CN105247632B - 软磁性树脂组合物、软磁性粘接薄膜、软磁性薄膜层叠电路基板及位置检测装置 - Google Patents

软磁性树脂组合物、软磁性粘接薄膜、软磁性薄膜层叠电路基板及位置检测装置 Download PDF

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CN105247632B
CN105247632B CN201480030879.2A CN201480030879A CN105247632B CN 105247632 B CN105247632 B CN 105247632B CN 201480030879 A CN201480030879 A CN 201480030879A CN 105247632 B CN105247632 B CN 105247632B
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soft
soft magnetism
soft magnetic
resin
magnetic particles
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CN105247632A (zh
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土生刚志
江部宏史
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Nitto Denko Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Soft Magnetic Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Powder Metallurgy (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
CN201480030879.2A 2013-05-27 2014-04-08 软磁性树脂组合物、软磁性粘接薄膜、软磁性薄膜层叠电路基板及位置检测装置 Active CN105247632B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013-110804 2013-05-27
JP2013110804 2013-05-27
JP2013172565A JP6297281B2 (ja) 2013-05-27 2013-08-22 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2013-172565 2013-08-22
PCT/JP2014/060220 WO2014192427A1 (ja) 2013-05-27 2014-04-08 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置

Publications (2)

Publication Number Publication Date
CN105247632A CN105247632A (zh) 2016-01-13
CN105247632B true CN105247632B (zh) 2018-06-15

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CN201480030879.2A Active CN105247632B (zh) 2013-05-27 2014-04-08 软磁性树脂组合物、软磁性粘接薄膜、软磁性薄膜层叠电路基板及位置检测装置

Country Status (7)

Country Link
US (1) US20160172086A1 (ja)
EP (1) EP3007187B1 (ja)
JP (1) JP6297281B2 (ja)
KR (1) KR102281408B1 (ja)
CN (1) CN105247632B (ja)
TW (1) TWI608501B (ja)
WO (1) WO2014192427A1 (ja)

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Publication number Priority date Publication date Assignee Title
US10699842B2 (en) * 2014-09-02 2020-06-30 Apple Inc. Magnetically doped adhesive for enhancing magnetic coupling
JP5881027B1 (ja) * 2015-03-16 2016-03-09 パナソニックＩｐマネジメント株式会社 樹脂シート、樹脂シートの製造方法、インダクタ部品
US10593453B2 (en) * 2016-07-25 2020-03-17 Tdk Corporation High permeability magnetic sheet
WO2018131536A1 (ja) 2017-01-12 2018-07-19 株式会社村田製作所 磁性体粒子、圧粉磁心、およびコイル部品
US11324120B2 (en) * 2017-03-08 2022-05-03 Sumitomo Electric Printed Circuits, Inc. Flexible printed circuit board
WO2018181737A1 (ja) * 2017-03-30 2018-10-04 味の素株式会社 ペースト状樹脂組成物
JP7352363B2 (ja) * 2018-03-16 2023-09-28 日東電工株式会社 磁性配線回路基板およびその製造方法
WO2019177077A1 (ja) * 2018-03-16 2019-09-19 日東電工株式会社 磁性配線回路基板およびその製造方法
JP7323268B2 (ja) * 2018-03-16 2023-08-08 日東電工株式会社 磁性配線回路基板およびその製造方法
JP7030022B2 (ja) * 2018-06-21 2022-03-04 日東電工株式会社 インダクタ
JP7081667B2 (ja) * 2018-07-25 2022-06-07 味の素株式会社 磁性ペースト
WO2020022393A1 (ja) * 2018-07-25 2020-01-30 味の素株式会社 磁性ペースト
WO2020067427A1 (ja) * 2018-09-27 2020-04-02 デンカ株式会社 接合基板、金属回路基板及び回路基板
JP7342433B2 (ja) * 2019-06-05 2023-09-12 Tdk株式会社 プリント配線基板およびその製造方法

Citations (12)

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Publication number Priority date Publication date Assignee Title
JPS6058497A (ja) * 1983-09-10 1985-04-04 Tdk Corp 磁性流体
US5714238A (en) * 1995-12-01 1998-02-03 Namics Corporation Conductive adhesive and circuit using the same
JPH10289815A (ja) * 1997-04-11 1998-10-27 Nok Corp 磁性流体の製造方法
JP2006202266A (ja) * 2004-12-20 2006-08-03 Toppan Forms Co Ltd 非接触型データ受送信体
JP2007258432A (ja) * 2006-03-23 2007-10-04 Nitta Ind Corp 電磁波吸収体およびその製造方法
JP2008134837A (ja) * 2006-11-28 2008-06-12 Wacom Co Ltd 位置検出装置及びディスプレイ装置
JP2009059753A (ja) * 2007-08-30 2009-03-19 Hitachi Chem Co Ltd 難燃化ノイズ抑制シート
JP2009218450A (ja) * 2008-03-11 2009-09-24 Furukawa Electric Co Ltd:The 電磁波障害対策シ−ト
JP2010196123A (ja) * 2009-02-26 2010-09-09 Daido Steel Co Ltd 扁平状軟磁性粉末の製造方法、扁平状軟磁性粉末および電磁波吸収体
JP4807523B2 (ja) * 2006-10-31 2011-11-02 ソニーケミカル＆インフォメーションデバイス株式会社 シート状軟磁性材料及びその製造方法
JP2012212790A (ja) * 2011-03-31 2012-11-01 Tdk Corp 磁性シート
JP2013062318A (ja) * 2011-09-12 2013-04-04 Tomoegawa Paper Co Ltd 複合磁性体

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JP4519914B2 (ja) * 2005-06-03 2010-08-04 Ｄｉｃ株式会社 電磁波シールド材及びその製造方法
JP5048974B2 (ja) * 2005-06-20 2012-10-17 アキレス株式会社 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート
JP2008021990A (ja) * 2006-06-16 2008-01-31 Nitta Ind Corp 電磁干渉抑制体および電磁障害抑制方法
JPWO2008123362A1 (ja) * 2007-03-27 2010-07-15 日本ゼオン株式会社 重合性組成物及び成形体
JP4962220B2 (ja) * 2007-08-30 2012-06-27 日立化成工業株式会社 難燃化ノイズ抑制シート
JP5688895B2 (ja) * 2008-12-26 2015-03-25 Ｄｏｗａエレクトロニクス株式会社 微小銀粒子粉末と該粉末を使用した銀ペースト
WO2014132879A1 (ja) * 2013-02-26 2014-09-04 日東電工株式会社 軟磁性熱硬化性フィルム、および、軟磁性フィルム
EP2963657B1 (en) * 2013-02-26 2021-04-14 Nitto Denko Corporation Soft magnetic film

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6058497A (ja) * 1983-09-10 1985-04-04 Tdk Corp 磁性流体
US5714238A (en) * 1995-12-01 1998-02-03 Namics Corporation Conductive adhesive and circuit using the same
JPH10289815A (ja) * 1997-04-11 1998-10-27 Nok Corp 磁性流体の製造方法
JP2006202266A (ja) * 2004-12-20 2006-08-03 Toppan Forms Co Ltd 非接触型データ受送信体
JP2007258432A (ja) * 2006-03-23 2007-10-04 Nitta Ind Corp 電磁波吸収体およびその製造方法
JP4807523B2 (ja) * 2006-10-31 2011-11-02 ソニーケミカル＆インフォメーションデバイス株式会社 シート状軟磁性材料及びその製造方法
JP2008134837A (ja) * 2006-11-28 2008-06-12 Wacom Co Ltd 位置検出装置及びディスプレイ装置
JP2009059753A (ja) * 2007-08-30 2009-03-19 Hitachi Chem Co Ltd 難燃化ノイズ抑制シート
JP2009218450A (ja) * 2008-03-11 2009-09-24 Furukawa Electric Co Ltd:The 電磁波障害対策シ−ト
JP2010196123A (ja) * 2009-02-26 2010-09-09 Daido Steel Co Ltd 扁平状軟磁性粉末の製造方法、扁平状軟磁性粉末および電磁波吸収体
JP2012212790A (ja) * 2011-03-31 2012-11-01 Tdk Corp 磁性シート
JP2013062318A (ja) * 2011-09-12 2013-04-04 Tomoegawa Paper Co Ltd 複合磁性体

Also Published As

Publication number Publication date
EP3007187B1 (en) 2021-01-06
WO2014192427A1 (ja) 2014-12-04
JP2015008263A (ja) 2015-01-15
TW201513142A (zh) 2015-04-01
CN105247632A (zh) 2016-01-13
EP3007187A1 (en) 2016-04-13
KR20160013024A (ko) 2016-02-03
EP3007187A4 (en) 2017-03-22
KR102281408B1 (ko) 2021-07-23
TWI608501B (zh) 2017-12-11
US20160172086A1 (en) 2016-06-16
JP6297281B2 (ja) 2018-03-20

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