WO2016088849A1 - 軟磁性樹脂組成物および軟磁性フィルム - Google Patents
軟磁性樹脂組成物および軟磁性フィルム Download PDFInfo
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- WO2016088849A1 WO2016088849A1 PCT/JP2015/084050 JP2015084050W WO2016088849A1 WO 2016088849 A1 WO2016088849 A1 WO 2016088849A1 JP 2015084050 W JP2015084050 W JP 2015084050W WO 2016088849 A1 WO2016088849 A1 WO 2016088849A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/08—Cores, Yokes, or armatures made from powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- the present invention relates to a soft magnetic resin composition and a soft magnetic film obtained therefrom.
- a soft magnetic film that converges magnetic flux is arranged around an antenna or a coil provided in the electronic device in order to increase the wireless communication distance, increase the efficiency, and reduce the size (for example, a patent) Reference 1).
- Patent Document 1 discloses a flexible magnetic film formed by blending a flat soft magnetic powder and a binder.
- Patent Document 2 a method of increasing the content ratio of soft magnetic particles in the magnetic film (high filling) is known (for example, see Patent Document 2).
- Patent Document 2 discloses an electromagnetic interference suppressor configured by dispersing soft magnetic powder that has been surface-treated using a surface treatment agent containing Si element in a binder.
- An object of the present invention is to provide a soft magnetic resin composition excellent in magnetic properties and capable of suppressing the generation of voids, and a soft magnetic film obtained therefrom.
- the present invention [1] contains flat soft magnetic particles and a resin component containing an epoxy resin, a phenol resin and an acrylic resin, and the epoxy resin is composed only of an epoxy resin having three or more functional groups.
- the phenol resin is composed of only a phenol resin having three or more functional groups, and the content ratio of the acrylic resin in the resin component is 25% by mass or more.
- the total content of the epoxy resin and the phenol resin is 20 parts by mass or more and 99 parts by mass or less with respect to 100 parts by mass of the soft magnetic particle exclusion component excluding the soft magnetic particles [1].
- the soft magnetic resin composition described in 1. is included.
- the epoxy equivalent of the epoxy resin is 230 g / eq.
- the hydroxyl group equivalent of the phenol resin is 230 g / eq.
- the soft magnetic resin composition described in [1] or [2] below is included.
- the epoxy resin having three or more functional groups is a trishydroxyphenylmethane type epoxy resin
- the phenol resin having three or more functional groups is a phenol novolac resin [1].
- the soft magnetic resin composition according to any one of [3] to [3].
- the epoxy resin having three or more functional groups is a cresol novolac type epoxy resin
- the phenol resin having three or more functional groups is a phenol biphenylene resin.
- the soft magnetic resin composition according to any one of [3] is included.
- the present invention includes the soft magnetic resin composition according to any one of [1] to [5], wherein the content of the soft magnetic particles is 40% by volume or more.
- the present invention [7] includes a soft magnetic film obtained by heat-curing the soft magnetic resin composition according to any one of [1] to [6].
- the soft magnetic film of the present invention obtained from the soft magnetic resin composition of the present invention is excellent in magnetic properties. Moreover, generation
- FIG. 1 shows a cross-sectional view of a soft magnetic multilayer circuit board provided with an embodiment of the soft magnetic film of the present invention.
- the soft magnetic resin composition of the present invention contains flat soft magnetic particles and a resin component.
- the soft magnetic material constituting the soft magnetic particles examples include magnetic stainless steel (Fe—Cr—Al—Si alloy), sendust (Fe—Si—A1 alloy), permalloy (Fe—Ni alloy), silicon copper (Fe— Cu-Si alloy), Fe-Si alloy, Fe-Si-B (-Cu-Nb) alloy, Fe-Si-Cr-Ni alloy, Fe-Si-Cr alloy, Fe-Si-Al-Ni-Cr alloy And ferrite.
- Sendust Fe—Si—Al alloy
- the soft magnetic particles for example, materials such as soft magnetic particles for low frequencies and soft magnetic particles for high frequencies can be selected according to the frequency.
- the soft magnetic particles for low frequencies have high magnetic flux convergence and low magnetic flux loss at a frequency of less than 2 MHz (particularly 1 MHz) (that is, the complex permeability real part ⁇ ′ is high and the complex permeability imaginary part ⁇ ′′ is low).
- Soft magnetic particles examples include soft magnetic particles having a coercive force in the easy magnetization direction of less than 3 (Oe).
- the high-frequency soft magnetic particles are, for example, soft magnetic particles having a particularly low magnetic flux loss (that is, a low complex permeability imaginary part ⁇ ′′) at a frequency of 2 MHz or higher (particularly 10 MHz).
- high-frequency soft magnetic particles include soft magnetic particles having a coercive force of 3 (Oe) or more in the easy magnetization direction.
- Soft magnetic particles have a flat shape (plate shape), that is, are formed in a shape with a small thickness and a wide surface.
- the flatness (flatness) of the soft magnetic particles is, for example, 8 or more, preferably 15 or more, and for example, 500 or less, preferably 450 or less.
- the flatness is calculated, for example, as an aspect ratio obtained by dividing the average particle diameter (average length) of the soft magnetic particles by the average thickness of the soft magnetic particles.
- the average particle diameter (average length) of the soft magnetic particles is, for example, 3.5 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 200 ⁇ m or less, preferably 150 ⁇ m or less.
- the average thickness is, for example, 0.1 ⁇ m or more, preferably 0.2 ⁇ m or more, and for example, 3.0 ⁇ m or less, preferably 2.5 ⁇ m or less.
- the specific gravity of the soft magnetic particles is, for example, 5.0 or more and 8.5 or less.
- the mass ratio of the soft magnetic particles in the soft magnetic resin composition is, for example, 80% by mass or more, preferably 83% by mass or more, more preferably 85% by mass or more in terms of solid content. 98 mass% or less, preferably 95 mass% or less, more preferably 90 mass% or less.
- the volume ratio of the soft magnetic particles in the soft magnetic resin composition is, for example, 40% by volume or more, preferably 45% by volume or more, more preferably 48% by volume or more, and still more preferably 60% in terms of solid content. For example, it is 90% by volume or less, preferably 85% by volume or less, and more preferably 80% by volume or less.
- the volume ratio of each component such as soft magnetic particles is calculated based on the theoretical volume obtained by dividing the mass of each component by the specific gravity of the component.
- the specific gravity of each component is obtained by a catalog value or a known measurement method (for example, a specific gravity measurement method described later).
- Resin component contains epoxy resin, phenol resin and acrylic resin.
- the epoxy resin is a thermosetting resin and is an epoxy resin (polyfunctional epoxy resin) having three or more functional groups in the molecule.
- the functional group is preferably a glycidyl group.
- polyfunctional epoxy resin examples include phenol novolac type epoxy resin, cresol novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylolethane type epoxy resin and the like. These can be used alone or in combination of two or more.
- cresol novolac type epoxy resin and a trishydroxyphenylmethane type epoxy resin are used.
- cresol novolac type epoxy resin examples include compounds represented by the following general formula (1), and specific examples of the trishydroxyphenylmethane type epoxy resin are represented by the following general formula (2). Compound etc. are mentioned.
- n shows the polymerization degree of a monomer each independently.
- the epoxy equivalent of the epoxy resin is, for example, 230 g / eq.
- the viscosity (150 ° C.) of the epoxy resin is, for example, 1.0 Pa ⁇ s or less, preferably 0.2 Pa ⁇ s or less, and 0.01 Pa ⁇ s or more. Viscosity is measured with an ICI viscometer.
- the specific gravity of the epoxy resin is, for example, 1.0 or more and 1.5 or less.
- the epoxy resin consists only of an epoxy resin having three or more functional groups.
- the epoxy resin in the resin component does not substantially contain an epoxy resin having two functional groups.
- “Substantially free of bifunctional epoxy resin” means that the content of the epoxy resin having two functional groups in the total epoxy resin is, for example, 1.0% by weight or less, preferably 0.5% by mass. Hereinafter, it is more preferably 0% by mass.
- the phenol resin is a thermosetting resin that serves as a curing agent for the epoxy resin, and is a phenol resin (polyfunctional phenol resin) having three or more functional groups in the molecule.
- the functional group is preferably a hydroxyl group.
- polyfunctional phenol resin examples include phenol novolac resin, cresol novolac resin, phenol aralkyl resin, phenol biphenylene resin, dicyclopentadiene type phenol resin, and resole resin. These can be used alone or in combination of two or more.
- Preferable examples include phenol novolac resin and phenol biphenylene resin.
- phenol novolac resin examples include compounds represented by the following general formula (3)
- specific examples of the phenol biphenylene resin include compounds represented by the following general formula (4).
- n shows the polymerization degree of a monomer each independently.
- the hydroxyl group equivalent of the phenol resin is, for example, 230 g / eq.
- the viscosity (150 ° C.) of the phenol resin is, for example, 0.10 Pa ⁇ s or less, preferably 0.04 Pa ⁇ s or less, and 0.01 Pa ⁇ s or more.
- the specific gravity of the phenol resin is, for example, 1.0 or more and 1.5 or less.
- the phenol resin consists only of a phenol resin having three or more functional groups.
- the phenol resin in the resin component does not substantially contain a phenol resin having two functional groups.
- “Substantially free of bifunctional phenolic resin” means that the content of phenolic resin having two functional groups in the total phenolic resin is, for example, 1.0% by weight or less, preferably 0.5% by mass. Hereinafter, it is more preferably 0% by mass.
- the combination of the epoxy resin and the phenol resin is preferably (1) a combination of a trishydroxyphenylmethane type epoxy resin and a phenol novolac resin, and (2) a cresol novolac type epoxy resin from the viewpoint of air gap suppression and magnetic properties. And a combination of phenol biphenylene resins. More preferably, the combination of (1) is mentioned.
- the soft magnetic resin composition of the present invention contains a polyfunctional epoxy resin and a polyfunctional phenol resin as a curable resin. Therefore, the polyfunctional epoxy resin and the polyfunctional phenol resin can be cross-linked with each other at a high density, thereby forming a high-strength cured resin. Therefore, when a soft magnetic resin composition containing a high proportion of soft magnetic particles is compressed to produce a soft magnetic film with a high filling rate, the repulsive force between soft magnetic particles and the occurrence of cracks in the cured resin due to resin elasticity As a result, generation
- the soft magnetic resin composition of this invention consists only of polyfunctional epoxy resin and polyfunctional phenol resin as curable resin. That is, it does not contain a bifunctional epoxy resin or a bifunctional phenol resin. Therefore, it does not contain a resin region that is crosslinked at a low density (that is, a fragile resin region). Therefore, the present invention can form a uniform and strong cured resin. For this reason, the use of the soft magnetic resin composition of the present invention can suppress the generation of microscopic (1 to 1000 ⁇ m) small voids.
- an acrylic resin for example, an acrylic polymer obtained by polymerizing one or two or more (meth) acrylic acid alkyl esters having a linear or branched alkyl group as a monomer component, and the like are polymerized.
- (meth) acryl means “acryl and / or methacryl”.
- alkyl group examples include methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, isobutyl, amyl, isoamyl, hexyl, heptyl, cyclohexyl, 2- Alkyl having 1 to 20 carbon atoms such as ethylhexyl group, octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, lauryl group, tridecyl group, tetradecyl group, stearyl group, octadecyl group, dodecyl group Groups.
- an alkyl group having 1 to 6 carbon atoms is used.
- the acrylic polymer may be a copolymer of (meth) acrylic acid alkyl ester and other monomers.
- Examples of other monomers include glycidyl group-containing monomers such as glycidyl acrylate and glycidyl methacrylate, such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.
- glycidyl group-containing monomers such as glycidyl acrylate and glycidyl methacrylate, such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.
- acid anhydride monomers such as maleic anhydride, itaconic anhydride, such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate or (4-hydride) Hydroxyl group-containing monomers such as xymethylcyclohexyl) -methyl acrylate, such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meta ) Acrylate, sulfonic acid group-containing monomer such as (
- the acrylic resin preferably has at least one group of a carboxy group and a hydroxyl group. More preferably, a carboxy group and a hydroxyl group are used in combination. As a result, the generation of voids can be more reliably suppressed and the magnetic characteristics can be improved.
- the weight average molecular weight of the acrylic resin is, for example, 1 ⁇ 10 5 or more, preferably 3 ⁇ 10 5 or more, and for example, 1 ⁇ 10 6 or less.
- a weight average molecular weight is measured based on a standard polystyrene conversion value by gel permeation chromatography (GPC).
- the specific gravity of the acrylic resin is, for example, 0.6 or more and 1.2 or less.
- the resin component may contain other resins other than the epoxy resin, the phenol resin, and the acrylic resin, but preferably includes only the epoxy resin, the phenol resin, and the acrylic resin.
- the mass ratio of the resin component in the soft magnetic resin composition is, for example, 2% by mass or more, preferably 5% by mass or more, more preferably 10% by mass or more in terms of solid content, and for example, 20% by mass. % Or less, preferably 17% by mass or less, and more preferably 15% by mass or less.
- the volume ratio of the resin component in the soft magnetic resin composition is, for example, 10% by volume or more, preferably 15% by volume or more, more preferably 20% by volume or more in terms of solid content. 60 volume% or less, Preferably, it is 55 volume% or less, More preferably, it is 52 volume% or less, More preferably, it is 40 volume% or less. When the content ratio of the resin component is within the above range, the soft magnetic film is excellent in film formability and magnetic characteristics.
- the total content of the epoxy resin and the phenol resin is, for example, 20 parts by mass or more with respect to 100 parts by mass of the soft magnetic particle exclusion component obtained by removing the soft magnetic particles from the soft magnetic thermosetting composition.
- it is 30 parts by mass or more, more preferably 40 parts by mass or more, and for example, 99 parts by mass or less, preferably 90 parts by mass or less, more preferably 80 parts by mass or less, still more preferably, It is 60 mass parts or less.
- the spring back can be suppressed while the soft magnetic film contains soft magnetic particles at a high ratio.
- the soft magnetic particle exclusion component is a component (solid content) composed of a resin component, a thermosetting catalyst and an additive (described later) that is added as necessary, and includes soft magnetic particles and a solvent. Is not included. *
- the mass ratio of the epoxy resin in the resin component is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 25% by mass or more, and for example, 50% by mass or less, preferably 40% by mass. % Or less, more preferably 35% by mass or less.
- the volume ratio of the epoxy resin in the resin component is, for example, 5% by volume or more, preferably 10% by volume or more, more preferably 25% by volume or more, and for example, 50% by volume or less, preferably It is 40 volume% or less, More preferably, it is 35 volume% or less.
- the mass ratio of the phenol resin in the resin component is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 25% by mass or more, and for example, 50% by mass or less, preferably 40% by mass. % Or less, more preferably 35% by mass or less.
- the volume ratio of the phenol resin in the resin component is, for example, 5% by volume or more, preferably 10% by volume or more, more preferably 25% by volume or more, and for example, 50% by volume or less, preferably It is 40 volume% or less, More preferably, it is 35 volume% or less.
- the mass ratio of the acrylic resin in the resin component is 25% by mass or more.
- the amount is preferably 30% by mass or more, more preferably 35% by mass or more, and for example, 80% by mass or less, preferably 70% by mass or less, and more preferably 60% by mass or less.
- the volume ratio of the acrylic resin in the resin component is, for example, 25% by volume or more, preferably 30% by volume or more, more preferably 35% by volume or more, and for example, 80% by volume or less, preferably 70% by volume. % Or less, more preferably 60% by volume or less.
- the soft magnetic resin composition preferably contains a thermosetting catalyst.
- thermosetting catalyst is not limited as long as it is a catalyst that promotes curing of the resin component by heating, and examples thereof include imidazole compounds, triphenylphosphine compounds, triphenylborane compounds, amino group-containing compounds, and the like. It is done. Preferably, an imidazole compound is used.
- imidazole compounds examples include 2-phenylimidazole (trade name; 2PZ), 2-ethyl-4-methylimidazole (trade name; 2E4MZ), 2-methylimidazole (trade name; 2MZ), and 2-undecylimidazole.
- (Trade name; C11Z) 2-phenyl-1H-imidazole 4,5-dimethanol (trade name; 2PHZ-PW), 2,4-diamino-6- (2′-methylimidazolyl (1) ′) ethyl-
- Examples include s-triazine / isocyanuric acid adduct (trade name: 2MAOK-PW) (all trade names are manufactured by Shikoku Kasei Co., Ltd.).
- the specific gravity of the thermosetting catalyst is, for example, 0.9 or more and 1.5 or less.
- the mass ratio of the thermosetting catalyst is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and for example, 5 parts by mass or less, preferably 100 parts by mass of the resin component. 3 parts by mass or less.
- the soft magnetic resin composition preferably contains a dispersant.
- the soft magnetic particles can be more uniformly dispersed in the soft magnetic film.
- the dispersant is preferably a polyether phosphate ester from the viewpoint of dispersibility and magnetic properties.
- polyether phosphate esters include HIPLAAD series (“ED-152”, “ED-153”, “ED-154”, “ED-118”, “ED-174”, “ED-174”, “ ED-251 ”) and the like.
- the acid value of the polyether phosphate ester is, for example, 10 or more, preferably 15 or more, and for example, 200 or less, preferably 150 or less.
- the acid value is measured by a neutralization titration method or the like.
- the specific gravity of the dispersant is, for example, 0.8 or more and 1.2 or less.
- the mass ratio of the dispersing agent is 0.1 parts by mass or more, preferably 0.3 parts by mass or more with respect to 100 parts by mass of the resin component. Moreover, it is 5 mass parts or less, Preferably, it is 3 mass parts or less.
- the soft magnetic resin composition can also contain a rheology control agent.
- the soft magnetic particles can be more uniformly dispersed in the soft magnetic film.
- a rheology control agent is a compound that imparts a thixotropic property to a soft magnetic resin composition that exhibits high viscosity when the shearing force (shear rate) is low and low viscosity when the shearing force (shear rate) is high. is there.
- rheology control agent examples include organic rheology control agents and inorganic rheology control agents.
- organic rheology control agent is used.
- organic rheology control agent examples include modified urea, urea-modified polyamide, fatty acid amide, polyurethane, and polymer urea derivative.
- Preferred examples include modified urea, urea-modified polyamide, and fatty acid amide, and more preferable examples include urea-modified polyamide.
- Examples of the inorganic rheology control agent include silica, calcium carbonate, smectite and the like.
- rheology control agent examples include, for example, “BYK-410”, “BYK-430”, “BYK-431” manufactured by BYK Chemie, for example, “Disparon PFA-131” manufactured by Enomoto Kasei Co., Ltd. Aerosil's “Aerosil VP NK200”, “Aerosil R976S”, “Aerosil COK84” and the like.
- the specific gravity of the rheology control agent is, for example, 0.6 or more and 1.0 or less.
- the mass ratio of the rheology control agent is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and for example, 10 parts by mass or less, preferably 100 parts by mass of the resin component. 5 parts by mass or less.
- the soft magnetic resin composition may further contain other additives as necessary.
- additives include commercially available or known additives such as a crosslinking agent and an inorganic filler.
- the soft magnetic resin composition is prepared by mixing the above components in the above proportions.
- the soft magnetic film is formed from a soft magnetic resin composition into a film shape (sheet shape), and is preferably obtained by heat-curing the soft magnetic resin composition into a film shape.
- the soft magnetic film is prepared by, for example, preparing a soft magnetic resin composition solution by dissolving or dispersing the soft magnetic resin composition in a solvent. Manufacturing by a drying step of obtaining a semi-cured soft magnetic thermosetting film by applying to the surface and drying, and a hot pressing step of laminating a plurality of soft magnetic thermosetting films and hot pressing Can do.
- the soft magnetic resin composition is dissolved or dispersed in a solvent (preparation step). Thereby, a soft magnetic resin composition solution is prepared.
- the solvent examples include ketones such as acetone and methyl ethyl ketone (MEK), esters such as ethyl acetate, ethers such as propylene glycol monomethyl ether, amides such as N, N-dimethylformamide, and the like.
- MEK methyl ethyl ketone
- esters such as ethyl acetate
- ethers such as propylene glycol monomethyl ether
- amides such as N, N-dimethylformamide, and the like.
- An organic solvent etc. are mentioned.
- the solvent also include aqueous solvents such as water, for example, alcohols such as methanol, ethanol, propanol, and isopropanol.
- the solid content in the soft magnetic resin composition solution is, for example, 10% by mass or more, preferably 30% by mass or more, and for example, 90% by mass or less, preferably 70% by mass or less.
- the soft magnetic resin composition solution is applied to the surface of a release substrate (separator, core material, etc.) and dried (drying step).
- Application method is not particularly limited, and examples thereof include a doctor blade method, roll coating, screen coating, and gravure coating.
- the drying temperature is, for example, 70 ° C. or more and 160 ° C. or less
- the drying time is, for example, 1 minute or more and 5 minutes or less.
- separator examples include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, and paper. These are subjected to mold release treatment on the surface with, for example, a fluorine release agent, a long-chain alkyl acrylate release agent, a silicone release agent, or the like.
- PET polyethylene terephthalate
- a fluorine release agent for example, a fluorine release agent, a long-chain alkyl acrylate release agent, a silicone release agent, or the like.
- the core material examples include plastic films (eg, polyimide film, polyester film, polyethylene terephthalate film, polyethylene naphthalate film, polycarbonate film, etc.), metal films (eg, aluminum foil, etc.), such as glass fiber and plastic Examples include resin substrates reinforced with woven fibers, silicone substrates, glass substrates, and the like.
- plastic films eg, polyimide film, polyester film, polyethylene terephthalate film, polyethylene naphthalate film, polycarbonate film, etc.
- metal films eg, aluminum foil, etc.
- glass fiber and plastic examples include resin substrates reinforced with woven fibers, silicone substrates, glass substrates, and the like.
- the average thickness of the separator or core material is, for example, 1 ⁇ m or more and 500 ⁇ m or less.
- the average thickness of the soft magnetic thermosetting film is, for example, 5 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 500 ⁇ m or less, preferably 250 ⁇ m or less.
- the soft magnetic thermosetting films are prepared, and the plurality of soft magnetic thermosetting films are hot-pressed in the thickness direction by hot pressing (hot pressing step).
- the semi-cured soft magnetic thermosetting film is cured by heating.
- the soft magnetic film can be filled with soft magnetic particles at a high ratio to improve the magnetic properties.
- the hot press can be performed using a known press machine, for example, a parallel plate press machine.
- the number of laminated soft magnetic thermosetting films is, for example, 2 layers or more, and for example, 20 layers or less, preferably 5 layers or less. Thereby, it can adjust to the soft-magnetic film of desired thickness.
- the heating temperature is, for example, 80 ° C. or more, preferably 100 ° C. or more, and for example, 250 ° C. or less, preferably 200 ° C. or less.
- the heating time is, for example, 1 minute or more, preferably 2 minutes or more, and for example, 24 hours or less, preferably 2 hours or less.
- the pressure is, for example, 0.01 MPa or more, preferably 0.1 MPa or more, and for example, 200 MPa or less, preferably 100 MPa or less.
- the soft magnetic thermosetting film is cured by heating to obtain a soft magnetic film in a cured state (C stage state).
- the average thickness of the soft magnetic film is, for example, 5 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 500 ⁇ m or less, preferably 250 ⁇ m or less.
- the actual specific gravity of the soft magnetic film is, for example, 3.00 or more, preferably 3.50 or more, and, for example, 6.00 or less.
- the actual specific gravity (actual specific gravity / theoretical specific gravity) with respect to the theoretical specific gravity of the soft magnetic film is, for example, 0.93 or more, preferably 0.95 or more, and, for example, 1.00 or less.
- Actual specific gravity (SG) is measured by, for example, a specific gravity measurement method. That is, the weight W1 (g) of the soft magnetic film in air and the weight (g) of the soft magnetic film W2 in water are measured and calculated by the following formula.
- Actual specific gravity (SG) W1 / (W1-W2) Specifically, it can be measured using an electronic hydrometer (manufactured by Alpha Mirage, “MDS-300”).
- the theoretical specific gravity is, for example, a solid component (soft magnetic particles, resin component, thermosetting catalyst added as necessary, dispersant, rheology control agent, and others included in the soft magnetic resin composition forming the soft magnetic film. And the like) are obtained by multiplying the specific gravity of each solid component by the blending ratio (weight) of each solid component and adding them together.
- the catalog value etc. can be referred for the specific gravity (for example, soft magnetic particle) of each solid content component.
- the theoretical specific gravity of the soft magnetic film is that in the soft magnetic film consisting of only the soft magnetic particles and the resin component. The theoretical specific gravity can be substituted.
- the complex permeability real part ⁇ ′ at 1 MHz is, for example, 60 or more, preferably 70 or more, more preferably 80 or more, and for example, 500 or less.
- the complex permeability real part ⁇ ′ at 1 MHz is more preferably 150 or more, and particularly preferably 170 or more.
- the complex permeability imaginary part ⁇ ′′ at 1 MHz is, for example, 20 or less, preferably 10 or less.
- the complex permeability real part ⁇ ′ at 10 MHz is, for example, 60 or more, preferably 70 or more, more preferably 80 or more, and, for example, 500 or less.
- the complex permeability imaginary part ⁇ ′′ at 10 MHz is, for example, 100 or less, preferably 50 or less.
- the complex permeability imaginary part ⁇ ′′ at 10 MHz is more preferably 20 or less, further preferably 10 or less, and particularly preferably 5 It is as follows.
- the relative permeability (complex permeability real part ⁇ ′ and complex permeability imaginary part ⁇ ′′) of the soft magnetic film is measured by an impedance analyzer (manufactured by Agilent, “4294A”) by a one-turn method. .
- the soft magnetic film preferably has flat soft magnetic particles contained in the soft magnetic film arranged in the two-dimensional in-plane direction of the soft magnetic film. That is, the flat soft magnetic particles are oriented so that the longitudinal direction (direction perpendicular to the thickness direction) is along the surface direction of the soft magnetic film. As a result, the soft magnetic film is filled with soft magnetic particles at a high ratio and has excellent magnetic properties. In addition, thinning of the soft magnetic film has been attempted.
- This soft magnetic film has, for example, a single layer structure composed of only a single layer of a soft magnetic film, a multilayer structure in which a soft magnetic film is laminated on one or both sides of a core material, and a separator is laminated on one or both sides of a soft magnetic film.
- a multi-layer structure can be used.
- a plurality of soft magnetic thermosetting films are laminated and hot pressed.
- one soft magnetic thermosetting film may be hot pressed. .
- the soft magnetic film obtained by using the soft magnetic resin composition of the present invention the generation of voids inside the soft magnetic film is suppressed while containing the soft magnetic particles in a high content ratio. Therefore, even after the reflow process, peeling of the soft magnetic film and poor appearance due to expansion of the gap can be suppressed.
- this soft magnetic film has good film formability and can improve the orientation of the soft magnetic particles. Therefore, an excellent relative magnetic permeability (complex magnetic permeability real part ⁇ ′) can be exhibited.
- the soft magnetic film can be suitably used as, for example, an antenna, a coil, or a soft magnetic film for laminating on a circuit board on which these are formed.
- the soft magnetic film includes a circuit board 2, an adhesive layer 3 disposed on a lower surface (one surface) of the circuit board 2, and a lower surface of the adhesive layer 3. It can be used as a soft magnetic film laminated substrate 1 provided with the soft magnetic film 4 arrange
- the circuit board 2 is, for example, a circuit board 2 used in an electromagnetic induction system, and a wiring pattern 6 such as a loop coil is formed on the upper surface (one surface) of the substrate 5.
- the wiring pattern 6 is formed by a semi-additive method or a subtractive method.
- Examples of the insulating material constituting the substrate 5 include a glass epoxy substrate, a glass substrate, a PET substrate, a Teflon substrate, a ceramic substrate, and a polyimide substrate.
- the adhesive layer 3 a known one that is usually used as an adhesive for the circuit board 2 is used.
- an adhesive such as an epoxy adhesive, a polyimide adhesive, or an acrylic adhesive is applied and dried. It is formed by.
- the thickness of the adhesive layer 3 is, for example, 10 to 100 ⁇ m.
- the soft magnetic film 4 is the above-described soft magnetic film, and flat soft magnetic particles 7 are dispersed in a soft magnetic resin composition (specifically, a cured resin 8 in which a resin component is cured).
- a soft magnetic resin composition specifically, a cured resin 8 in which a resin component is cured.
- the soft magnetic particles 7 are oriented so that the longitudinal direction (the direction perpendicular to the thickness direction) is along the surface direction of the soft magnetic film 4.
- Such a soft magnetic film laminated substrate 1 can be used for low frequency applications such as a smartphone, a personal computer, and a position detection device. It can also be used for high frequency applications such as a coil module for wireless communication or wireless power transmission using a high frequency band of 13.56 MHz or 6.78 MHz.
- the adhesive layer 3 is provided between the circuit board 2 and the soft magnetic film 4.
- the soft magnetic film 4 is in direct contact with the circuit board 2. It can also be provided.
- a soft magnetic thermosetting film in a semi-cured state is directly attached to the circuit board 2, and then the soft magnetic thermosetting film is cured by heating.
- the soft magnetic film laminated substrate 1 since the soft magnetic film 4 is provided, the space
- Example 1 88.5 parts by mass of Fe—Si—Al alloy and 3.0 mass of cresol novolac epoxy resin in terms of solid content so that the volume ratio of the soft magnetic particles to the soft magnetic resin composition is 55.0% by volume. Parts, phenol biphenylene resin 3.0 parts by mass, acrylic resin 5.1 parts by mass, thermosetting catalyst 0.1 parts by mass, dispersant 0.1 parts by mass, and rheology control agent 0.2 parts by mass. Thus, the soft magnetic resin composition of Example 1 was obtained.
- This soft magnetic resin composition was dissolved in methyl ethyl ketone to prepare a soft magnetic resin composition solution having a solid content of 45% by mass.
- This soft magnetic resin composition solution was applied on a separator (polyethylene terephthalate film subjected to silicone release treatment) and then dried at 110 ° C. for 2 minutes. As a result, a semi-cured soft magnetic thermosetting film (average thickness 45 ⁇ m) was produced.
- Examples 2 to 3 Soft magnetic resin compositions of Examples 2 to 3 were obtained with the materials and blending ratios shown in Table 1. Soft magnetic films of Examples 2 to 3 (average thickness 150 ⁇ m) were produced in the same manner as in Example 1 except that the soft magnetic resin composition of each Example was used.
- Examples 4-6 Soft magnetic resin compositions of Examples 4 to 6 were obtained with the materials and blending ratios shown in Tables 1 and 2.
- the soft magnetic films of Examples 4 to 6 (average thickness 150 ⁇ m) were used in the same manner as in Example 1 except that the soft magnetic resin composition of each Example was used and the hot press conditions were 175 ° C., 30 minutes, and 20 MPa. Manufactured.
- Comparative Examples 1 and 2 The soft magnetic resin compositions of Comparative Examples 1 and 2 were obtained with the materials and blending ratios shown in Table 1. Soft magnetic films (average thickness 150 ⁇ m) of Comparative Examples 1 and 2 were produced in the same manner as Example 1 except that each soft magnetic resin composition was used.
- Comparative Examples 3-6 The soft magnetic resin compositions of Comparative Examples 3 to 6 were obtained using the materials and blending ratios shown in Tables 1 and 2.
- the soft magnetic films of Comparative Examples 3 to 6 (average thickness 150 ⁇ m) were used in the same manner as in Example 1 except that the soft magnetic resin composition of each Comparative Example was used and the hot pressing conditions were 175 ° C., 30 minutes, and 20 MPa. Manufactured.
- the actual specific gravity (SG) of the soft magnetic films of each Example and each Comparative Example was measured using an electronic hydrometer (manufactured by Alpha Mirage, “MDS-300”).
- the soft magnetic resin composition of each example and the soft magnetic film obtained therefrom are excellent in magnetic properties and sufficiently suppress the generation of voids.
- the film formability is also excellent.
- the complex permeability real part ⁇ ′ of the magnetic characteristics has a higher numerical value and better magnetic flux convergence than both comparative examples for both low frequency (1 MHz) and high frequency (10 MHz).
- the complex magnetic permeability imaginary part ⁇ ′′ both the low frequency (1 MHz) and the high frequency (10 MHz) are almost the same numerical values as compared with the comparative examples, and it is understood that the magnetic flux loss is not reduced. That is, since the magnetic flux convergence is improved while preventing magnetic flux loss, the characteristics as a magnetic film used for an antenna provided in an electronic device are excellent.
- each component in the table indicates the solid content. Moreover, unless otherwise indicated, the numerical value in each component in a table
- surface shows a mass part. Details of each component in the examples and tables are described below.
- -Soft magnetic particles for low frequencies Fe-Si-Al alloy, flat, average particle size 43 ⁇ m, average thickness 1 ⁇ m, specific gravity 6.8, less than coercive force 3 (Oe) in the direction of easy magnetization •
- Soft magnetic particles for high frequencies Fe-Si-Al alloy, flat, coercive force of 3 (Oe) or more in the direction of easy magnetization
- Cresol novolac type epoxy resin epoxy resin of the above general formula (1), epoxy equivalent of 199 g / eq.
- the soft magnetic resin composition and soft magnetic film of the present invention can be applied to various industrial products.
- the soft magnetic resin composition and the soft magnetic film are used for smartphones, personal computers, position detection devices, for example, coil modules for wireless communication or wireless power transmission. be able to.
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Abstract
Description
平均厚みは、例えば、0.1μm以上、好ましくは、0.2μm以上であり、また、例えば、3.0μm以下、好ましくは、2.5μm以下である。軟磁性粒子の扁平率、平均粒子径、平均厚みなどを調整することにより、軟磁性粒子による反磁界の影響を小さくでき、その結果、軟磁性粒子の透磁率(複素透磁率実部μ´)を増加させることができる。なお、軟磁性粒子の大きさを均一にするために、必要に応じて、ふるいなどを使用して分級された軟磁性粒子を用いてもよい。
具体的には、電子比重計(アルファミラージュ製、「MDS-300」)を用いて測定することができる。
軟磁性樹脂組成物に対し軟磁性粒子の体積割合が55.0体積%となるように、固形分換算で、Fe-Si-Al合金88.5質量部、クレゾールノボラック型エポキシ樹脂3.0質量部、フェノールビフェニレン樹脂3.0質量部、アクリル樹脂5.1質量部、熱硬化触媒0.1質量部、分散剤0.1質量部、および、レオロジーコントロール剤0.2質量部を混合することにより、実施例1の軟磁性樹脂組成物を得た。
表1に記載の材料および配合割合にて、実施例2~3の軟磁性樹脂組成物を得た。各実施例の軟磁性樹脂組成物を用いた以外は、実施例1と同様にして、実施例2~3の軟磁性フィルム(平均厚み150μm)を製造した。
表1および表2に記載の材料および配合割合にて、実施例4~6の軟磁性樹脂組成物を得た。各実施例の軟磁性樹脂組成物を用い、熱プレス条件を175℃、30分、20MPaとした以外は、実施例1と同様にして、実施例4~6の軟磁性フィルム(平均厚み150μm)を製造した。
表1に記載の材料および配合割合にて、比較例1~2の軟磁性樹脂組成物を得た。各軟磁性樹脂組成物を用いた以外は、実施例1と同様にして、比較例1~2の軟磁性フィルム(平均厚み150μm)を製造した。
表1および表2に記載の材料および配合割合にて、比較例3~6の軟磁性樹脂組成物を得た。各比較例の軟磁性樹脂組成物を用い、熱プレス条件を175℃、30分、20MPaとした以外は、実施例1と同様にして、比較例3~6の軟磁性フィルム(平均厚み150μm)を製造した。
各実施例および各比較例の軟磁性フィルムの実比重(S.G.)を、電子比重計(アルファミラージュ製、「MDS-300」)を用いて測定した。
各実施例および各比較例の軟磁性フィルムの側断面を、SEM(倍率:5000倍)にて、空隙が発生しているか否かを観察した。
各実施例および各比較例の軟磁性フィルムの比透磁率(複素透磁率実部μ´および複素透磁率虚部μ´´)を、インピーダンスアナライザー(Agilent社製、「4291B」)を用いて、1ターン法(周波数1MHz、10MHz)によって測定した。結果を表1および表2に示す。
各実施例および各比較例において、軟磁性樹脂組成物溶液をセパレータ上に塗布し、130℃で2分間乾燥させた後の軟磁性熱硬化性フィルムの表面の外観を観察した。
各実施例の軟磁性樹脂組成物およびそれから得られる軟磁性フィルムは、表1および表2から明らかなように、磁気特性に優れ、空隙の発生を十分に抑制できている。また、成膜性にも優れている。特に、磁気特性のうち複素透磁率実部μ´については、低周波(1MHz)および高周波(10MHz)ともに、各比較例と比べて、数値が高く、より良好な磁束収束を示すことが分かる。複素透磁率虚部μ´´については、低周波(1MHz)および高周波(10MHz)ともに、各比較例と比べて、ほぼ同等の数値であり、磁束損失が低下していないことが分かる。すなわち、磁束損失を防止しつつ、磁束収束を良好にしているため、電子機器が備えるアンテナなどに用いる磁性フィルムとしての特性が優れている。
・低周波向け軟磁性粒子:Fe-Si-Al系合金、扁平状、平均粒子径43μm、平均厚み1μm、比重6.8、磁化容易方向の保磁力3(Oe)未満
・高周波向け軟磁性粒子:Fe-Si-Al系合金、扁平状、磁化容易方向の保磁力3(Oe)以上
・クレゾールノボラック型エポキシ樹脂:上記一般式(1)のエポキシ樹脂、エポキシ当量199g/eq.、ICI粘度(150℃)0.4Pa・s、比重1.21、商品名「KI-3000-4」、東都化成社製
・トリスヒドロキシフェニルメタン型エポキシ樹脂:上記一般式(2)のエポキシ樹脂、エポキシ当量169g/eq.、ICI粘度(150℃)0.1Pa・s、比重1.25、商品名「EPPN-501HY」、日本化薬社製
・ビスフェノールA型エポキシ樹脂:エポキシ当量180g/eq.、ICI粘度(150℃)0.05Pa・s、比重1.15、商品名「エピコートYL980」、三菱化学社製
・フェノールビフェニレン樹脂:上記一般式(4)のフェノール樹脂、水酸基当量203g/eq.、ICI粘度(150℃)0.05Pa・s、比重1.18、商品名「MEH-7851SS」、明和化成社製
・フェノールノボラック樹脂:上記一般式(3)のフェノール樹脂、水酸基当量104g/eq.、ICI粘度(150℃)0.03Pa・s、比重1.2、商品名「レヂトップLVR8210DL」、群栄化学工業社製
・アクリル樹脂:カルボキシ基およびヒドロキシ基変性のアクリル酸エチル-アクリル酸ブチル-アクリロニトリル共重合体、重量平均分子量900,000、比重1.00、商品名「テイサンレジン SG-70L」(樹脂含有割合12.5質量%)、ナガセケムテックス社製
・熱硬化触媒:2-フェニル-1H-イミダゾール4,5-ジメタノール、比重1.33、商品名「キュアゾール2PHZ-PW」、四国化成社製
・分散剤:ポリエーテルリン酸エステル、酸価17、比重1.03、商品名「HIPLAAD ED152」、楠本化成社製
・レオロジーコントロール剤:ウレア変性中極性ポリアマイド、比重0.86、商品名「BYK430」(固形分30質量%)、ビックケミージャパン社製
なお、上記発明は、本発明の例示の実施形態として提供したが、これは単なる例示に過ぎず、限定的に解釈してはならない。当該技術分野の当業者によって明らかな本発明の変形例は、後記請求の範囲に含まれる。
7 軟磁性粒子
Claims (7)
- 扁平状の軟磁性粒子と、エポキシ樹脂、フェノール樹脂およびアクリル樹脂を含有する樹脂成分とを含有し、
前記エポキシ樹脂が、3つ以上の官能基を有するエポキシ樹脂のみからなり、
前記フェノール樹脂が、3つ以上の官能基を有するフェノール樹脂のみからなり、
前記樹脂成分における前記アクリル樹脂の含有割合が、25質量%以上であることを特徴とする、軟磁性樹脂組成物。 - 前記軟磁性粒子を除く軟磁性粒子除外成分100質量部に対して、前記エポキシ樹脂および前記フェノール樹脂の合計含有量が20質量部以上99質量部以下であることを特徴とする、請求項1に記載の軟磁性樹脂組成物。
- 前記エポキシ樹脂のエポキシ当量が、230g/eq.以下であり、
前記フェノール樹脂の水酸基当量が、230g/eq.以下であることを特徴とする、請求項1に記載の軟磁性樹脂組成物。 - 前記3つ以上の官能基を有するエポキシ樹脂が、トリスヒドロキシフェニルメタン型エポキシ樹脂であり、
前記3つ以上の官能基を有するフェノール樹脂が、フェノールノボラック樹脂であることを特徴とする、請求項1に記載の軟磁性樹脂組成物。 - 前記3つ以上の官能基を有するエポキシ樹脂が、クレゾールノボラック型エポキシ樹脂であり、
前記3つ以上の官能基を有するフェノール樹脂が、フェノールビフェニレン樹脂であることを特徴とする、請求項1に記載の軟磁性樹脂組成物。 - 前記軟磁性粒子の含有割合が、40体積%以上であることを特徴とする、請求項1に記載の軟磁性樹脂組成物。
- 請求項1に記載の軟磁性樹脂組成物を加熱硬化することにより得られることを特徴とする、軟磁性フィルム。
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JP2012212790A (ja) * | 2011-03-31 | 2012-11-01 | Tdk Corp | 磁性シート |
JP2012241151A (ja) * | 2011-05-23 | 2012-12-10 | Nitto Denko Corp | 電子部品封止用樹脂組成物およびそれを用いた電子部品装置 |
JP2013181166A (ja) * | 2012-03-05 | 2013-09-12 | Showa Denko Kk | フェノール樹脂および熱硬化性樹脂組成物 |
WO2014132879A1 (ja) * | 2013-02-26 | 2014-09-04 | 日東電工株式会社 | 軟磁性熱硬化性フィルム、および、軟磁性フィルム |
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JP2009059752A (ja) * | 2007-08-30 | 2009-03-19 | Hitachi Chem Co Ltd | 難燃化ノイズ抑制シート |
JP2012212790A (ja) * | 2011-03-31 | 2012-11-01 | Tdk Corp | 磁性シート |
JP2012241151A (ja) * | 2011-05-23 | 2012-12-10 | Nitto Denko Corp | 電子部品封止用樹脂組成物およびそれを用いた電子部品装置 |
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