JP2016006852A - 軟磁性樹脂組成物および軟磁性フィルム - Google Patents
軟磁性樹脂組成物および軟磁性フィルム Download PDFInfo
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- JP2016006852A JP2016006852A JP2015088690A JP2015088690A JP2016006852A JP 2016006852 A JP2016006852 A JP 2016006852A JP 2015088690 A JP2015088690 A JP 2015088690A JP 2015088690 A JP2015088690 A JP 2015088690A JP 2016006852 A JP2016006852 A JP 2016006852A
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Abstract
【解決手段】軟磁性樹脂組成物は、軟磁性粒子、エポキシ樹脂、フェノール樹脂およびアクリル樹脂を含有する。軟磁性粒子の含有割合は、軟磁性樹脂組成物に対して、60体積%以上である。硬化後の軟磁性樹脂組成物は、22.0ppm/℃以下の線膨張係数を有する。
【選択図】なし
Description
軟磁性樹脂組成物に対し軟磁性粒子の体積割合が固形分換算で70.0体積%となるように、Fe−Si−Al合金500質量部、エポキシ樹脂として、上記一般式(1)で表わされるエポキシ樹脂(日本化薬社製、EPPN−501HY)21.9質量部、フェノール樹脂としてフェノールノボラック樹脂(群栄化学工業社製、レヂトップ LVR8210DL)13.5質量部、アクリル樹脂としてアクリル酸エステル共重合物(ナガセケムテックス社製、テイサンレジン SG−P3)8.6質量部、分散剤としてポリエーテルリン酸エステル(楠本化成社製、ED152、)0.5質量部(軟磁性粒子100質量部に対して、0.1質量部)、熱硬化性触媒として2−フェニル−1H−イミダゾール4,5−ジメタノール(四国化成社製、キュアゾール2PHZ−PW)0.28質量部(樹脂成分100質量部に対して1.0質量部)、および、レオロジーコントロール剤としてBYK−430(ビックケミージャパン社製)3質量部を混合することにより、軟磁性樹脂組成物を得た。
表1に記載の成分および配合割合で、各成分を混合して軟磁性樹脂組成物を得た以外は、実施例1と同様に処理し、その後、軟磁性樹脂組成物溶液を調製した。
各実施例および各比較例の軟磁性樹脂組成物溶液を、離型処理済みのセパレータの上に塗布し、その後、110℃の熱雰囲気下で2分間乾燥させた。これにより、半硬化状態の軟磁性フィルム(平均厚み50μm)を製造した。
サンプルサイズ:4mm×16mm
モード:引張モード
昇温速度:5℃/分
測定温度範囲:−50℃から300℃
各実施例および各比較例の軟磁性樹脂組成物溶液を、離型処理済みのセパレータの上に塗布し、その後、110℃の熱雰囲気下で2分間乾燥させた。これにより、半硬化状態の軟磁性フィルム(平均厚み50μm)を製造した。
各実施例および比較例で製造した軟磁性フィルムの比透磁率は、インピーダンスアナライザ(Agilent社製、商品番号「4294A」)を用いて、インピーダンスを測定することにより求めた。
・Fe−Si−Al合金:商品名「FME3DH」、軟磁性粒子、扁平状、平均粒子径43μm、平均厚み1μm、比重6.8、山陽特殊製鋼社製
・SG−P3:アクリルゴム溶液、商品名「テイサンレジン SG−P3」、エポキシ基含有のアクリル酸エチル−アクリル酸ブチル−アクリロニトリル共重合体、比重0.85、重量平均分子量8.5×104、エポキシ価210eq./g、ガラス転移温度12℃、ゴム含有割合15質量%、溶媒:メチルエチルケトン、ナガセケムテックス社製
・LVR8210DL:フェノールノボラック樹脂:商品名「レヂトップ LVR8210DL」、水酸基当量104g/eq.、比重1.2、群栄化学工業社製
・EPPN−501HY:上記一般式(1)で表わされるエポキシ樹脂、商品名「EPPN−501HY」、エポキシ当量169g/eq.、ICI粘度(150℃)0.1Pa・s、比重1.25、日本化薬社製
・ED152:ポリエーテルリン酸エステル:商品名「HIPLAAD ED152」、ポリエーテルリン酸エステル、酸価17、比重1.03、楠本化成社製
・BYK−430:商品名、レオロジーコントロール剤、ウレア変性中極性ポリアマイド、比重0.86、固形分30質量%、イソブチルアルコールおよびソルベントナフサの混合液、ビックケミージャパン社製
・2PHZ−PW:熱硬化触媒、2−フェニル−1H−イミダゾール4,5−ジメタノール、比重1.33、商品名「キュアゾール2PHZ−PW」、四国化成社製
7 軟磁性粒子
Claims (3)
- 軟磁性粒子、エポキシ樹脂、フェノール樹脂およびアクリル樹脂を含有する軟磁性樹脂組成物であって、
前記軟磁性粒子の含有割合は、前記軟磁性樹脂組成物に対して、60体積%以上であり、
硬化後の前記軟磁性樹脂組成物は、22.0ppm/℃以下の線膨張係数を有することを特徴とする、軟磁性樹脂組成物。 - 請求項1に記載の軟磁性樹脂組成物から形成されることを特徴とする、軟磁性フィルム。
- 厚さが500μm以下であることを特徴とする、請求項2に記載の軟磁性フィルム。
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WO2018105347A1 (ja) | 2016-12-07 | 2018-06-14 | 日東電工株式会社 | モジュールの製造方法 |
TWI646725B (zh) * | 2016-05-31 | 2019-01-01 | Skc股份有限公司 | 磁性片及包含該磁性片之天線裝置 |
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JP2015082554A (ja) * | 2013-10-22 | 2015-04-27 | 日東電工株式会社 | 軟磁性樹脂組成物、および、軟磁性フィルム |
JP6526471B2 (ja) * | 2014-05-29 | 2019-06-05 | 日東電工株式会社 | 軟磁性フィルム |
WO2020022393A1 (ja) * | 2018-07-25 | 2020-01-30 | 味の素株式会社 | 磁性ペースト |
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- 2015-05-12 CN CN201580028614.3A patent/CN106415743A/zh active Pending
- 2015-05-12 KR KR1020167032643A patent/KR102342068B1/ko active IP Right Grant
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TWI646725B (zh) * | 2016-05-31 | 2019-01-01 | Skc股份有限公司 | 磁性片及包含該磁性片之天線裝置 |
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JPWO2019106809A1 (ja) * | 2017-11-30 | 2020-12-10 | 昭和電工マテリアルズ株式会社 | シート状積層体及び積層物 |
JP7001103B2 (ja) | 2017-11-30 | 2022-01-19 | 昭和電工マテリアルズ株式会社 | シート状積層体及び積層物 |
JP2021002553A (ja) * | 2019-06-20 | 2021-01-07 | 日立金属株式会社 | 磁性材、積層磁性体および積層コア、並びに、磁性材の製造方法および積層磁性体の製造方法 |
WO2021251357A1 (ja) * | 2020-06-09 | 2021-12-16 | 富士フイルム株式会社 | 組成物、磁性粒子含有膜、及び、電子部品 |
Also Published As
Publication number | Publication date |
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KR20170015896A (ko) | 2017-02-10 |
WO2015182375A1 (ja) | 2015-12-03 |
TW201611047A (zh) | 2016-03-16 |
CN106415743A (zh) | 2017-02-15 |
EP3151253A4 (en) | 2018-02-07 |
TWI660377B (zh) | 2019-05-21 |
JP6812091B2 (ja) | 2021-01-13 |
EP3151253B1 (en) | 2021-11-10 |
KR102342068B1 (ko) | 2021-12-21 |
US20170110231A1 (en) | 2017-04-20 |
EP3151253A1 (en) | 2017-04-05 |
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