | 2016-04-13 |
WO2014192427A1 (ja) | 2014-12-04 |
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