WO2014192427A1 - 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置 - Google Patents
軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
- H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Definitions
- the present invention relates to a soft magnetic resin composition, a soft magnetic adhesive film, a soft magnetic film laminated circuit board, and a position detection device.
- a position detection device that detects a position by moving a pen-type position indicator on a position detection plane is called a digitizer and is widely used as an input device for a computer.
- This position detection device includes a position detection flat plate, and a circuit board (sensor board) disposed under the position detection flat board and having a loop coil formed on the surface of the board. And the position of a position indicator is detected by utilizing the electromagnetic induction which a position indicator and a loop coil generate
- the position detection device contains a soft magnetic material on the surface (opposite surface) opposite to the position detection plane of the sensor substrate in order to control the magnetic flux generated during electromagnetic induction and improve communication efficiency.
- a method of arranging a soft magnetic film has been proposed (see, for example, Patent Document 1 below).
- Patent Document 1 discloses a magnetic film containing soft magnetic powder, a binder resin made of acrylic rubber, phenol resin, epoxy resin, melamine, and the like, and a phosphinic acid metal salt.
- An object of the present invention is to provide a soft magnetic adhesive film filled with soft magnetic particles at a high ratio and having excellent magnetic properties, a soft magnetic film laminated circuit board and a position detection device obtained from the soft magnetic adhesive film, and the soft magnetic film.
- the object is to provide a soft magnetic resin composition capable of producing a magnetic adhesive film.
- the soft magnetic resin composition of the present invention contains flat soft magnetic particles, a resin component, and a polyether phosphate, the content of the soft magnetic particles is 60% by volume or more, and the soft magnetic particles 100 A content ratio of the polyether phosphate ester relative to parts by mass is 0.1 to 5 parts by mass.
- the polyether phosphate ester has an acid value of 10 or more.
- the resin component contains an acrylic resin, an epoxy resin, and a phenol resin.
- the soft magnetic particles are sendust.
- the soft magnetic adhesive film of the present invention is characterized by being formed from the above soft magnetic resin composition.
- the soft magnetic film laminated circuit of the present invention is characterized by being obtained by laminating the above soft magnetic adhesive film on a circuit board.
- a position detection device of the present invention is characterized by including the above-described soft magnetic film laminated circuit board.
- the soft magnetic resin composition of the present invention can be stably applied in a state containing a high percentage of soft magnetic particles, a soft magnetic adhesive film containing a high percentage of soft magnetic particles is easily produced. be able to.
- the soft magnetic adhesive film of the present invention is filled with a high content of soft magnetic particles and is well oriented, and therefore has excellent magnetic properties.
- the soft magnetic film laminated circuit board and the position detection device of the present invention include the soft magnetic adhesive film having excellent magnetic properties, the position detection device has good performance and enables more reliable position detection. .
- FIG. 1A is a manufacturing process diagram of an embodiment of a method for manufacturing a soft magnetic film laminated circuit board of the present invention, a process of preparing a soft magnetic adhesive film and a circuit board
- FIG. 1B is a soft magnetic film of the present invention. It is a manufacturing process figure of one Embodiment of the manufacturing method of a laminated circuit board, the process of making a soft magnetic adhesive film contact a circuit board following FIG. 1A, FIG. 1C is manufacture of the soft magnetic film laminated circuit board of this invention. It is a manufacturing-process figure of one Embodiment of a method, and shows the process of pressing a soft-magnetic-adhesive film to a circuit board following FIG. 1B.
- the soft magnetic resin composition of the present invention contains flat soft magnetic particles (hereinafter also simply referred to as “soft magnetic particles”), a resin component, and a polyether phosphate ester.
- soft magnetic materials for soft magnetic particles include magnetic stainless steel (Fe—Cr—Al—Si alloy), sendust (Fe—Si—A1 alloy), permalloy (Fe—Ni alloy), and silicon copper (Fe—Cu—).
- Si alloy Fe-Si alloy, Fe-Si-B (-Cu-Nb) alloy, Fe-Si-Cr-Ni alloy, Fe-Si-Cr alloy, Fe-Si-Al-Ni-Cr alloy, ferrite Etc.
- Sendust Fe—Si—Al alloy
- Fe—Si—Al alloy More preferred is an Fe—Si—Al alloy having a Si content of 9 to 15% by mass. Thereby, the magnetic permeability of the soft magnetic adhesive film can be improved.
- the shape of the soft magnetic particles is flat (plate-like).
- the flatness (flatness) is, for example, 8 or more, preferably 15 or more, and for example, 80 or less, preferably 65 or less.
- the flatness is calculated as an aspect ratio obtained by dividing the 50% particle diameter (D50) by the average thickness of the soft magnetic particles. *
- the average particle diameter (average length) of the soft magnetic particles is, for example, 3.5 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 100 ⁇ m or less.
- the average thickness is, for example, 0.3 ⁇ m or more, preferably 0.5 ⁇ m or more, and for example, 3 ⁇ m or less, preferably 2.5 ⁇ m or less.
- Soft magnetic particle content in soft magnetic resin composition (and hence soft magnetic adhesive film or soft magnetic film) (solid content excluding solvent (that is, soft magnetic particles, resin component, polyether phosphate ester, and as necessary)
- the proportion in the thermosetting catalyst and other additives contained accordingly is 60% by volume or more, preferably 65% by volume or more, for example, 95% by volume or less, preferably 90% by volume or less. .
- it is 80 mass% or more, for example, Preferably, it is 85 mass% or more, for example, is 98 mass% or less, Preferably, it is also 95 mass% or less.
- the film-forming property on the soft magnetic adhesive film in the soft magnetic resin composition is excellent.
- the magnetic characteristic of a soft magnetic adhesive film is excellent by setting it as the range beyond the said minimum.
- Resin component contains, for example, acrylic resin, epoxy resin, phenol resin and the like.
- an acrylic resin, an epoxy resin, and a phenol resin are used in combination.
- a soft magnetic adhesive film obtained from the soft magnetic resin composition (soft magnetic thermosetting adhesive resin composition). Film) exhibits good adhesion and thermosetting.
- an acrylic resin for example, an acrylic polymer obtained by polymerizing one or two or more (meth) acrylic acid alkyl esters having a linear or branched alkyl group as a monomer component, and the like are polymerized.
- (meth) acryl means “acryl and / or methacryl”.
- alkyl group examples include methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, isobutyl, amyl, isoamyl, hexyl, heptyl, cyclohexyl, 2- Alkyl having 1 to 20 carbon atoms such as ethylhexyl, octyl, isooctyl, nonyl, isononyl, decyl, isodecyl, undecyl, lauryl, tridecyl, tetradecyl, stearyl, octadecyl, dodecyl Groups.
- an alkyl group having 1 to 6 carbon atoms is used.
- the acrylic polymer may be a copolymer of (meth) acrylic acid alkyl ester and other monomers.
- Examples of other monomers include glycidyl group-containing monomers such as glycidyl acrylate and glycidyl methacrylate, such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.
- glycidyl group-containing monomers such as glycidyl acrylate and glycidyl methacrylate, such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.
- Carboxyl group-containing monomers for example, acid anhydride monomers such as maleic anhydride, itaconic anhydride, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4- (meth) acrylic acid 4- Hydroxybutyl, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate or ( Hydroxyl group-containing monomers such as -hydroxymethylcyclohexyl) -methyl acrylate such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl ( Examples thereof include sulfonic acid group-containing monomers such as (meth)
- a glycidyl group-containing monomer, a carboxyl group-containing monomer, or a hydroxyl group-containing monomer is used.
- the acrylic resin is a copolymer of (meth) acrylic acid alkyl ester and other monomers, that is, when the acrylic resin has a glycidyl group, a carboxyl group or a hydroxyl group, a soft magnetic film obtained from a soft magnetic adhesive film Excellent reflow resistance.
- the blending ratio (mass) of the other monomer is preferably 40% by mass or less with respect to the copolymer.
- the weight average molecular weight of the acrylic resin is, for example, 1 ⁇ 10 5 or more, preferably 3 ⁇ 10 5 or more, and for example, 1 ⁇ 10 6 or less. By setting it as this range, it is excellent in the adhesiveness of a soft magnetic adhesive film, etc.
- a weight average molecular weight is measured by a standard polystyrene conversion value by gel permeation chromatography (GPC).
- the glass transition point (Tg) of the acrylic resin is, for example, ⁇ 30 ° C. or more, preferably ⁇ 20 ° C. or more, and for example, 30 ° C. or less, preferably 15 ° C. or less. It is excellent in the adhesiveness of a soft-magnetic adhesive film as it is more than the said minimum. On the other hand, when it is not more than the above upper limit, the handleability of the soft magnetic adhesive film is excellent.
- the glass transition point is obtained from the maximum value of the loss tangent (tan ⁇ ) measured using a dynamic viscoelasticity measuring device (DMA, frequency 1 Hz, heating rate 10 ° C./min).
- the content ratio of the acrylic resin is, for example, 10 with respect to 100 parts by mass of a resin component (for example, an acrylic resin, an epoxy resin, a phenol resin, and another resin (described later) blended as necessary). It is 20 parts by mass or more, preferably 20 parts by mass or more, more preferably 40 parts by mass or more, and for example, 80 parts by mass or less, preferably 70 parts by mass or less. By setting it as this range, it is excellent in the film-forming property of a soft-magnetic resin composition, and the adhesiveness of a soft-magnetic adhesive film.
- a resin component for example, an acrylic resin, an epoxy resin, a phenol resin, and another resin (described later) blended as necessary. It is 20 parts by mass or more, preferably 20 parts by mass or more, more preferably 40 parts by mass or more, and for example, 80 parts by mass or less, preferably 70 parts by mass or less.
- epoxy resin for example, those used as an adhesive composition can be used, and bisphenol type epoxy resins (in particular, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, brominated bisphenol A type epoxy resins). , Hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy resin, etc.), phenol type epoxy resin (especially phenol novolak type epoxy resin, orthocresol novolak type epoxy resin), biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene Bifunctional epoxy resins and polyfunctional epoxy resins such as epoxy resin, trishydroxyphenylmethane epoxy resin, and tetraphenylolethane epoxy resin.
- bisphenol type epoxy resins in particular, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, brominated bisphenol A type epoxy resins.
- phenol type epoxy resin especially phenol novol
- a hydantoin type epoxy resin a trisglycidyl isocyanurate type epoxy resin, a glycidylamine type epoxy resin and the like can be mentioned.
- these epoxy resins bisphenol type epoxy resins are preferable, and bisphenol A type epoxy resins are more preferable.
- the phenol resin is a curing agent for an epoxy resin.
- a novolak resin is preferable, a phenol novolac resin, a phenol aralkyl resin, and more preferably a phenol aralkyl resin.
- the content ratio of the epoxy resin to 100 parts by mass of the resin component is, for example, 15 parts by mass or more, preferably 35 parts by mass or more, for example, 70 parts by mass or less, and the content ratio of the phenol resin to 100 parts by mass of the resin component is, for example, 5 parts by mass or more, preferably 15 parts by mass or more. For example, it is 30 parts by mass or less.
- the content of the epoxy resin with respect to 100 parts by mass of the resin component is, for example, 10 parts by mass or more, 25 parts by mass or more, for example, 50 parts by mass or less, and the content ratio of the phenol resin to 100 parts by mass of the resin component is, for example, 10 parts by mass or more, preferably 25 parts by mass or more. For example, it is 50 parts by mass or less.
- the content of the epoxy resin with respect to 100 parts by mass of the resin component is, for example, 5 parts by mass or more, 15 parts by mass or more, for example, 30 parts by mass or less, and the content ratio of the phenol resin to 100 parts by mass of the resin component is, for example, 15 parts by mass or more, preferably 35 parts by mass or more. For example, it is 70 parts by mass or less.
- the epoxy equivalent when two types of epoxy resins are used in combination is the epoxy equivalent of all epoxy resins obtained by multiplying the epoxy equivalent of each epoxy resin by the mass ratio of each epoxy resin to the total amount of epoxy resin, and adding them together. is there.
- the hydroxyl group equivalent in the phenol resin is, for example, 0.2 equivalents or more, preferably 0.5 equivalents or more, and preferably, 2.0 equivalents or less, preferably 1 equivalent or less, per equivalent of epoxy group of the epoxy resin. 1.2 equivalent or less.
- the amount of the hydroxyl group is within the above range, the curing reaction of the soft magnetic adhesive film becomes good and deterioration can be suppressed.
- the content ratio of the resin component in the soft magnetic resin composition is, for example, 2% by mass or more, preferably 5% by mass or more, and for example, 20% by mass or less, preferably 15% by mass or less. By setting it as the above range, the film forming property of the soft magnetic resin composition and the magnetic properties of the soft magnetic film are excellent.
- the resin component can also contain other resins other than acrylic resin, epoxy resin and phenol resin.
- resins other than acrylic resin, epoxy resin and phenol resin.
- examples of such a resin include a thermoplastic resin and a thermosetting resin. These resins can be used alone or in combination of two or more.
- thermoplastic resin examples include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin (6-nylon, 6,6-nylon). Etc.), phenoxy resin, saturated polyester resin (PET, PBT, etc.), polyamideimide resin, fluororesin and the like.
- thermosetting resin examples include amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins.
- the content of other resins in the resin component is, for example, 10% by mass or less, preferably 5% by mass or less.
- polyether phosphate esters examples include polyoxyalkylene alkyl ether phosphate esters and polyoxyalkylene alkyl phenyl ether phosphate esters.
- polyoxyalkylene alkyl ether phosphate ester is used.
- the polyoxyalkylene alkyl ether phosphate ester has a form in which 1 to 3 alkyl-oxy-poly (alkyleneoxy) groups are bonded to the phosphorus atom of the phosphate.
- alkyl-oxy-poly (alkyleneoxy) group ie, a polyoxyalkylene alkyl ether moiety
- the number of repeating alkyleneoxy with respect to the poly (alkyleneoxy) moiety is not particularly limited. It can be appropriately selected from the range of (preferably 3 to 20).
- the alkylene at the poly (alkyleneoxy) moiety is preferably an alkylene group having 2 to 4 carbon atoms.
- alkyl group is not particularly limited, and examples thereof include an alkyl group having 6 to 30 carbon atoms, and preferably an alkyl group having 8 to 20 carbon atoms.
- examples of the alkyl group include a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, and an octadecyl group.
- the polyoxyalkylene alkyl ether phosphate ester has a plurality of alkyl-oxy-poly (alkyleneoxy) groups, the plurality of alkyl groups may be different or the same.
- Polyether phosphate esters can be used alone or in combination of two or more. Further, the polyether phosphate ester may be a mixture with an amine or the like.
- polyether phosphate ester examples include HIPLAAD series (“ED152”, “ED153”, “ED154”, “ED118”, “ED174”, “ED251”) manufactured by Enomoto Kasei Co., Ltd.
- the acid value of the polyether phosphate ester is, for example, 10 or more, preferably 15 or more, and for example, 200 or less, preferably 150 or less.
- the acid value is measured by a neutralization titration method or the like.
- the content of the polyether phosphate ester is 0.1 parts by mass or more, preferably 0.5 parts by mass or more with respect to 100 parts by mass of the soft magnetic particles. Moreover, it is 5 mass parts or less, Preferably, it is 2 mass parts or less.
- the polyether phosphate ester When the polyether phosphate ester is contained in the soft magnetic adhesive composition in a content ratio of 0.1 part by mass or more, the polyether phosphate ester effectively functions as a dispersant, and the soft magnetism in the soft magnetic resin composition It can be adsorbed on the particle surface and suppress aggregation and precipitation of soft magnetic particles. Therefore, even a soft magnetic resin composition containing a high proportion of soft magnetic particles can be stably applied and can be reliably formed into a soft magnetic adhesive film (film shape).
- the flat soft magnetic particles can be uniformly oriented in the longitudinal direction (direction perpendicular to the thickness direction) along the surface direction of the soft magnetic adhesive film.
- the apparent aspect ratio becomes small due to the aggregation precipitation of the soft magnetic particles, that is, soft magnetism. Since the particles become secondary particles (agglomerated) and do not substantially function as a flat shape, improvement in magnetic properties cannot be expected.
- the polyether phosphate ester when the polyether phosphate ester is contained in an amount of 0.1 part by mass or more, high magnetic properties corresponding to the content ratio can be improved in the soft magnetic adhesive film having a high content ratio. This is because the polyether phosphate ester suppresses aggregation and precipitation of the flat soft magnetic particles even under high filling, so that the flat soft magnetic particles can be oriented as primary particles, and the magnetic properties due to the aggregation and precipitation are reduced. This is because the decrease is considered to be suppressed.
- the polyether phosphate ester when the polyether phosphate ester is contained in the soft magnetic adhesive composition in a content ratio of 5 parts by mass or less, the polyether phosphate ester bleed out on the surface of the soft magnetic adhesive film, and Possibility that the adhesive force with respect to a to-be-attached body will fall can be reduced.
- the soft magnetic resin composition contains, for example, an acrylic resin, an epoxy resin, or a phenol resin as the resin component, it preferably contains a thermosetting catalyst.
- thermosetting catalyst is not limited as long as it is a catalyst that accelerates the curing of the resin component by heating.
- a salt having an imidazole skeleton a salt having a triphenylphosphine structure, a salt having a triphenylborane structure, amino And group-containing compounds.
- Examples of the salt having an imidazole skeleton include 2-phenylimidazole (trade name; 2PZ), 2-ethyl-4-methylimidazole (trade name; 2E4MZ), 2-methylimidazole (trade name; 2MZ), 2-un Decylimidazole (trade name; C11Z), 2-phenyl-4,5-dihydroxymethylimidazole (trade name; 2-PHZ), 2,4-diamino-6- (2′-methylimidazolyl (1) ′) ethyl- Examples include s-triazine / isocyanuric acid adduct (trade name: 2MAOK-PW) (all trade names are manufactured by Shikoku Kasei Co., Ltd.).
- Examples of the salt having a triphenylphosphine structure include triorganophosphine, triphenylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, diphenyltolylphosphine, tetra Phenylphosphonium bromide (trade name; TPP-PB), methyltriphenylphosphonium (trade name; TPP-MB), methyltriphenylphosphonium chloride (trade name; TPP-MC), methoxymethyltriphenylphosphonium (trade name; TPP- MOC), benzyltriphenylphosphonium chloride (trade name; TPP-ZC), methyltriphenylphosphonium (trade name; TPP-MB), etc. ).
- Examples of the salt having a triphenylborane structure include tri (p-methylphenyl) phosphine.
- the salt having a triphenylborane structure further includes a salt having a triphenylphosphine structure.
- Examples of the salt having a triphenylphosphine structure and a triphenylborane structure include tetraphenylphosphonium tetraphenylborate (trade name: TPP-K), tetraphenylphosphonium tetra-p-triborate (trade name: TPP-MK), benzyltri Examples thereof include phenylphosphonium tetraphenylborate (trade name; TPP-ZK), triphenylphosphine triphenylborane (trade name; TPP-S), and the like.
- amino group-containing compound examples include monoethanolamine trifluoroborate (manufactured by Stella Chemifa), dicyandiamide (manufactured by Nacalai Tesque), and the like.
- thermosetting catalyst examples include a spherical shape and an ellipsoidal shape.
- Thermosetting catalysts can be used alone or in combination of two or more.
- the blending ratio of the thermosetting catalyst is, for example, 0.2 parts by mass or more, preferably 0.3 parts by mass or more, for example, 5 parts by mass or less, preferably 100 parts by mass of the resin component. It is also 2 parts by mass or less.
- the blending ratio of the thermosetting catalyst is not more than the above upper limit, the long-term storage at room temperature in the soft magnetic adhesive film (soft magnetic thermosetting adhesive film) can be improved.
- the soft magnetic adhesive film can be cured by heating at a low temperature and in a short time. Moreover, the reflow resistance of the soft magnetic film can be improved.
- the soft magnetic resin composition may further contain other additives as necessary.
- additives include commercially available or known additives such as a crosslinking agent and an inorganic filler.
- crosslinking agent examples include polyisocyanate compounds such as tolylene diisocyanate, diphenylmethane diisocyanate, p-phenylene diisocyanate, 1,5-naphthalene diisocyanate, and adducts of polyhydric alcohol and diisocyanate.
- a content rate of a crosslinking agent it is 7 mass parts or less with respect to 100 mass parts of resin components, and exceeds 0 mass part.
- the soft magnetic resin composition can be appropriately blended with an inorganic filler according to its use. Thereby, the thermal conductivity and elastic modulus of the soft magnetic film can be improved.
- inorganic fillers include ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina oxide, beryllium oxide, silicon carbide, silicon nitride, such as aluminum, copper, silver, gold, nickel, chromium, Examples thereof include metals such as lead, tin, zinc, palladium and solder, alloys, and carbon. These inorganic fillers can be used alone or in combination of two or more.
- the average particle size of the inorganic filler is, for example, 0.1 ⁇ m or more and 80 ⁇ m or less.
- the blending ratio is, for example, 80 parts by mass or less, preferably 70 parts by mass or less, and more than 0 parts by mass with respect to 100 parts by mass of the resin component.
- a soft magnetic resin composition is obtained by mixing the above-described components, and then the soft magnetic resin composition is dissolved or dispersed in a solvent to thereby obtain a soft magnetic resin composition. Prepare the solution.
- the solvent examples include organic solvents such as ketones such as acetone and methyl ethyl ketone (MEK), esters such as ethyl acetate, amides such as N, N-dimethylformamide, ethers such as propylene glycol monomethyl ether, and the like. Etc.
- organic solvents such as ketones such as acetone and methyl ethyl ketone (MEK), esters such as ethyl acetate, amides such as N, N-dimethylformamide, ethers such as propylene glycol monomethyl ether, and the like.
- Etc examples of the solvent also include aqueous solvents such as water, for example, alcohols such as methanol, ethanol, propanol, and isopropanol.
- the solid content in the soft magnetic resin composition solution is, for example, 10% by mass or more, preferably 30% by mass or more, more preferably 40% by mass or more, and for example, 90% by mass or less, preferably 70%. It is also not more than mass%, more preferably not more than 50 mass%.
- polyether phosphate ester can also be mixed with the component mentioned above in the state previously mix
- a soft magnetic resin composition solution is applied to the surface of a substrate (separator, core material, etc.) so as to have a predetermined thickness to form a coating film, and then the coating film is dried under predetermined conditions. Thereby, a soft magnetic adhesive film is obtained.
- Application method is not particularly limited, and examples thereof include a doctor blade method, roll coating, screen coating, and gravure coating.
- the drying temperature is, for example, 70 ° C. or more and 160 ° C. or less
- the drying time is, for example, 1 minute or more and 5 minutes or less.
- the average film thickness of the soft magnetic adhesive film is, for example, 5 ⁇ m or more, preferably 50 ⁇ m or more, and for example, 1000 ⁇ m or less, preferably 500 ⁇ m or less, more preferably 300 ⁇ m or less.
- the soft magnetic adhesive film is in a semi-cured state (B stage state) at room temperature (specifically, 25 ° C.).
- the average thickness of the soft magnetic adhesive film is, for example, 5 ⁇ m or more, preferably 50 ⁇ m or more, and for example, 500 ⁇ m or less, preferably 250 ⁇ m or less.
- separator examples include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, and paper. These are subjected to mold release treatment on the surface with, for example, a fluorine release agent, a long-chain alkyl acrylate release agent, a silicone release agent, or the like.
- PET polyethylene terephthalate
- a fluorine release agent for example, a fluorine release agent, a long-chain alkyl acrylate release agent, a silicone release agent, or the like.
- the core material examples include plastic films (eg, polyimide film, polyester film, polyethylene terephthalate film, polyethylene naphthalate film, polycarbonate film, etc.), metal films (eg, aluminum foil, etc.), such as glass fiber and plastic
- plastic films eg, polyimide film, polyester film, polyethylene terephthalate film, polyethylene naphthalate film, polycarbonate film, etc.
- metal films eg, aluminum foil, etc.
- glass fiber and plastic examples thereof include a resin substrate reinforced with a woven fiber, a silicon substrate, a glass substrate, and the like.
- the average thickness of the separator or core material is, for example, 1 ⁇ m or more and 500 ⁇ m or less.
- the soft magnetic adhesive film of the present invention includes, for example, a single layer structure composed of only a single layer of a soft magnetic adhesive film, a multilayer structure in which a soft magnetic adhesive film is laminated on one side or both sides of a core material, and a soft magnetic curable adhesive film.
- a multi-layer structure in which separators are laminated on one side or both sides can be used.
- a preferred embodiment of the present invention is a multilayer structure in which separators are laminated on one side or both sides of a soft magnetic adhesive film.
- the soft magnetic adhesive film can be protected until it is put into practical use, and can also be used as a support base material when the soft magnetic adhesive film is transferred to the circuit board.
- FIGS. 1A to 1C an embodiment of a method for manufacturing a soft magnetic film laminated circuit board (a method for attaching a soft magnetic adhesive film) will be described with reference to FIGS. 1A to 1C.
- a soft magnetic adhesive film 2 on which a separator 1 is laminated and a circuit board 5 having a wiring pattern 3 formed on the surface of a substrate 4 are prepared, and then a soft magnetic adhesive is prepared.
- the film 2 and the circuit board 5 are opposed to each other in the thickness direction with a space therebetween.
- the soft magnetic adhesive film 2 can be obtained by the above method, and the soft magnetic particles (flat soft magnetic particles) 6 are made of a soft magnetic resin composition (in the embodiment of FIG. 1A, an acrylic resin, an epoxy resin, and a phenol resin). Dispersed in resin component 7 and polyether phosphate ester (not shown). In the embodiment of FIG. 1A, the soft magnetic particles 6 are oriented so that the longitudinal direction (direction perpendicular to the thickness direction) is along the surface direction of the soft magnetic adhesive film 2.
- the circuit board 5 is, for example, a circuit board 5 used in an electromagnetic induction system, and a wiring pattern 3 such as a loop coil is formed on one surface of the board 4.
- the wiring pattern 3 is formed by a semi-additive method or a subtractive method.
- Examples of the insulating material constituting the substrate 4 include a glass epoxy substrate, a glass substrate, a PET substrate, a Teflon substrate, a ceramic substrate, and a polyimide substrate.
- the wiring pattern 3 is formed of a conductor such as copper, for example.
- each wiring 8 constituting the wiring pattern 3 is, for example, 5 ⁇ m or more, preferably 9 ⁇ m or more, and for example, 500 ⁇ m or less, preferably 300 ⁇ m or less.
- the thickness (height) of the wiring 8 is, for example, 5 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 50 ⁇ m or less, preferably 35 ⁇ m or less.
- the gap 9 between the wirings 8 is, for example, 50 ⁇ m or more, preferably 80 ⁇ m or more, and for example, 3 mm or less, preferably 2 mm or less.
- the soft magnetic adhesive film 2 and the upper surface of the wiring 8 are brought into contact with each other.
- the soft magnetic adhesive film 2 is pressed against the wiring 8 while being heated under vacuum.
- the soft magnetic resin composition forming the soft magnetic adhesive film 2 flows, the wiring pattern 3 is buried in the soft magnetic resin composition, and voids in the soft magnetic adhesive film 2 are reduced and the density is increased. . That is, the surface and side surfaces of each wiring 8 constituting the wiring pattern 3 are covered with the soft magnetic resin composition.
- the surface of the substrate 4 exposed from the wiring pattern 3 is covered with the soft magnetic resin composition.
- the resin component is cured by heating.
- the pressure can be, for example, 10 kN / cm 2 or more, preferably at most 100 kN / cm 2 or more, and is, for example, 1000 kN / cm 2 or less, or preferably 500 kN / cm 2 or less.
- the heating temperature is, for example, 80 ° C. or higher, preferably 100 ° C. or higher, and for example, 200 ° C. or lower, preferably 175 ° C. or lower.
- the heating time is, for example, 0.1 hour or more, preferably 0.2 hours or more, and for example, 24 hours or less, preferably 3 hours or less, more preferably 2 hours or less.
- the degree of vacuum is, for example, 2000 Pa or less, preferably 1000 Pa or less, and more preferably 100 Pa or less.
- the soft magnetic film laminated circuit board 11 in which the soft magnetic film 10 is laminated on the circuit board 5 is obtained.
- the thus obtained soft magnetic film laminated circuit board 11 includes a circuit board 5 on which the wiring pattern 3 is formed and a soft magnetic film 10 on which the circuit board 5 is laminated.
- the soft magnetic film 10 is formed of soft magnetic particles 6, a cured resin component 7a obtained by heat curing, and a polyether phosphate, and is in a cured state (C stage state).
- the soft magnetic particles 6 are, for example, 60% by volume or more, preferably 65% by volume or more with respect to the soft magnetic film 10, and for example, 95% by volume or less, preferably , 90% by volume or less.
- the wiring pattern 3 is embedded in the soft magnetic film 10. That is, the surface and side surfaces of each wiring 8 constituting the wiring pattern 3 are covered with the soft magnetic film 10. At the same time, the surface of the substrate 4 exposed from the wiring pattern 3 is covered with the soft magnetic film 10.
- the soft magnetic particles 6, the cured resin component 7a, and the polyether phosphate are present between the separator 1 and the wiring 8 or the substrate 4 and in the gap 9 between the wirings 8, and the soft magnetic particles 6 is oriented so that its longitudinal direction (direction perpendicular to the thickness direction) is along the surface direction of the soft magnetic film 10 without aggregation.
- the circuit board 5 having the wiring pattern 3 formed only on one side is used.
- the circuit board having the wiring pattern 3 formed on one side and the other side is used. 5 can also be used.
- only one soft magnetic adhesive film 2 (one layer) is attached to the circuit board.
- a plurality of (multiple layers) adhesive films 2 can also be attached. In this case, for example, 2 to 20 layers, preferably 2 to 5 layers are attached.
- the B-stage soft magnetic adhesive film 2 is directly laminated (attached) to the circuit board 5.
- the B-stage soft magnetic adhesive film 2 is used. It is also possible to obtain a soft magnetic film 10 in a C stage state by heating and curing in advance, and then laminate the soft magnetic film 10 on the circuit board 5 through an adhesive layer.
- heating and curing The conditions for heating and curing (heating time, heating temperature) are the same as above.
- the adhesive layer a known one that is usually used as an adhesive layer of a circuit board is used. For example, by applying and drying an adhesive such as an epoxy adhesive, a polyimide adhesive, or an acrylic adhesive It is formed.
- the thickness of the adhesive layer is, for example, 10 to 100 ⁇ m.
- the position detection device includes, for example, a sensor board including the above-described soft magnetic film laminated circuit board 11 and a sensor unit mounted on the soft magnetic film laminated circuit board, and a position detection arranged on the sensor board. And a flat plate.
- Examples of the reflow process when mounting the sensor unit on the soft magnetic film laminated circuit board 11 include hot air reflow and infrared reflow. Moreover, any system of whole heating or local heating may be used.
- the heating temperature in the reflow process is, for example, 200 ° C. or more, preferably 240 ° C. or more, and for example, 300 ° C. or less, preferably 265 ° C. or less.
- the heating time is, for example, 1 second or more, preferably 5 seconds or more, more preferably 30 seconds or more, and for example, 2 minutes or less, preferably 1.5 minutes or less.
- a position detection device is manufactured by disposing a position detection flat plate opposite to the sensor substrate obtained as described above at an interval.
- the soft magnetic resin composition contains the flat soft magnetic particles 6, the resin component 7, and the polyether phosphate ester.
- the soft magnetic particle content is 60% by volume or more.
- the content ratio of the polyether phosphate ester relative to parts by mass is 0.1 to 5 parts by mass.
- the soft magnetic adhesive film 2 contained in the soft magnetic particles 6 at a high ratio can be easily manufactured. Further, the flat soft magnetic particles 6 in the soft magnetic adhesive film 2 can be oriented while being in a high proportion. Therefore, the magnetic properties of the obtained soft magnetic adhesive film 2 are excellent.
- the soft magnetic adhesive film 2 contains flat soft magnetic particles 6, a resin component 7, and a polyether phosphate, and the content of the soft magnetic particles 6 is 60% by volume or more. It is formed from a soft magnetic resin composition having a polyether phosphate ester content of 100 to 5 parts by mass of 0.1 to 5 parts by mass.
- the flat soft magnetic particles 6 are contained in a high ratio, and the flat soft magnetic particles 6 are oriented in the longitudinal direction without agglomeration. Therefore, it has high magnetic characteristics according to the content ratio of the soft magnetic particles.
- the position detection device since the soft magnetic film laminated circuit board 11 and the position detection device are manufactured using the soft magnetic adhesive film 2 having excellent magnetic characteristics, the position detection device has good performance and a more reliable position. Detection is possible.
- Example 1 Preparation of soft magnetic resin composition 500 parts by mass of soft magnetic particles (Fe—Si—Al alloy, flat, manufactured by Mate), polyether phosphate (Enomoto Kasei Co., Ltd.) so that the soft magnetic particles are 60% by volume with respect to the soft magnetic resin composition.
- soft magnetic particles Fe—Si—Al alloy, flat, manufactured by Mate
- polyether phosphate Enomoto Kasei Co., Ltd.
- ED152 acid value 17
- acrylate ester-based polymer having ethyl acrylate-methyl methacrylate as the main component (Negami Kogyo Co., Ltd., trade name “Paracron W-197CM”) 25 parts by mass, bisphenol A type epoxy resin (JER, Epicoat 1004) 13 parts by mass, bisphenol A type epoxy resin (JER, Epicoat YL980) 7 Parts by mass, 9 parts by mass of phenol aralkyl resin (Mirex XLC-4L, manufactured by Mitsui Chemicals), and 2,4-diamino-6- (2′-methyl) Dazolyl (1) ′) ethyl-s-triazine isocyanuric acid adduct (thermosetting catalyst, manufactured by Shikoku Kasei Co., Ltd., “2MAOK-PW”) 0.54 parts by mass (1.0 parts per 100 parts by mass of resin component)
- thermosetting catalyst manufactured by Shikoku Kasei Co., Ltd., “2
- This soft magnetic resin composition was dissolved in methyl ethyl ketone to prepare a soft magnetic resin composition solution having a solid content concentration of 43% by mass.
- This soft magnetic resin composition solution was applied onto a separator (average thickness: 50 ⁇ m) made of a polyethylene terephthalate film subjected to a silicone release treatment, and then dried at 130 ° C. for 2 minutes.
- Example 2 (Preparation of soft magnetic resin composition) 500 parts by mass of soft magnetic particles (same as above), polyether phosphate (“ED153” manufactured by Enomoto Kasei Co., Ltd., acid value 55, content 50% by mass, solvent, so that the soft magnetic particles are 65% by volume : Propylene glycol monomethyl ether) 5 parts by mass (1.0 part by mass with respect to 100 parts by mass of soft magnetic particles), acrylate-based polymer having ethyl acrylate-methyl methacrylate as a main component (same as above) 20 Parts by weight, 10 parts by weight of a bisphenol A type epoxy resin (manufactured by JER, Epicoat 1004), 6 parts by weight of a bisphenol A type epoxy resin (manufactured by JER, Epicoat YL980), 7 parts by weight of a phenol aralkyl resin (same as above), and 2,4-diamino-6- (2′-methylimidazolyl (1) ′) ethy
- This soft magnetic resin composition was dissolved in methyl ethyl ketone to prepare a soft magnetic resin composition solution having a solid content concentration of 43% by mass.
- Example 2 a soft magnetic adhesive film in which separators were laminated was manufactured.
- This soft magnetic adhesive film was in a semi-cured state. Further, when the surface state of the soft magnetic adhesive film was observed with an SEM, the flat soft magnetic particles were oriented so that the longitudinal direction thereof was along the surface direction of the soft magnetic adhesive film without causing unevenness due to aggregation.
- SEM surface state of the soft magnetic adhesive film
- Example 3 Preparation of soft magnetic resin composition 500 parts by mass of soft magnetic particles (same as above), 25 parts by mass of polyether phosphate (manufactured by Enomoto Kasei Co., Ltd., “ED154”, acid value 114) so that the soft magnetic particles become 70% by volume (soft magnetic particles 100 parts by mass, 5.0 parts by mass), 16 parts by mass of an acrylic ester polymer (same as above) having ethyl acrylate-methyl methacrylate as a main component, bisphenol A type epoxy resin (manufactured by JER, Epicoat 1004) 6 parts by mass, bisphenol A type epoxy resin (manufactured by JER, Epicoat YL980) 8 parts by mass, phenol aralkyl resin (same as above), 5 parts by mass, and 2,4-diamino-6- [2'- Methylimidazolyl- (1 ′)]-ethyl-s-triazine isocyanuric acid adduct (
- This soft magnetic resin composition was dissolved in methyl ethyl ketone to prepare a soft magnetic resin composition solution having a solid content concentration of 43% by mass.
- Example 2 a soft magnetic adhesive film in which separators were laminated was manufactured.
- This soft magnetic adhesive film was in a semi-cured state. Further, when the surface state of the soft magnetic adhesive film was observed with an SEM, the flat soft magnetic particles were oriented so that the longitudinal direction thereof was along the surface direction of the soft magnetic adhesive film without causing unevenness due to aggregation.
- SEM surface state of the soft magnetic adhesive film
- Comparative Example 1 A soft magnetic resin composition was obtained in the same manner as in Example 1 except that the polyether phosphate ester was not contained.
- a soft magnetic adhesive film was produced in the same manner as in Example 1 except that the obtained soft magnetic resin composition was used.
- Comparative Example 2 A soft magnetic resin composition was obtained in the same manner as in Example 2 except that the polyether phosphate ester was not contained.
- a soft magnetic adhesive film was produced in the same manner as in Example 1 except that the obtained soft magnetic resin composition was used.
- Comparative Example 3 A soft magnetic resin composition was obtained in the same manner as in Example 3 except that the polyether phosphate ester was not contained.
- a soft magnetic adhesive film was produced in the same manner as in Example 1 except that the obtained soft magnetic resin composition was used.
- Example 4 The soft magnetic resin composition was the same as in Example 2 except that 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent, “KBM503”) was contained instead of the polyether phosphate ester. I got a thing.
- 3-methacryloxypropyltrimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent, “KBM503”
- KBM503 silane coupling agent
- a soft magnetic adhesive film was produced in the same manner as in Example 1 except that the obtained soft magnetic resin composition was used.
- Example 3 was repeated except that 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent, “KBM303”) was contained instead of the polyether phosphate ester. Thus, a soft magnetic resin composition was obtained.
- 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd., silane coupling agent, “KBM303”
- KBM303 silane coupling agent
- a soft magnetic adhesive film was produced in the same manner as in Example 1 except that the obtained soft magnetic resin composition was used.
- Comparative Example 6 500 parts by mass of soft magnetic particles (same as above) and 2.5 parts by mass of polyether phosphate (“ED152”, acid value 17) manufactured by Enomoto Kasei Co., Ltd. so that the soft magnetic particles are 50% by volume.
- a soft magnetic resin composition was obtained in the same manner as in Example 1 except that 0.5 parts by mass (with respect to 100 parts by mass of soft magnetic particles) was added and the mixing ratio shown in Table 1 was used.
- a soft magnetic adhesive film was produced in the same manner as in Example 1 except that the obtained soft magnetic resin composition was used.
- Comparative Example 7 A soft magnetic resin composition was obtained in the same manner as Comparative Example 6 except that the polyether phosphate ester was not contained.
- a soft magnetic adhesive film was produced in the same manner as in Example 1 except that the obtained soft magnetic resin composition was used.
- the soft magnetic resin composition solution can be stably applied to the separator, and the surface of the produced soft magnetic adhesive film is not rough.
- the soft magnetic resin composition solution could be applied to the separator, but when the roughness of the manufactured soft magnetic adhesive film was confirmed as ⁇ , the soft magnetic resin composition
- the case where the physical solution could not be stably applied and could not be formed into a film was evaluated as x.
- Double-sided wiring pattern forming circuit board (total thickness 48 ⁇ m, wiring width 100 ⁇ m, spacing between wirings (pitch), a loop coil-like wiring pattern with a thickness of 15 ⁇ m formed on both sides of a flexible substrate (polyimide film, thickness 18 ⁇ m) Between 500 ⁇ m).
- the soft magnetic adhesive films of each Example and Comparative Example were laminated so that the surface of the soft magnetic thermosetting film was in contact with one side of the circuit board (the surface of the wiring pattern), and then this was heated to a vacuum hot press apparatus (Mikado Technos (Made by company).
- the soft magnetic thermosetting film was thermally cured by performing hot pressing under conditions of 1000 Pa under vacuum, a temperature of 175 ° C., and a pressure of 400 kN / cm 2 for 30 minutes.
- a soft magnetic film laminated circuit board was manufactured.
- the magnetic permeability of the soft magnetic film of the obtained soft magnetic film laminated circuit board was measured for the magnetic permeability ⁇ ′ at a frequency of 1 MHz by an one-turn method using an impedance analyzer (manufactured by Agilent, product number “4294A”). did.
- Epicoat 1004 trade name, bisphenol A type epoxy resin, epoxy equivalent of 875 to 975 g / eq, manufactured by JER ⁇ Epicoat YL980: trade name, bisphenol A type epoxy resin, epoxy equivalent 180-190 g / eq, manufactured by JER ⁇ Mirex XLC-4L: trade name, phenol aralkyl resin, hydroxyl group equivalent 170 g / eq, manufactured by Mitsui Chemicals ⁇ ED152: Product name “HIPLAAD ED152”, polyether phosphate ester, manufactured by Enomoto Kasei Co., Ltd., acid value 17 ED153: trade name “HIPLAAD ED153”, polyether phosphate ester, manufactured by Enomoto Kasei Co., Ltd., acid value 55, content 50% by mass, solvent: propylene glycol monomethyl ether ED154: trade name “HIPLAAD ED154”, polyether phosphorus Acid ester, manufactured by Enomoto Kasei Co., Ltd., acid
- the soft magnetic resin composition of this example contains a silane coupling agent, and is intended to improve the dispersibility by subjecting the soft magnetic particles to surface treatment (Comparative Examples 4 and 5). ) Also exhibited excellent moldability (film formability) and obtained a soft magnetic adhesive film or soft magnetic film having more excellent magnetic properties.
- the soft magnetic resin composition, soft magnetic adhesive film, soft magnetic film laminated circuit board, and position detection device of the present invention can be applied to various industrial products.
- the soft magnetic resin composition, the soft magnetic adhesive film, and the soft magnetic film laminated circuit board of the present invention can be used for a position detection device or the like, and the position detection device of the present invention is an input of a computer such as a digitizer. Can be used in the device.
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Abstract
Description
(軟磁性樹脂組成物の調製)
軟磁性樹脂組成物に対し軟磁性粒子が60体積%となるように、軟磁性粒子(Fe-Si-Al合金、扁平状、メイト社製)500質量部、ポリエーテルリン酸エステル(楠本化成社製、「ED152」、酸価17)2.5質量部(軟磁性粒子100質量部に対して、0.5質量部)、アクリル酸エチル-メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー(根上工業社製、商品名「パラクロンW-197CM」)25質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコート1004)13質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコートYL980)7質量部、フェノールアラルキル樹脂(三井化学社製、ミレックスXLC-4L)9質量部、および、2,4-ジアミノ-6-(2’-メチルイミダゾリル(1)’)エチル-s-トリアジン・イソシアヌール酸付加物(熱硬化触媒、四国化成社製、「2MAOK-PW」)0.54質量部(樹脂成分100質量部に対して1.0質量部)を混合することにより、軟磁性樹脂組成物(軟磁性熱硬化性樹脂組成物)を得た。
この軟磁性樹脂組成物をメチルエチルケトンに溶解させることにより、固形分濃度43質量%の軟磁性樹脂組成物溶液を調製した。
(軟磁性樹脂組成物の調製)
軟磁性粒子が65体積%となるように、軟磁性粒子(上記と同様)500質量部、ポリエーテルリン酸エステル(楠本化成社製、「ED153」、酸価55、含有量50質量%、溶剤:プロピレングリコールモノメチルエーテル)5質量部(軟磁性粒子100質量部に対して、1.0質量部)、アクリル酸エチル-メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー(上記と同様)20質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコート1004)10質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコートYL980)6質量部、フェノールアラルキル樹脂(上記と同様)7質量部、および、2,4-ジアミノ-6-(2’-メチルイミダゾリル(1)’)エチル-s-トリアジン・イソシアヌール酸付加物(熱硬化触媒、四国化成社製、「2MAOK-PW」)0.43質量部(樹脂成分100質量部に対して1.0質量部)を混合することにより、軟磁性樹脂組成物を得た。
この軟磁性樹脂組成物をメチルエチルケトンに溶解させることにより、固形分濃度43質量%の軟磁性樹脂組成物溶液を調製した。
(軟磁性樹脂組成物の調製)
軟磁性粒子が70体積%となるように、軟磁性粒子(上記と同様)500質量部、ポリエーテルリン酸エステル(楠本化成社製、「ED154」、酸価114)25質量部(軟磁性粒子100質量部に対して、5.0質量部)、アクリル酸エチル-メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー(上記と同様)16質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコート1004)6質量部、ビスフェノールA型エポキシ樹脂(JER社製、エピコートYL980)8質量部、フェノールアラルキル樹脂(上記と同様)5質量部、および、2,4-ジアミノ-6-[2´-メチルイミダゾリル-(1´)]-エチル-s-トリアジンイソシアヌル酸付加物(熱硬化触媒、四国化成社製、「2MAOK-PW」)0.35質量部(樹脂成分100質量部に対して1.0質量部)を混合することにより、軟磁性樹脂組成物を得た。
この軟磁性樹脂組成物をメチルエチルケトンに溶解させることにより、固形分濃度43質量%の軟磁性樹脂組成物溶液を調製した。
ポリエーテルリン酸エステルを含有しなかった以外は、実施例1と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルを含有しなかった以外は、実施例2と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルを含有しなかった以外は、実施例3と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルの代わりに、3-メタクリロキシプロピルトリメトキシシラン(信越化学社製、シランカップリング剤、「KBM503」)を含有した以外は、実施例2と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルの代わりに、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン(信越化学社製、シランカップリング剤、「KBM303」)を含有した以外は、実施例3と同様にして、軟磁性樹脂組成物を得た。
軟磁性粒子が50体積%となるように、軟磁性粒子(上記と同様)500質量部、および、ポリエーテルリン酸エステル(楠本化成社製、「ED152」、酸価17)2.5質量部(軟磁性粒子100質量部に対して、0.5質量部)を配合し、表1に記載の配合割合にした以外は、実施例1と同様にして、軟磁性樹脂組成物を得た。
ポリエーテルリン酸エステルを含有しなかった以外は、比較例6と同様にして、軟磁性樹脂組成物を得た。
・成形性(成膜性)
各実施例および比較例の軟磁性接着フィルムを製造する際に、軟磁性樹脂組成物溶液をセパレータに安定して塗布することができ、製造した軟磁性接着フィルムの表面に荒れが発生していなかった場合を○と評価し、軟磁性樹脂組成物溶液をセパレータに塗布することができたが、製造した軟磁性接着フィルムの表面に荒れが確認できた場合を△と評価し、軟磁性樹脂組成物溶液を安定して塗布することができず、フィルム状に形成することができなった場合を×と評価した。
(軟磁性フィルム積層回路基板の製造)
ループコイル状の厚み15μmの配線パターンが、可撓性基板(ポリイミドフィルム、厚み18μm)の両面に形成された両面配線パターン形成回路基板(合計厚み48μm、配線の幅100μm、配線間の間隔(ピッチ間)500μm)を用意した。
・Fe-Si-Al合金:商品名「SP-7」、軟磁性粒子、平均粒子径65μm、扁平状、メイト社製
・パラクロンW-197CM:商品名、アクリル酸エチル-メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー、根上工業社製
・エピコート1004:商品名、ビスフェノールA型エポキシ樹脂、エポキシ当量875~975g/eq、JER社製、
・エピコートYL980:商品名、ビスフェノールA型エポキシ樹脂、エポキシ当量180~190g/eq、JER社製
・ミレックスXLC-4L:商品名、フェノールアラルキル樹脂、水酸基当量170g/eq、三井化学社製
・ED152:商品名「HIPLAAD ED152」、ポリエーテルリン酸エステル、楠本化成社製、酸価17
・ED153:商品名「HIPLAAD ED153」、ポリエーテルリン酸エステル、楠本化成社製、酸価55、含有量50質量%、溶剤:プロピレングリコールモノメチルエーテル
・ED154:商品名「HIPLAAD ED154」、ポリエーテルリン酸エステル、楠本化成社製、酸価114
・KBM503:商品名、3-メタクリロキシプロピルトリメトキシシラン、信越化学社製、シランカップリング剤
・KBM303:商品名、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、信越化学社製、シランカップリング剤
・2MAOK-PW:商品名、2,4-ジアミノ-6-[2’-メチルイミダゾリル-(1’)]-エチル-s-トリアジンイソシアヌル酸付加物、四国化成社製
(考察)
表1から明らかなように、本実施例のポリエーテルリン酸エステルを含有する軟磁性樹脂組成物を用いれば、ポリエーテルリン酸エステルを含有しない軟磁性樹脂組成物(比較例1)よりも、優れた成形性(成膜性)を発揮し、また、より優れた磁気特性を備える軟磁性接着フィルムや軟磁性フィルムを得ることができた。
5 回路基板
6 軟磁性粒子
7 樹脂成分
10 軟磁性フィルム
11 軟磁性フィルム積層回路基板
Claims (7)
- 扁平状の軟磁性粒子、樹脂成分およびポリエーテルリン酸エステルを含有し、
前記軟磁性粒子の含有割合が、60体積%以上であり、
前記軟磁性粒子100質量部に対する前記ポリエーテルリン酸エステルの含有割合が、0.1~5質量部であることを特徴とする、軟磁性樹脂組成物。 - 前記ポリエーテルリン酸エステルの酸価が、10以上であることを特徴とする、請求項1に記載の軟磁性樹脂組成物。
- 前記樹脂成分が、アクリル樹脂、エポキシ樹脂およびフェノール樹脂を含有することを特徴とする、請求項1に記載の軟磁性樹脂組成物。
- 前記軟磁性粒子が、センダストであることを特徴とする、請求項1に記載の軟磁性樹脂組成物。
- 扁平状の軟磁性粒子、樹脂成分およびポリエーテルリン酸エステルを含有し、前記軟磁性粒子の含有割合が、60体積%以上であり、前記軟磁性粒子100質量部に対する前記ポリエーテルリン酸エステルの含有割合が、0.1~5質量部である軟磁性樹脂組成物から形成されることを特徴とする、軟磁性接着フィルム。
- 扁平状の軟磁性粒子、樹脂成分およびポリエーテルリン酸エステルを含有し、前記軟磁性粒子の含有割合が、60体積%以上であり、前記軟磁性粒子100質量部に対する前記ポリエーテルリン酸エステルの含有割合が、0.1~5質量部である軟磁性樹脂組成物から形成される軟磁性接着フィルムを、回路基板に積層することにより得られることを特徴とする、軟磁性フィルム積層回路基板。
- 扁平状の軟磁性粒子、樹脂成分およびポリエーテルリン酸エステルを含有し、前記軟磁性粒子の含有割合が、60体積%以上であり、前記軟磁性粒子100質量部に対する前記ポリエーテルリン酸エステルの含有割合が、0.1~5質量部である軟磁性樹脂組成物から形成される軟磁性接着フィルムを、回路基板に積層することにより得られる軟磁性フィルム積層回路基板を備えることを特徴とする、位置検出装置。
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EP3007187B1 (en) | 2021-01-06 |
JP2015008263A (ja) | 2015-01-15 |
TW201513142A (zh) | 2015-04-01 |
CN105247632A (zh) | 2016-01-13 |
EP3007187A1 (en) | 2016-04-13 |
KR20160013024A (ko) | 2016-02-03 |
CN105247632B (zh) | 2018-06-15 |
EP3007187A4 (en) | 2017-03-22 |
KR102281408B1 (ko) | 2021-07-23 |
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US20160172086A1 (en) | 2016-06-16 |
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